the workpieces or work carriers being actively moved by a drive

Industry

CPC
B24B37/105

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/105the workpieces or work carriers being actively moved by a drive

Industries

Patents Grantslast 30 patents

Information Patent Grant
Polishing apparatus and polishing method
- Patent number 12,131,923
- Issue date Oct 29, 2024
- Ebara Corporation
- Yuta Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical cleaning tool for wafer polishing tool system
- Patent number 12,128,455
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Grant
Surface projection polishing pad
- Patent number 12,048,980
- Issue date Jul 30, 2024
- 3M Innovative Properties Company
- Lian S. Tan
- B24 - GRINDING POLISHING
Information Patent Grant
Process for making anti-reflective optical glass and product thereof
- Patent number 12,043,568
- Issue date Jul 23, 2024
- TACHI METAL MATERIAL TECHNOLOGY CO., LTD.
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 12,036,636
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar grinder
- Patent number 12,000,764
- Issue date Jun 4, 2024
- Illinois Tool Works Inc.
- Kurt G. Adair
- G01 - MEASURING TESTING
Information Patent Grant
Substrate holding apparatus, substrate processing apparatus having...
- Patent number 12,002,704
- Issue date Jun 4, 2024
- Ebara Corporation
- Makoto Kashiwagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-temperature metal CMP for minimizing dishing and corrosion, and...
- Patent number 11,897,079
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus for smoothing diamonds
- Patent number 11,897,087
- Issue date Feb 13, 2024
- Board of Trustees of Michigan State University
- Aaron Hardy
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based in-situ edge assymetry correction during CMP
- Patent number 11,865,671
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing system, learning device, and learning method of learning...
- Patent number 11,833,635
- Issue date Dec 5, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Keitaro Fujii
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing with applied magnetic field
- Patent number 11,787,008
- Issue date Oct 17, 2023
- Applied Materials, Inc.
- Xingfeng Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing carrier head with multiple angular pressurizable zones
- Patent number 11,780,049
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing temperature scanning apparatus for te...
- Patent number 11,752,589
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polish edge uniformity control with secondary fluid dispense
- Patent number 11,724,355
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Justin H. Wong
- B24 - GRINDING POLISHING
Information Patent Grant
Retaining ring for use in chemical mechanical polishing and CMP app...
- Patent number 11,717,933
- Issue date Aug 8, 2023
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Yong-Seok Ro
- B24 - GRINDING POLISHING
Information Patent Grant
Temperature-based assymetry correction during CMP and nozzle for me...
- Patent number 11,697,187
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing head system and polishing apparatus
- Patent number 11,673,222
- Issue date Jun 13, 2023
- Ebara Corporation
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 11,667,007
- Issue date Jun 6, 2023
- Ebara Corporation
- Mitsunori Sugiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing pad conditioning apparatus
- Patent number 11,648,644
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Eun Seok Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Silicon wafer single-side polishing method
- Patent number 11,628,534
- Issue date Apr 18, 2023
- Sumco Corporation
- Toshiharu Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 11,590,627
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for monitoring chemical mechanical polishing
- Patent number 11,565,365
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing (CMP) polishing head with improved va...
- Patent number 11,541,506
- Issue date Jan 3, 2023
- Systems on Silicon Manufacturing Company Pte. Ltd.
- Jayakumar Pachaiyappan
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing head and polishing apparatus
- Patent number 11,511,389
- Issue date Nov 29, 2022
- Ebara Corporation
- Kenichi Akazawa
- B24 - GRINDING POLISHING
Information Patent Grant
Carrier head having retainer ring, polishing system including the c...
- Patent number 11,458,587
- Issue date Oct 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method for phosphor glass thin plate and piece thereo...
- Patent number 11,433,500
- Issue date Sep 6, 2022
- Nippon Electric Glass Co., Ltd.
- Hideki Asano
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing table and polishing apparatus having ihe same
- Patent number 11,433,502
- Issue date Sep 6, 2022
- Ebara Corporation
- Kenichiro Saito
- B24 - GRINDING POLISHING
Information Patent Grant
Metallographic grinder and components thereof
- Patent number 11,397,139
- Issue date Jul 26, 2022
- Leco Corporation
- John Hauck
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240367202
