the switching components being connected to a common vertical conductor

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H01L27/249

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/249the switching components being connected to a common vertical conductor

Industries

Patents Grantslast 30 patents

Information Patent Grant
Cross-point memory array and related fabrication techniques
- Patent number 11,706,934
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistance memory device
- Patent number 11,672,132
- Issue date Jun 6, 2023
- Samsung Electronics Co., Ltd.
- Tae Hong Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-volatile memory
- Patent number 11,665,907
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Kyung-Hwa Yun
- G11 - INFORMATION STORAGE
Information Patent Grant
Three dimensional semiconductor memory devices
- Patent number 11,665,914
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Si-Ho Song
- G11 - INFORMATION STORAGE
Information Patent Grant
Cross-point memory array and related fabrication techniques
- Patent number 11,653,505
- Issue date May 16, 2023
- Micron Technology, Inc.
- Hernan A. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive random access memory and manufacturing method thereoff
- Patent number 11,637,241
- Issue date Apr 25, 2023
- Winbond Electronics Corp.
- Meng-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked memory structure with insulating patterns
- Patent number 11,637,124
- Issue date Apr 25, 2023
- SK hynix Inc.
- Changhan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,616,004
- Issue date Mar 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory arrays, and methods of forming the same
- Patent number 11,616,098
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Lingming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to produce 3D semiconductor devices and structures with memory
- Patent number 11,600,667
- Issue date Mar 7, 2023
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic memristive array
- Patent number 11,599,781
- Issue date Mar 7, 2023
- Rain Neuromorphics Inc.
- Suhas Kumar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
3D semiconductor device and structure with metal layers and a conne...
- Patent number 11,594,473
- Issue date Feb 28, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory array
- Patent number 11,587,979
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Fabio Pellizzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive memory array
- Patent number 11,588,103
- Issue date Feb 21, 2023
- International Business Machines Corporation
- Youngseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device and method of manufacturing the same
- Patent number 11,587,977
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Dong-Jun Seong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device, integrated circuit device and method
- Patent number 11,581,368
- Issue date Feb 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Meng-Han Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional memory array
- Patent number 11,574,957
- Issue date Feb 7, 2023
- Micron Technology, Inc.
- Anna Maria Conti
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,574,920
- Issue date Feb 7, 2023
- SK hynix Inc.
- Byung Woo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including vertical memory structure
- Patent number 11,569,262
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Janggn Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including phase change material layers...
- Patent number 11,563,056
- Issue date Jan 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jau-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having first memory section and second memory...
- Patent number 11,557,631
- Issue date Jan 17, 2023
- Samsung Electronics Co., Ltd.
- Kilho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the semiconductor...
- Patent number 11,557,607
- Issue date Jan 17, 2023
- SK hynix Inc.
- Jin Ha Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,552,102
- Issue date Jan 10, 2023
- SK hynix Inc.
- Nam Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device and manufacturing method thereof
- Patent number 11,538,862
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chao-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,532,599
- Issue date Dec 20, 2022
- Monolitic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable resistance memory device
- Patent number 11,522,015
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Junghoon Bak
- G11 - INFORMATION STORAGE
Information Patent Grant
3D vertical memory array cell structures with individual selectors...
- Patent number 11,522,016
- Issue date Dec 6, 2022
- Fu-Chang Hsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming semiconductor device having capped air gaps betwe...
- Patent number 11,508,614
- Issue date Nov 22, 2022
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 11,495,504
- Issue date Nov 8, 2022
- SK hynix Inc.
- Young Rok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor device and structure with metal layers
- Patent number 11,476,181
- Issue date Oct 18, 2022
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PILLAR AND WORD LINE PLATE ARCHITECTURE FOR A MEMORY ARRAY
- Publication number 20240057348
- Publication date Feb 15, 2024
- Micron Technology, Inc.
- Lorenzo Fratin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL CROSS-POINT NON-VOLATILE MEMORY
- Publication number 20240049478
- Publication date Feb 8, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS-POINT ARCHITECTURE FOR PCRAM
- Publication number 20230380194
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Pin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASYMMETRIC MEMORY CELL DESIGN
- Publication number 20230354619
- Publication date Nov 2, 2023
- Micron Technology, Inc.
- Mattia Robustelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CELL FORMATION IN THREE DIMENSIONAL MEMORY ARRAYS USING ATOM...
- Publication number 20230354721
- Publication date Nov 2, 2023
- Micron Technology, Inc.
- Paolo Fantini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAY HAVING AIR GAPS
- Publication number 20230337441
- Publication date Oct 19, 2023
- Micron Technology, Inc.
- Paolo Fantini
- G11 - INFORMATION STORAGE
Information Patent Application
TRENCH AND PIER ARCHITECTURES FOR THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20230329010
- Publication date Oct 12, 2023
- Micron Technology, Inc.
- Fabio Pellizzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE PIERS FOR THREE-DIMENSIONAL MEMORY ARRAYS
- Publication number 20230309326
- Publication date Sep 28, 2023
- Micron Technology, Inc.
- Stephen W. Russell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20230301118
- Publication date Sep 21, 2023
- Kioxia Corporation
- Katsuyoshi KOMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20230301119
- Publication date Sep 21, 2023
- KIOXIA Corporation
- Kensuke TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL STACKED SEMICONDUCTOR MEMORY
- Publication number 20230284464
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Hidehiro SHIGA
- G11 - INFORMATION STORAGE
Information Patent Application
VARIABLE RESISTANCE NON-VOLATILE MEMORY
- Publication number 20230284460
- Publication date Sep 7, 2023
- KIOXIA Corporation
- Tomoki CHIBA
- G11 - INFORMATION STORAGE
Information Patent Application
VERTICAL MEMORY ARCHITECTURE
- Publication number 20230262995
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Agostino Pirovano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230240086
- Publication date Jul 27, 2023
- SK HYNIX INC.
- Si Jung YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...
- Publication number 20230232624
- Publication date Jul 20, 2023
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE RESISTANCE MEMORY DEVICE
- Publication number 20230232640
- Publication date Jul 20, 2023
- Samsung Electronics Co., Ltd.
- Jinwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...
- Publication number 20230117934
- Publication date Apr 20, 2023
- SK HYNIX INC.
- Jin Ha KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE RESISTANCE MEMORY DEVICE
- Publication number 20230121581
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Seyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230103339
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-I Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED VERTICAL 3D MEMORY DEVICE AND ACCESSING METHOD
- Publication number 20230097079
- Publication date Mar 30, 2023
- Micron Technology, Inc.
- Paolo Fantini
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE INCLUDING VERTICAL STACK STRUCTURE, METHOD OF FABRICA...
- Publication number 20230093892
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Yumin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230087787
- Publication date Mar 23, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECODING ARCHITECTURE FOR MEMORY TILES
- Publication number 20230071663
- Publication date Mar 9, 2023
- Micron Technology, Inc.
- Paolo Fantini
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD TO PRODUCE 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY
- Publication number 20230056346
- Publication date Feb 23, 2023
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230045495
- Publication date Feb 9, 2023
- Macronix International Co., Ltd.
- Feng-Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH A COLUMNAR MEMORY OPENING ARRA...
- Publication number 20230029690
- Publication date Feb 2, 2023
- SANDISK TECHNOLOGIES LLC
- Tatsuya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20230021651
- Publication date Jan 26, 2023
- SK HYNIX INC.
- Young Rok KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...
- Publication number 20230018490
- Publication date Jan 19, 2023
- SK HYNIX INC.
- In Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...
- Publication number 20230005821
- Publication date Jan 5, 2023
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHODS OF MANUFACTURING AND OPERAT...
- Publication number 20220415921
- Publication date Dec 29, 2022
- SK HYNIX INC.
- Dong Uk LEE
- G11 - INFORMATION STORAGE

