the wafers being placed on a susceptor, stage or support

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H01L21/68714

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/68714the wafers being placed on a susceptor, stage or support

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Temperature control device
- Patent number 12,131,940
- Issue date Oct 29, 2024
- Kelk Ltd.
- Atsushi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Real time bias detection and correction for electrostatic chuck
- Patent number 12,080,584
- Issue date Sep 3, 2024
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transferring head and method for manufacturing electronic device
- Patent number 12,040,428
- Issue date Jul 16, 2024
- Innolux Corporation
- Hui-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat exchanger for thermal control of heat producing devices
- Patent number 12,019,095
- Issue date Jun 25, 2024
- Mikros Manufacturing, Inc.
- Jesse D. McGowan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature measurement and temperature calibration methods and tem...
- Patent number 12,007,289
- Issue date Jun 11, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ShihChieh Lin
- G01 - MEASURING TESTING
Information Patent Grant
Processing apparatus for electronic component
- Patent number 11,996,314
- Issue date May 28, 2024
- UENO SEIKI CO., LTD.
- Takayuki Masuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support unit and substrate treating apparatus including the same
- Patent number 11,961,748
- Issue date Apr 16, 2024
- Semes Co., Ltd.
- Kangseop Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus
- Patent number 11,945,074
- Issue date Apr 2, 2024
- Disco Corporation
- Nobuyuki Fukushi
- B24 - GRINDING POLISHING
Information Patent Grant
Article including inorganic compound and method of manufacturing ar...
- Patent number 11,911,877
- Issue date Feb 27, 2024
- Canon Kabushiki Kaisha
- Kanako Oshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic temperature control of substrate support in substrate proce...
- Patent number 11,908,715
- Issue date Feb 20, 2024
- Lam Research Corporation
- Sairam Sundaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selective deposition of silicon nitride layer and struct...
- Patent number 11,901,175
- Issue date Feb 13, 2024
- ASM IP Holding B.V.
- Eric James Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 11,881,419
- Issue date Jan 23, 2024
- SCREEN Holdings Co., Ltd.
- Toru Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer jig, robot system, communication method, and robot teaching m...
- Patent number 11,845,179
- Issue date Dec 19, 2023
- Kawasaki Jukogyo Kabushiki Kaisha
- Haruhiko Tan
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Stacked substrate manufacturing method, stacked substrate manufactu...
- Patent number 11,842,905
- Issue date Dec 12, 2023
- Nikon Corporation
- Isao Sugaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus, substrate cleaning method, and non-tr...
- Patent number 11,826,794
- Issue date Nov 28, 2023
- Tokyo Electron Limited
- Yuki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 11,817,337
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Munehisa Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package assembly handling
- Patent number 11,809,441
- Issue date Nov 7, 2023
- Onto Innovation Inc.
- Kevin Barr
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Processing apparatus for forming a coating film on a substrate havi...
- Patent number 11,791,162
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Yasuaki Noda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Placing table including heat exchange medium path and substrate pro...
- Patent number 11,791,177
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Katsuyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus
- Patent number 11,784,085
- Issue date Oct 10, 2023
- Tokyo Electron Limited
- Taro Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus
- Patent number 11,765,793
- Issue date Sep 19, 2023
- Semes Co., Ltd.
- Muhyeon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning apparatus
- Patent number 11,761,075
- Issue date Sep 19, 2023
- Tokyo Electron Limited
- Yukimasa Saito
- B08 - CLEANING
Information Patent Grant
Light irradiation type heat treatment method
- Patent number 11,764,073
- Issue date Sep 19, 2023
- SCREEN Holdings Co., Ltd.
- Mao Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,545
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,547
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,735,546
- Issue date Aug 22, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,302
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective micro device transfer to receiver substrate
- Patent number 11,728,306
- Issue date Aug 15, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage medium, EMI calculation method, and EMI calculation apparatus
- Patent number 11,719,733
- Issue date Aug 8, 2023
- Fujitsu Limited
- Shohei Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal regulator, substrate processing apparatus, and method of co...
- Patent number 11,705,347
- Issue date Jul 18, 2023
- Tokyo Electron Limited