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS HAVING...
- Publication number 20240282619
- Publication date Aug 22, 2024
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...
- Publication number 20240075582
- Publication date Mar 7, 2024
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20240066660
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Haosheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM
- Publication number 20240050995
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Wen Liu
- B08 - CLEANING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ZONES
- Publication number 20230405758
- Publication date Dec 21, 2023
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...
- Publication number 20230356351
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Hari Soundararajan
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD
- Publication number 20230352326
- Publication date Nov 2, 2023
- EBARA CORPORATION
- Kuniaki YAMAGUCHI
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20230339066
- Publication date Oct 26, 2023
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS FOR SMOOTHING DIAMONDS
- Publication number 20230286102
- Publication date Sep 14, 2023
- Board of Trustees of Michigan State University
- Aaron HARDY
- B24 - GRINDING POLISHING
Information Patent Application
LARGE AREA QUARTZ CRYSTAL WAFER LAPPING DEVICE AND A LAPPING METHOD...
- Publication number 20230249312
- Publication date Aug 10, 2023
- TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO., LTD.
- Jianmin XU
- B24 - GRINDING POLISHING
Information Patent Application
MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20230219188
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME
- Publication number 20230191555
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Chaelyoung Kim
- B24 - GRINDING POLISHING
Information Patent Application
SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING
- Publication number 20230182257
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu WANG
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS
- Publication number 20220297258
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Jeonghoon OH
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISHING SYSTEM
- Publication number 20220274228
- Publication date Sep 1, 2022
- KCTECH CO., LTD.
- Hee Sung CHAE
- B24 - GRINDING POLISHING
Information Patent Application
Process for Making Anti-reflective Optical Glass and Product Thereof
- Publication number 20220250974
- Publication date Aug 11, 2022
- Kuan-Wei Chen
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING WITH APPLIED MAGNETIC FIELD
- Publication number 20220193859
- Publication date Jun 23, 2022
- Applied Materials, Inc.
- Xingfeng WANG
- B24 - GRINDING POLISHING
Information Patent Application
HORIZONTAL BUFFING MODULE
- Publication number 20220134505
- Publication date May 5, 2022
- Applied Materials, Inc.
- Edward GOLUBOVSKY
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE
- Publication number 20220097198
- Publication date Mar 31, 2022
- Applied Materials, Inc.
- Justin H. WONG
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING
- Publication number 20220072682
- Publication date Mar 10, 2022
- Applied Materials, Inc.
- Jeonghoon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20220048155
- Publication date Feb 17, 2022
- KIOXIA Corporation
- Mikiya SAKASHITA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING CARRIER HEAD WITH MULTIPLE ANGULAR PRESSURIZABLE ZONES
- Publication number 20210402558
- Publication date Dec 30, 2021
- Applied Materials, Inc.
- Steven M. Zuniga
- B24 - GRINDING POLISHING
Information Patent Application
DRESSING APPARATUS AND DRESSING METHOD FOR SUBSTRATE REAR SURFACE P...
- Publication number 20210308828
- Publication date Oct 7, 2021
- TOKYO ELECTRON LIMITED
- Yoshiki Okamoto
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING HEAD SYSTEM AND POLISHING APPARATUS
- Publication number 20210308823
- Publication date Oct 7, 2021
- EBARA CORPORATION
- Katsuhide Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING (CMP) POLISHING HEAD WITH IMPROVED VA...
- Publication number 20210094146
- Publication date Apr 1, 2021
- Systems on Silicon Manufacturing Co. PTE. LTD.
- Jayakumar PACHAIYAPPAN
- B24 - GRINDING POLISHING
Information Patent Application
RETAINING RING FOR USE IN CHEMICAL MECHANICAL POLISHING AND CMP APP...
- Publication number 20210086324
- Publication date Mar 25, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- YONG-SEOK RO
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD FOR PHOSPHOR GLASS THIN PLATE AND PIECE THEREO...
- Publication number 20210069851
- Publication date Mar 11, 2021
- NIPPON ELECTRIC GLASS CO., LTD.
- Hideki ASANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...
- Publication number 20210046602
- Publication date Feb 18, 2021
- Applied Materials, Inc.
- Haosheng Wu
- B24 - GRINDING POLISHING

the workpieces or work carriers being actively moved by a drive

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Polishing apparatus and polishing method

