Thermal arrangements

Industry

CPC
H05K1/0201

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0201Thermal arrangements

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for an electronic device
- Patent number 12,207,444
- Issue date Jan 21, 2025
- Harman International Industries, Incorporated
- David Jia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fastening system for coupling a computing module to a printed circu...
- Patent number 12,207,388
- Issue date Jan 21, 2025
- Dell Products L.P.
- Tung-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sinks for electronic circuits
- Patent number 12,200,852
- Issue date Jan 14, 2025
- Auradine Inc.
- Glen Gibson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground discontinuities for thermal isolation
- Patent number 12,193,142
- Issue date Jan 7, 2025
- International Business Machines Corporation
- Trevor Timpane
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ball grid array package design
- Patent number 12,191,225
- Issue date Jan 7, 2025
- Dell Products L.P.
- Qinghong He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and circuit board
- Patent number 12,185,452
- Issue date Dec 31, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Rui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid ejecting head unit and liquid ejecting apparatus
- Patent number 12,179,484
- Issue date Dec 31, 2024
- Seiko Epson Corporation
- Ryota Kinoshita
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic device and method of manufacturing the same
- Patent number 12,185,475
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Tun-Ching Pi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pre-charge unit for charging a dc link capacitor and battery system...
- Patent number 12,113,380
- Issue date Oct 8, 2024
- Samsung SDI Co., Ltd.
- Florian Maxl
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Metal-ceramic substrate with a foil formed for direct cooling as su...
- Patent number 12,087,660
- Issue date Sep 10, 2024
- Heraeus Deutschland GmbH & Co. KG
- Peter Dietrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management systems having signal transfer routing for use w...
- Patent number 12,082,332
- Issue date Sep 3, 2024
- Intel Corporation
- Juha Paavola
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board, semiconductor device, power converter, and moving ob...
- Patent number 12,075,556
- Issue date Aug 27, 2024
- Mitsubishi Electric Corporation
- Yuta Fukushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure for inverter ground screws of a belt sta...
- Patent number 12,075,601
- Issue date Aug 27, 2024
- Vitesco Technologies USA, LLC.
- Guoqing Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fan assembly and server
- Patent number 12,048,124
- Issue date Jul 23, 2024
- SQ Technology (Shanghai) Corporation
- Zhao Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Axial field rotary energy device with PCB stator with thermal expan...
- Patent number 12,046,966
- Issue date Jul 23, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier substrate and power module
- Patent number 12,028,974
- Issue date Jul 2, 2024
- Robert Bosch GmbH
- Peter Tauber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical assembly with a temperature monitoring device
- Patent number 12,028,961
- Issue date Jul 2, 2024
- PHOENIX CONTACT E-MOBILITY GMBH
- Thomas Fuehrer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Printed flexible wiring apparatus in a cryostat
- Patent number 12,016,138
- Issue date Jun 18, 2024
- EQUAL 1 LABORATORIES IRELAND LIMITED
- Hans Haenlein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting system for optical element of intraoral scanner
- Patent number 12,011,338
- Issue date Jun 18, 2024
- Align Technology, Inc.
- Rami Boltanski
- G01 - MEASURING TESTING
Information Patent Grant
Cover for sealing a power module
- Patent number 11,997,812
- Issue date May 28, 2024
- Lunar Energy, Inc.
- Kevin Richard Fine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming interconnect circuits
- Patent number 11,979,976
- Issue date May 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flexible interconnect circuits for battery packs
- Patent number 11,950,377
- Issue date Apr 2, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-safety lamp tube and method for increasing protection range of...
- Patent number 11,942,294
- Issue date Mar 26, 2024
- Xiamen PVTECH Co., Ltd.
- Fuxing Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit copper overlay for temperature management
- Patent number 11,924,958
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Teruhiro Nakamiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing heat radiation member
- Patent number 11,919,288
- Issue date Mar 5, 2024
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wiring substrate
- Patent number 11,916,365
- Issue date Feb 27, 2024
- Autonetworks Technologies, Ltd.
- Arinobu Nakamura
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wiring structure
- Patent number 11,908,786
- Issue date Feb 20, 2024
- Advanced Semiconductor Engineering, Inc.
- Ting Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE
- Publication number 20240427390
- Publication date Dec 26, 2024
- Raytheon Company
- Christopher M. Cosner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...
- Publication number 20240431016
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Joohan KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE ADJUSTMENT MODULE
- Publication number 20240414887
- Publication date Dec 12, 2024
- GIGA-BYTE TECHNOLOGY CO.,LTD.
- Chih-Hua Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT
- Publication number 20240407138
- Publication date Dec 5, 2024
- SAGEMCOM BROADBAND SAS
- Nathan JEANROT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
- Publication number 20240381523
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Wanjae JU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...
- Publication number 20240341026
- Publication date Oct 10, 2024
- Haedong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD MODULE AND ELECTRICAL JUNCTION BOX
- Publication number 20240339773
- Publication date Oct 10, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shun Takamizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240334586
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VOLTAGE REGULATOR MODULE HAVING A POWER STAGE
- Publication number 20240314926
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE, CONTROL METHOD THEREFOR, AND MANUFACTURING METHOD TH...
- Publication number 20240276084
- Publication date Aug 15, 2024
- NIPPON CHEMI-CON CORPORATION
- Katsuya TAMAKI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPOSITE HEAT DISSIPATION STRUCTURE AND DISPLAY APPARATUS
- Publication number 20240276631
- Publication date Aug 15, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FASTENING SYSTEM FOR COUPLING A COMPUTING MODULE TO A PRINTED CIRCU...
- Publication number 20240268016
- Publication date Aug 8, 2024
- Dell Products L.P.
- TUNG-YI CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT IN AN ELECTRONIC DEVICE CHASSIS
- Publication number 20240268073
- Publication date Aug 8, 2024
- Rakuten Symphony UK Ltd
- Gerard MacManus
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODE FOR HIGH-ENERGY BATTERIES
- Publication number 20240258513
- Publication date Aug 1, 2024
- HYDRO-QUEBEC
- Karim ZAGHIB
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT
- Publication number 20240260167
- Publication date Aug 1, 2024
- Canon Kabushiki Kaisha
- KOJI NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION
- Publication number 20240237186
- Publication date Jul 11, 2024
- ELEMENTS PERFORMANCE TECHNOLOGY INC.
- JERRYSON LEE
- F21 - LIGHTING
Information Patent Application
SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE
- Publication number 20240237280
- Publication date Jul 11, 2024
- Dana Canada Corporation
- Jingyuan LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE INTERCONNECT CIRCUITS FOR BATTERY PACKS
- Publication number 20240215173
- Publication date Jun 27, 2024
- CelLink Corporation
- Jean-Paul Ortiz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING
- Publication number 20240188212
- Publication date Jun 6, 2024
- Intel Corporation
- Mohammad Mamunur Rahman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE
- Publication number 20240138107
- Publication date Apr 25, 2024
- Dana Canada Corporation
- Jingyuan LIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION
- Publication number 20240138049
- Publication date Apr 25, 2024
- ELEMENTS PERFORMANCE TECHNOLOGY INC.
- JERRYSON LEE
- F21 - LIGHTING
Information Patent Application
COVER FOR SEALING A POWER MODULE
- Publication number 20240130064
- Publication date Apr 18, 2024
- Lunar Energy, Inc.
- Kevin Richard Fine
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
UNIVERSAL RUGGEDIZED COMPUTER SYSTEM ENCLOSURE
- Publication number 20240114653
- Publication date Apr 4, 2024
- United States of America as Represented by The Secretary of The Army
- Joshua D. Wattier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT
- Publication number 20240107671
- Publication date Mar 28, 2024
- Liqid Inc.
- Andrew Rudolph Heyd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCLOSURE ASSEMBLIES, AND RELATED DEVICES AND METHODS
- Publication number 20240107654
- Publication date Mar 28, 2024
- Cummins Inc.
- Vineet K. Pandey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERCONNECT CIRCUIT METHODS AND DEVICES
- Publication number 20240098873
- Publication date Mar 21, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098872
- Publication date Mar 21, 2024
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems and methods for an electronic device