the switching components being connected to a common vertical conductor

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Cross-point memory array and related fabrication techniques

Variable resistance memory device

Non-volatile memory

Three dimensional semiconductor memory devices

Cross-point memory array and related fabrication techniques

Resistive random access memory and manufacturing method thereoff

Stacked memory structure with insulating patterns

3D semiconductor device and structure with metal layers and a conne...

Three-dimensional memory arrays, and methods of forming the same

Method to produce 3D semiconductor devices and structures with memory

Lithographic memristive array

3D semiconductor device and structure with metal layers and a conne...

Three dimensional memory array

Resistive memory array

Memory device and method of manufacturing the same

Memory device, integrated circuit device and method

Three-dimensional memory array

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device including vertical memory structure

Semiconductor memory device including phase change material layers...

Semiconductor device having first memory section and second memory...

Semiconductor device and manufacturing method of the semiconductor...

Semiconductor device and manufacturing method thereof

Three-dimensional memory device and manufacturing method thereof

3D semiconductor device and structure with metal layers

Variable resistance memory device

3D vertical memory array cell structures with individual selectors...

Method of forming semiconductor device having capped air gaps betwe...

Semiconductor device and manufacturing method of semiconductor device

3D semiconductor device and structure with metal layers

Patents Applicationslast 30 patents

PILLAR AND WORD LINE PLATE ARCHITECTURE FOR A MEMORY ARRAY

THREE DIMENSIONAL CROSS-POINT NON-VOLATILE MEMORY

CROSS-POINT ARCHITECTURE FOR PCRAM

ASYMMETRIC MEMORY CELL DESIGN

MEMORY CELL FORMATION IN THREE DIMENSIONAL MEMORY ARRAYS USING ATOM...

MEMORY ARRAY HAVING AIR GAPS

TRENCH AND PIER ARCHITECTURES FOR THREE-DIMENSIONAL MEMORY ARRAYS

DENSE PIERS FOR THREE-DIMENSIONAL MEMORY ARRAYS

SEMICONDUCTOR MEMORY DEVICE

MEMORY DEVICE

THREE DIMENSIONAL STACKED SEMICONDUCTOR MEMORY

VARIABLE RESISTANCE NON-VOLATILE MEMORY

VERTICAL MEMORY ARCHITECTURE

SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING SELF-ALIGNED ISOLATION S...

VARIABLE RESISTANCE MEMORY DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SEMICONDUCTOR...

VARIABLE RESISTANCE MEMORY DEVICE

THREE-DIMENSIONAL MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

IMPROVED VERTICAL 3D MEMORY DEVICE AND ACCESSING METHOD

MEMORY DEVICE INCLUDING VERTICAL STACK STRUCTURE, METHOD OF FABRICA...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

DECODING ARCHITECTURE FOR MEMORY TILES

METHOD TO PRODUCE 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH MEMORY

MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

THREE-DIMENSIONAL MEMORY DEVICE WITH A COLUMNAR MEMORY OPENING ARRA...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF A SEMICONDUCTOR DE...

3D SEMICONDUCTOR DEVICE AND STRUCTURE WITH METAL LAYERS AND A CONNE...

SEMICONDUCTOR MEMORY DEVICE AND METHODS OF MANUFACTURING AND OPERAT...