Electrical cleaning tool for wafer polishing tool system

Surface projection polishing pad

Process for making anti-reflective optical glass and product thereof

Mega-sonic vibration assisted chemical mechanical planarization

Planar grinder

Substrate holding apparatus, substrate processing apparatus having...

Low-temperature metal CMP for minimizing dishing and corrosion, and...

Polishing apparatus for smoothing diamonds

Polishing apparatus

Temperature-based in-situ edge assymetry correction during CMP

Polishing system, learning device, and learning method of learning...

Chemical mechanical polishing with applied magnetic field

Polishing carrier head with multiple angular pressurizable zones

Chemical mechanical polishing temperature scanning apparatus for te...

Substrate polish edge uniformity control with secondary fluid dispense

Retaining ring for use in chemical mechanical polishing and CMP app...

Temperature-based assymetry correction during CMP and nozzle for me...

Polishing head system and polishing apparatus

Polishing apparatus and polishing method

Polishing pad conditioning apparatus

Silicon wafer single-side polishing method

Mega-sonic vibration assisted chemical mechanical planarization

System and method for monitoring chemical mechanical polishing

Chemical mechanical polishing (CMP) polishing head with improved va...

Polishing head and polishing apparatus

Carrier head having retainer ring, polishing system including the c...

Manufacturing method for phosphor glass thin plate and piece thereo...

Polishing table and polishing apparatus having ihe same

Metallographic grinder and components thereof

Patents Applicationslast 30 patents

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

SUBSTRATE HOLDING APPARATUS, SUBSTRATE PROCESSING APPARATUS HAVING...

POLISHING APPARATUS

MODULAR CHEMICAL MECHANICAL POLISHER WITH SIMULTANEOUS POLISHING AN...

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...

ELECTRICAL CLEANING TOOL FOR WAFER POLISHING TOOL SYSTEM

POLISHING CARRIER HEAD WITH MULTIPLE ZONES

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TE...

SUBSTRATE PROCESSING APPARATUS AND PROCESSING METHOD

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

POLISHING APPARATUS FOR SMOOTHING DIAMONDS

LARGE AREA QUARTZ CRYSTAL WAFER LAPPING DEVICE AND A LAPPING METHOD...

MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD USING THE SAME

SYSTEM AND METHOD FOR MONITORING CHEMICAL MECHANICAL POLISHING

SUBSTRATE POLISHING SIMULTANEOUSLY OVER MULTIPLE MINI PLATENS

SUBSTRATE POLISHING SYSTEM

Process for Making Anti-reflective Optical Glass and Product Thereof

CHEMICAL MECHANICAL POLISHING WITH APPLIED MAGNETIC FIELD

HORIZONTAL BUFFING MODULE

SUBSTRATE POLISH EDGE UNIFORMITY CONTROL WITH SECONDARY FLUID DISPENSE

SUBSTRATE HANDLING SYSTEMS AND METHODS FOR CMP PROCESSING

POLISHING APPARATUS AND POLISHING METHOD

POLISHING CARRIER HEAD WITH MULTIPLE ANGULAR PRESSURIZABLE ZONES

DRESSING APPARATUS AND DRESSING METHOD FOR SUBSTRATE REAR SURFACE P...

POLISHING HEAD SYSTEM AND POLISHING APPARATUS

CHEMICAL MECHANICAL POLISHING (CMP) POLISHING HEAD WITH IMPROVED VA...

RETAINING RING FOR USE IN CHEMICAL MECHANICAL POLISHING AND CMP APP...

MANUFACTURING METHOD FOR PHOSPHOR GLASS THIN PLATE AND PIECE THEREO...

LOW-TEMPERATURE METAL CMP FOR MINIMIZING DISHING AND CORROSION, AND...