the supporting or holding device being angularly adjustable

Industry

CPC
B28D5/0088

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/0088the supporting or holding device being angularly adjustable

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Diamond wire cutting method for crystal boules
- Patent number 10,994,443
- Issue date May 4, 2021
- Comadur S.A.
- Naser Berisha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for dividing workpiece
- Patent number 10,818,523
- Issue date Oct 27, 2020
- Disco Corporation
- Chris Mihai
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Workpiece holder and method for slicing workpiece
- Patent number 10,596,724
- Issue date Mar 24, 2020
- Shin-Etsu Handotai Co., Ltd.
- Shiroyasu Watanabe
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Gemstone processing
- Patent number 9,962,859
- Issue date May 8, 2018
- Sahajanand Technologies Private Limited
- Rahul Mahendrakumar Gaywala
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for slicing semiconductor single crystal ingot
- Patent number 9,876,078
- Issue date Jan 23, 2018
- Sumco Techxiv Corporation
- Hiroshi Noguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sapphire wafer squaring machine with double swing cutter heads
- Patent number 9,452,549
- Issue date Sep 27, 2016
- ECO POWER (WUXI) CO., LTD
- Xinzhong Zhang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Intelligent machines and process for production of monocrystalline...
- Patent number 9,134,260
- Issue date Sep 15, 2015
- Rubicon Technology, Inc.
- Srikanth Kamireddi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent machines and process for production of monocrystalline...
- Patent number 8,934,606
- Issue date Jan 13, 2015
- Rubicon Technology, Inc.
- Srikanth Kamireddi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent machines and process for production of monocrystalline...
- Patent number 8,259,901
- Issue date Sep 4, 2012
- Rubicon Technology, Inc.
- Srikanth Kamireddi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece
- Patent number 8,146,581
- Issue date Apr 3, 2012
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer sawing system and method
- Patent number 7,943,425
- Issue date May 17, 2011
- Texas Instruments Incorporated
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for sawing semiconductor wafer
- Patent number 7,521,338
- Issue date Apr 21, 2009
- Texas Instruments Incorporated
- Patricio Vergara Ancheta, Jr.
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for the measurement, orientation and fixation...
- Patent number 7,285,168
- Issue date Oct 23, 2007
- EFG Elektrotechnische Fabrikations-und Grosshandelsgesellschaft mnB
- Hans Bradaczek
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and device for cutting single crystals, in addition to an ad...
- Patent number 7,137,865
- Issue date Nov 21, 2006
- Freiberger Compound Materials GmbH
- Ralf Hammer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Brittle material rotating and aligning mechanism for use in a britt...
- Patent number 7,063,246
- Issue date Jun 20, 2006
- Industrial Technology Research Institute
- Kuei-Jung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire sawing process and device
- Patent number 6,981,495
- Issue date Jan 3, 2006
- HCT Shaping Systems SA
- Andreas Muller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for determining the orientation of a crystallogra...
- Patent number 6,923,171
- Issue date Aug 2, 2005
- Freiberger Compound Materials GmbH
- Ralf Hammer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Brittle material rotating and aligning mechanism for use in a britt...
- Patent number 6,892,917
- Issue date May 17, 2005
- Industrial Technology Research Institute
- Kuei-Jung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for cutting mother rod lens
- Patent number 6,796,145
- Issue date Sep 28, 2004
- Nippon Sheet Glass Co., Ltd.
- Hiroshi Koshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vertical wafer sawing apparatus
- Patent number 6,662,799
- Issue date Dec 16, 2003
- Samsung Electronics Co., Ltd.
- Dong-Kuk Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment method and apparatus for aligning cutting blade
- Patent number 6,494,122
- Issue date Dec 17, 2002
- Disco Corporation
- Masakado Kamigaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Work crystal orientation adjusting method and apparatus
- Patent number 6,179,909
- Issue date Jan 30, 2001
- Nippei Toyama Corporation
- Yoshiaki Banzawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process and device for producing a cylindrical single crystal and p...
- Patent number 6,159,284
- Issue date Dec 12, 2000
- Wacker Siltronic Gesellschaft fur Halbleitermaterialien AG
- Hans Olkrug
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of positioning work piece and system therefor
- Patent number 6,145,422
- Issue date Nov 14, 2000
- Tokyo Seimitsu Co., Ltd.
- Shozo Katamachi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Apparatus and method for slicing a workpiece utilizing a diamond im...
- Patent number 6,024,080
- Issue date Feb 15, 2000
- Laser Technology West Limited
- John B. Hodsden
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting device with wires
- Patent number 5,913,305
- Issue date Jun 22, 1999
- HCT Shaping Systems SA
- Charles Hauser
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw and slicing method thereof
- Patent number 5,904,136
- Issue date May 18, 1999
- Tokyo Seimitsu Co., Ltd.
- Shinji Nagatsuka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of positioning work piece and system therefor
