TREA

the terminals embracing or surrounding the capacitive element

Follow

Industry

  • CPC
  • H01G4/248
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01GCAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE H01G4/00Fixed capacitors Processes of their manufacture

Current Industry

H01G4/248the terminals embracing or surrounding the capacitive element
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTILAYER CAPACITOR HAVING INTERNAL ELECTRODE WITH DOUBLE BOTTLENE...
    • Publication number 20240145167
    • Publication date May 2, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Ho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CERAMIC ELECTRONIC COMPONENT
    • Publication number 20240128022
    • Publication date Apr 18, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jin Woo Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240120152
    • Publication date Apr 11, 2024
    • TDK Corporation
    • Toshihiro IGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20240112865
    • Publication date Apr 4, 2024
    • TDK Corporation
    • Toshihiro IGUCHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYERED CAPACITOR
    • Publication number 20240112859
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyukjin Hong
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20240105386
    • Publication date Mar 28, 2024
    • Murata Manufacturing Co., Ltd.
    • Mitsuru IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20240096556
    • Publication date Mar 21, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuuta HOSHINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR
    • Publication number 20240087808
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Masato KIMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR
    • Publication number 20240087814
    • Publication date Mar 14, 2024
    • Murata Manufacturing Co., Ltd.
    • Yuta KUROSU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20240079182
    • Publication date Mar 7, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Yoona Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC DEVICE
    • Publication number 20240071688
    • Publication date Feb 29, 2024
    • Taiyo Yuden Co., Ltd.
    • Tomoaki NAKAMURA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Multilayer Ceramic Capacitor
    • Publication number 20240062959
    • Publication date Feb 22, 2024
    • KYOCERA AVX Components Corporation
    • Marianne Berolini
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT
    • Publication number 20240038447
    • Publication date Feb 1, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Du Won Choi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COM...
    • Publication number 20230411075
    • Publication date Dec 21, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Hyoung Uk Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR
    • Publication number 20230411081
    • Publication date Dec 21, 2023
    • Murata Manufacturing Co., Ltd.
    • Mitsuru IKEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT
    • Publication number 20230402230
    • Publication date Dec 14, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Ho Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR MOUNT...
    • Publication number 20230395322
    • Publication date Dec 7, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Soohwan Son
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COM...
    • Publication number 20230386743
    • Publication date Nov 30, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Kyung Sik Kim
    • C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
  • Information Patent Application

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20230377800
    • Publication date Nov 23, 2023
    • Murata Manufacturing Co., Ltd.
    • Yuuta HOSHINO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAPACITOR COMPONENT
    • Publication number 20230343515
    • Publication date Oct 26, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang Jong LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    • Publication number 20230335336
    • Publication date Oct 19, 2023
    • Murata Manufacturing Co., Ltd.
    • Makoto NISHIKORI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT, CIRCUIT BOARD, AND METHOD...
    • Publication number 20230335340
    • Publication date Oct 19, 2023
    • Taiyo Yuden Co., Ltd.
    • Yuji TOMIZAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND CIRCUIT BOARD
    • Publication number 20230326676
    • Publication date Oct 12, 2023
    • Taiyo Yuden Co., Ltd.
    • Tomoki SAKAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    • Publication number 20230326678
    • Publication date Oct 12, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Eun Hee JEONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230326673
    • Publication date Oct 12, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Min Jung CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    • Publication number 20230317372
    • Publication date Oct 5, 2023
    • Murata Manufacturing Co., Ltd.
    • Yukie WATANABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CAPACITOR
    • Publication number 20230298817
    • Publication date Sep 21, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Yun Sung KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOUNTING STRUCTURE AND MOUNTING METHOD OF ELECTRONIC COMPONENT
    • Publication number 20230298814
    • Publication date Sep 21, 2023
    • Murata Manufacturing Co., Ltd.
    • Daichi SATOU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF TH...
    • Publication number 20230290577
    • Publication date Sep 14, 2023
    • Taiyo Yuden Co., Ltd.
    • Yuji TSUSHIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTILAYER ELECTRONIC COMPONENT
    • Publication number 20230290572
    • Publication date Sep 14, 2023
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Woo Kang
    • H01 - BASIC ELECTRIC ELEMENTS