- Katsuyuki Koizumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SYSTEM AND METHOD FOR USING THE SAME
- Publication number 20240387232
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD, SYSTEM AND APPARATUS FOR SURFACE MODIFICATION
- Publication number 20240371662
- Publication date Nov 7, 2024
- ASM IP HOLDING B.V.
- Rajkumar Jakkaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING HEAD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240339559
- Publication date Oct 10, 2024
- InnoLux Corporation
- Hui-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF
- Publication number 20240339326
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Fang-I Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD
- Publication number 20240274462
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Makoto Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240222125
- Publication date Jul 4, 2024
- Resonac Corporation
- Yoshikazu Umeta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOWL AND APPARATUS FOR PROCESSING SUBSTRATE
- Publication number 20240222159
- Publication date Jul 4, 2024
- SEMES CO., LTD.
- Se Hyeong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240203782
- Publication date Jun 20, 2024
- MICO CERAMICS LTD.
- Min-Ho Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ZONE HEATERS FOR METALLIC PEDESTALS
- Publication number 20240194506
- Publication date Jun 13, 2024
- LAM RESEARCH CORPORATION
- Sairam SUNDARAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING SYSTEM
- Publication number 20240120194
- Publication date Apr 11, 2024
- Samsung Electronics Co., Ltd.
- Sang Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240120219
- Publication date Apr 11, 2024
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING
- Publication number 20240112904
- Publication date Apr 4, 2024
- SKYWORKS GLOBAL PTE. LTD.
- Kezia Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HEATING DEVICE CONFIGURED TO SUPPRESS CRACK GENERATION
- Publication number 20240063033
- Publication date Feb 22, 2024
- MICO CERAMICS LTD.
- Hyosung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICK-AND-PLACE APPARATUS AND METHOD
- Publication number 20240038572
- Publication date Feb 1, 2024
- NEXPERIA B.V.
- Steven Verstoep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND NON-TR...
- Publication number 20240033786
- Publication date Feb 1, 2024
- TOKYO ELECTRON LIMITED
- Yuki ITO
- B08 - CLEANING
Information Patent Application
STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...
- Publication number 20240021447
- Publication date Jan 18, 2024
- Nikon Corporation
- Isao SUGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS
- Publication number 20230411188
- Publication date Dec 21, 2023
- Beijing NAURA Microelectronics Equipment Co., Ltd.
- Xiaoyan REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER FOR THERMAL CONTROL OF HEAT PRODUCING DEVICES
- Publication number 20230408545
- Publication date Dec 21, 2023
- Mikros Manufacturing, Inc.
- Jesse D. McGowan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS FOR FORMING A COATING FILM ON A SUBSTRATE HAVI...
- Publication number 20230395380
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Yasuaki NODA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WET PROCESSING SYSTEM AND SYSTEM AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20230386870
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIEH MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20230307257
- Publication date Sep 28, 2023
- SCREEN Holdings Co., Ltd.
- Shuhei NEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS FOR ELECTRONIC COMPONENT
- Publication number 20230274971
- Publication date Aug 31, 2023
- UENO SEIKI CO., LTD.
- Takayuki MASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING HEAD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- Publication number 20230215970
- Publication date Jul 6, 2023
- InnoLux Corporation
- Hui-Chieh Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL TIME BIAS DETECTION AND CORRECTION FOR ELECTROSTATIC CHUCK
- Publication number 20230207372
- Publication date Jun 29, 2023
- Applied Materials, Inc.
- Jian Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR DEPOSITING AN EPITAXIAL LAYER ON A SUBSTRATE...
- Publication number 20230178398
- Publication date Jun 8, 2023
- Siltronic AG
- Thomas STETTNER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230162982
- Publication date May 25, 2023
- TOKYO ELECTRON LIMITED
- Hideyuki Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PLACEMENT TABLE
- Publication number 20230146815
- Publication date May 11, 2023
- NGK Insulators, Ltd.
- Seiya INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TREATING SUBSTRATE
- Publication number 20230129923
- Publication date Apr 27, 2023
- SEMES CO., LTD.
- Jin Woo JUNG
- B08 - CLEANING
Information Patent Application
A PRESSURE REGULATED SEMICONDUCTOR WAFER COOLING APPARATUS AND METH...
- Publication number 20230112125
- Publication date Apr 13, 2023
- Edwards Vacuum LLC
- Kaustubh Kale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE
- Publication number 20230051061
- Publication date Feb 16, 2023
- Jusung Engineering Co., Ltd.
- Gu Hyun JUNG
- H01 - BASIC ELECTRIC ELEMENTS