Fastening system for coupling a computing module to a printed circu...

Heat sinks for electronic circuits

Ground discontinuities for thermal isolation

Ball grid array package design

Display device and circuit board

Liquid ejecting head unit and liquid ejecting apparatus

Electronic device and method of manufacturing the same

Electronic control of a compressor, compressor and cooling equipment

Pre-charge unit for charging a dc link capacitor and battery system...

Metal-ceramic substrate with a foil formed for direct cooling as su...

Thermal management systems having signal transfer routing for use w...

Circuit board, semiconductor device, power converter, and moving ob...

Heat dissipation structure for inverter ground screws of a belt sta...

Resin multilayer substrate

Fan assembly and server

Axial field rotary energy device with PCB stator with thermal expan...

Methods of forming flexible interconnect circuits

Ceramic carrier substrate and power module

Electrical assembly with a temperature monitoring device

Printed flexible wiring apparatus in a cryostat

Mounting system for optical element of intraoral scanner

Cover for sealing a power module

Methods of forming interconnect circuits

Flexible interconnect circuits for battery packs

High-safety lamp tube and method for increasing protection range of...

Flexible printed circuit copper overlay for temperature management

Method for producing heat radiation member

Wiring substrate

Wiring structure

Patents Applicationslast 30 patents

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

PROCESSOR UNIT WITH ACTIVE COOLING SYSTEM FOR PROCESSOR DEVICE

PRINTED CIRCUIT BOARD STRUCTURE CONTAINING THERMAL INTERFACE MATERI...

TEMPERATURE ADJUSTMENT MODULE

THERMAL REGULATION DEVICE AND ASSOCIATED PIECE OF ELECTRONIC EQUIPMENT

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

SILICON CARBIDE THERMAL BRIDGE INTEGRATED ON A LOW THERMAL CONDUCTI...

BOARD MODULE AND ELECTRICAL JUNCTION BOX

PACKAGE STRUCTURE

VOLTAGE REGULATOR MODULE HAVING A POWER STAGE

CAMERA MODULE, CONTROL METHOD THEREFOR, AND MANUFACTURING METHOD TH...

COMPOSITE HEAT DISSIPATION STRUCTURE AND DISPLAY APPARATUS

Interconnect Circuit Methods And Devices

FASTENING SYSTEM FOR COUPLING A COMPUTING MODULE TO A PRINTED CIRCU...

THERMAL MANAGEMENT IN AN ELECTRONIC DEVICE CHASSIS

ANODE FOR HIGH-ENERGY BATTERIES

ELECTRONIC MODULE, IMAGING UNIT AND EQUIPMENT

POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION

SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE

FLEXIBLE INTERCONNECT CIRCUITS FOR BATTERY PACKS

PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING

SYSTEMS FOR THERMAL MANAGEMENT OF AN ELECTRONIC DEVICE

POWER SUPPLY DEVICE HAVING THERMAL INSULATION FUNCTION

COVER FOR SEALING A POWER MODULE

UNIVERSAL RUGGEDIZED COMPUTER SYSTEM ENCLOSURE

DUAL-SIDED EXPANSION CARD WITH OFFSET SLOT ALIGNMENT

ENCLOSURE ASSEMBLIES, AND RELATED DEVICES AND METHODS

INTERCONNECT CIRCUIT METHODS AND DEVICES

ELECTRONIC DEVICE