- Patent number 5,893,308
- Issue date Apr 13, 1999
- Tokyo Seimitsu Co., Ltd.
- Shozo Katamachi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw and method of slicing ingot by wire saw
- Patent number 5,857,454
- Issue date Jan 12, 1999
- Tokyo Seimitsu Co., Ltd.
- Shinji Shibaoka
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Process for the orientation of several single crystals disposed sid...
- Patent number 5,839,424
- Issue date Nov 24, 1998
- HCT Shaping System SA
- Charles Hauser
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...
- Publication number 20220063135
- Publication date Mar 3, 2022
- DIA&CO Inc.
- YOUNG DAE KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WORKPIECE HOLDER AND METHOD FOR SLICING WORKPIECE
- Publication number 20180215075
- Publication date Aug 2, 2018
- Shin-Etsu Handotai Co., Ltd.
- Shiroyasu WATANABE
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GEMSTONE PROCESSING
- Publication number 20150375421
- Publication date Dec 31, 2015
- Sahajanand Technologies Private Limited
- Rahul Mahendrakumar Gaywala
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAPPHIRE WAFER SQUARING MACHINE WITH DOUBLE SWING CUTTER HEADS
- Publication number 20150165646
- Publication date Jun 18, 2015
- ECO POWER (WUXI) CO., LTD
- Xinzhong Zhang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING SEMICONDUCTOR SINGLE CRYSTAL INGOT
- Publication number 20140295126
- Publication date Oct 2, 2014
- SUMCO TECHXIV CORPORATION
- Hiroshi NOGUCHI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
GEMSTONE PROCESSING
- Publication number 20140246006
- Publication date Sep 4, 2014
- Rahul Mahendrakumar Gaywala
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Intelligent Machines and Process for Production of Monocrystalline...
- Publication number 20130028385
- Publication date Jan 31, 2013
- RUBICON TECHNOLOGY, INC.
- Srikanth KAMIREDDI
- C30 - CRYSTAL GROWTH
Information Patent Application
SCRIBING APPARATUS FOR THIN FILM SOLAR CELLS
- Publication number 20110179934
- Publication date Jul 28, 2011
- Masanobu SOYAMA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE
- Publication number 20110059679
- Publication date Mar 10, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
WIRE SLICING SYSTEM
- Publication number 20100006082
- Publication date Jan 14, 2010
- Saint-Gobain Abrasives, Inc.
- Lukasz A. Glinski
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Wafer Sawing System and Method
- Publication number 20090263954
- Publication date Oct 22, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Apparatus and Method for Separating and Transporting Substrates
- Publication number 20080213079
- Publication date Sep 4, 2008
- Richard Herter
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Wafer Sawing System and Method
- Publication number 20080153260
- Publication date Jun 26, 2008
- Patricio Vergara Ancheta
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
PRODUCT DESIGNED TO BE USED WITH HANDLING SYSTEM
- Publication number 20070297885
- Publication date Dec 27, 2007
- Jean Michel Processe
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and apparatus for the measurement, orientation and fixation...
- Publication number 20060032430
- Publication date Feb 16, 2006
- EFG Elektrotechnische Fabrikations-und Grosshandelsgesellschaft mbh
- Hans Bradaczek
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Laser diamond blocking machine for faceting the bottom of a diamond
- Publication number 20050145238
- Publication date Jul 7, 2005
- Arvindbhai Lavjibhai Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Brittle material rotating and aligning mechanism for use in a britt...
- Publication number 20050139047
- Publication date Jun 30, 2005
- Kuei-Jung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Wire sawing process and device
- Publication number 20040194773
- Publication date Oct 7, 2004
- HTC SHAPING SYSTEMS SA
- Andreas Muller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device and method for determining the orientation of a crystallogra...
- Publication number 20040168682
- Publication date Sep 2, 2004
- Ralph Hammer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method and device for cutting single crystals, in addition to an ad...
- Publication number 20040118338
- Publication date Jun 24, 2004
- Ralf Hammer
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Brittle material rotating and aligning mechanism for use in a britt...
- Publication number 20040094593
- Publication date May 20, 2004
- Kuei-Jung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Angle control system including a display device configured with two...
- Publication number 20040092048
- Publication date May 13, 2004
- Chiu-Tien Hsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method of aligning a workpiece in a cutting machine
- Publication number 20030089206
- Publication date May 15, 2003
- Tsuyoshi Ueno
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for cutting mother rod lens and lens block for supporting mo...
- Publication number 20020078806
- Publication date Jun 27, 2002
- Hiroshi Koshi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Vertical wafer sawing apparatus
- Publication number 20020063115
- Publication date May 30, 2002
- Samsung Electronics Co. Ltd.
- Dong-Kuk Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Alignment method and apparatus for aligning cutting blade
- Publication number 20020025616
- Publication date Feb 28, 2002
- Masakado Kamigaki
- B28 - WORKING CEMENT, CLAY, OR STONE