the wafers being placed on a susceptor, stage or support

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Temperature control device

Real time bias detection and correction for electrostatic chuck

Transferring head and method for manufacturing electronic device

Heat exchanger for thermal control of heat producing devices

Temperature measurement and temperature calibration methods and tem...

Processing apparatus for electronic component

Support unit and substrate treating apparatus including the same

Processing apparatus

Article including inorganic compound and method of manufacturing ar...

Dynamic temperature control of substrate support in substrate proce...

Method for selective deposition of silicon nitride layer and struct...

Substrate processing apparatus

Wafer jig, robot system, communication method, and robot teaching m...

Stacked substrate manufacturing method, stacked substrate manufactu...

Substrate cleaning apparatus, substrate cleaning method, and non-tr...

Substrate processing system and substrate processing method

Wafer-level package assembly handling

Processing apparatus for forming a coating film on a substrate havi...

Placing table including heat exchange medium path and substrate pro...

Plasma processing apparatus

Substrate treating apparatus

Substrate cleaning apparatus

Light irradiation type heat treatment method

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Selective micro device transfer to receiver substrate

Storage medium, EMI calculation method, and EMI calculation apparatus

Thermal regulator, substrate processing apparatus, and method of co...

Patents Applicationslast 30 patents

BONDING SYSTEM AND METHOD FOR USING THE SAME

METHOD, SYSTEM AND APPARATUS FOR SURFACE MODIFICATION

TRANSFERRING HEAD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

WAFER EDGE TRIMMING PROCESS AND METHODS THEREOF

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING THE SAME

BOWL AND APPARATUS FOR PROCESSING SUBSTRATE

SUSCEPTOR AND METHOD OF MANUFACTURING THE SAME

DUAL ZONE HEATERS FOR METALLIC PEDESTALS

WAFER PROCESSING SYSTEM

BONDING APPARATUS AND BONDING METHOD

PLASMA PROCESS UNIFORMITY BY WAFER BACK SIDE DOPING

SUBSTRATE HEATING DEVICE CONFIGURED TO SUPPRESS CRACK GENERATION

PICK-AND-PLACE APPARATUS AND METHOD

SUBSTRATE CLEANING APPARATUS, SUBSTRATE CLEANING METHOD, AND NON-TR...

STACKED SUBSTRATE MANUFACTURING METHOD, STACKED SUBSTRATE MANUFACTU...

SEMICONDUCTOR PROCESSING APPARATUS

HEAT EXCHANGER FOR THERMAL CONTROL OF HEAT PRODUCING DEVICES

PROCESSING APPARATUS FOR FORMING A COATING FILM ON A SUBSTRATE HAVI...

WET PROCESSING SYSTEM AND SYSTEM AND METHOD FOR MANUFACTURING SEMIC...

SUBSTRATE PROCESSING APPARATUS

PROCESSING APPARATUS FOR ELECTRONIC COMPONENT

TRANSFERRING HEAD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

REAL TIME BIAS DETECTION AND CORRECTION FOR ELECTROSTATIC CHUCK

METHOD AND DEVICE FOR DEPOSITING AN EPITAXIAL LAYER ON A SUBSTRATE...

BONDING APPARATUS AND BONDING METHOD

WAFER PLACEMENT TABLE

APPARATUS FOR TREATING SUBSTRATE

A PRESSURE REGULATED SEMICONDUCTOR WAFER COOLING APPARATUS AND METH...

SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER DEVICE