the supporting or holding device being angularly adjustable

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diamond wire cutting method for crystal boules

Apparatus for dividing workpiece

Workpiece holder and method for slicing workpiece

Gemstone processing

Method for slicing semiconductor single crystal ingot

Sapphire wafer squaring machine with double swing cutter heads

Intelligent machines and process for production of monocrystalline...

Intelligent machines and process for production of monocrystalline...

Intelligent machines and process for production of monocrystalline...

Method for slicing workpiece

Semiconductor wafer sawing system and method

Method for sawing semiconductor wafer

Method and apparatus for the measurement, orientation and fixation...

Method and device for cutting single crystals, in addition to an ad...

Brittle material rotating and aligning mechanism for use in a britt...

Wire sawing process and device

Device and method for determining the orientation of a crystallogra...

Brittle material rotating and aligning mechanism for use in a britt...

Method for cutting mother rod lens

Vertical wafer sawing apparatus

Alignment method and apparatus for aligning cutting blade

Work crystal orientation adjusting method and apparatus

Process and device for producing a cylindrical single crystal and p...

Method of positioning work piece and system therefor

Apparatus and method for slicing a workpiece utilizing a diamond im...

Cutting device with wires

Wire saw and slicing method thereof

Method of positioning work piece and system therefor

Wire saw and method of slicing ingot by wire saw

Process for the orientation of several single crystals disposed sid...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR MANUFACTURING HIGH-HARDNESS DIAMOND SIMULA...

WORKPIECE HOLDER AND METHOD FOR SLICING WORKPIECE

GEMSTONE PROCESSING

SAPPHIRE WAFER SQUARING MACHINE WITH DOUBLE SWING CUTTER HEADS

METHOD FOR SLICING SEMICONDUCTOR SINGLE CRYSTAL INGOT

GEMSTONE PROCESSING

Intelligent Machines and Process for Production of Monocrystalline...

SCRIBING APPARATUS FOR THIN FILM SOLAR CELLS

METHOD FOR SLICING WORKPIECE

WIRE SLICING SYSTEM

Semiconductor Wafer Sawing System and Method

Apparatus and Method for Separating and Transporting Substrates

Semiconductor Wafer Sawing System and Method

PRODUCT DESIGNED TO BE USED WITH HANDLING SYSTEM

Method and apparatus for the measurement, orientation and fixation...

Laser diamond blocking machine for faceting the bottom of a diamond

Brittle material rotating and aligning mechanism for use in a britt...

Wire sawing process and device

Device and method for determining the orientation of a crystallogra...

Method and device for cutting single crystals, in addition to an ad...

Brittle material rotating and aligning mechanism for use in a britt...

Angle control system including a display device configured with two...

Method of aligning a workpiece in a cutting machine

Method for cutting mother rod lens and lens block for supporting mo...

Vertical wafer sawing apparatus

Alignment method and apparatus for aligning cutting blade