Thermal management

Industry

CPC
H05K7/20381

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20381Thermal management

Industries

Patents Grantslast 30 patents

Information Patent Grant
Fluid immersion cooling system with low flash point hydrocarbon die...
- Patent number 12,185,497
- Issue date Dec 31, 2024
- Super Micro Computer, Inc.
- Yueh-Ming Liu
- A62 - LIFE-SAVING FIRE-FIGHTING
Information Patent Grant
Active heat dissipating apparatus for a terminal, terminal, and act...
- Patent number 12,169,426
- Issue date Dec 17, 2024
- ZTE Corporation
- Yan Liu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal management device for circuit breakers
- Patent number 12,171,086
- Issue date Dec 17, 2024
- EATON INTELLIGENT POWER LIMITED
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Evaporative cooling logic control method and apparatus of inductive...
- Patent number 12,171,085
- Issue date Dec 17, 2024
- ETS SOLUTIONS (BEIJING) LTD.
- Yaming Qin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid immersion cooling apparatus
- Patent number 12,160,978
- Issue date Dec 3, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Xue-Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature management system for autonomous vehicles
- Patent number 12,156,369
- Issue date Nov 26, 2024
- TUSIMPLE, INC.
- Kaixin Zheng
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Liquid submerged, horizontal computer server rack and systems and m...
- Patent number 12,150,282
- Issue date Nov 19, 2024
- GREEN REVOLUTION COOLING, INC.
- Christiaan Scott Best
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Systems and methods for vapor-compressed cooling
- Patent number 12,144,151
- Issue date Nov 12, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device
- Patent number 12,144,150
- Issue date Nov 12, 2024
- VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Xiao-Yao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device heat dissipation system with sugar alcohol phase...
- Patent number 12,137,539
- Issue date Nov 5, 2024
- Beihang University
- Yuming Xing
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3-D structured two-phase cooling boilers with nano structured boili...
- Patent number 12,120,851
- Issue date Oct 15, 2024
- Microsoft Technology Licensing, LLC
- Dennis Trieu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mode control method and system, and electronic device, and storage...
- Patent number 12,120,850
- Issue date Oct 15, 2024
- Zhejiang Sanhua Intelligent Controls CO., Ltd.
- Shuang Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for thermal management of high-capacity devices...
- Patent number 12,108,568
- Issue date Oct 1, 2024
- Microsoft Technology Licensing, LLC
- Bharath Ramakrishnan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat exchange system used for heat dissipation of electronic contro...
- Patent number 12,101,911
- Issue date Sep 24, 2024
- SANHUA (HANGZHOU) MICRO CHANNEL HEAT EXCHANGER CO., LTD.
- Xiaoming Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system in electronics cabinet comprising thermally coupled...
- Patent number 12,096,602
- Issue date Sep 17, 2024
- Pfannenberg GmbH
- Russell Fuller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal regulation for electrical devices
- Patent number 12,080,865
- Issue date Sep 3, 2024
- Arkema France
- Laurent Abbas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, apparatus, and computer program product for multiphase cool...
- Patent number 12,082,372
- Issue date Sep 3, 2024
- Nokia Technologies Oy
- Akshat Agarwal
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Intelligent dual function cold plate system with heat pipe for data...
- Patent number 12,069,836
- Issue date Aug 20, 2024
- NVIDIA Corporation
- Ali Heydari
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for additive manufacturing of wick structure fo...
- Patent number 12,064,708
- Issue date Aug 20, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Ercan Dede
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Liquid immersion cooling platform and components thereof
- Patent number 12,035,508
- Issue date Jul 9, 2024
- Modine LLC
- John David Enright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Evaporative thermal management systems and methods
- Patent number 12,031,753
- Issue date Jul 9, 2024
- GE Aviation Systems LLC
- Brian Magann Rush
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Grant
Immersion liquid cooling tank assembly with fan
- Patent number 12,004,325
- Issue date Jun 4, 2024
- Quanta Computer Inc.
- Chao-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooling while preventing electronic damage
- Patent number 11,999,895
- Issue date Jun 4, 2024
- Aojiang (Wuxi) Network Energy Co., Ltd.
- Jianmei Lu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Immersion cooling system that enables increased heat flux at heat-g...
- Patent number 11,997,827
- Issue date May 28, 2024
- Microsoft Technology Licensing, LLC
- Husam Atallah Alissa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Intelligent thermosyphon system for datacenter cooling systems
- Patent number 11,974,416
- Issue date Apr 30, 2024
- NVIDIA Corporation
- Ali Heydari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling system and operation method thereof where a separation tank...
- Patent number 11,968,804
- Issue date Apr 23, 2024
- Inventec (Pudong) Technology Corp.
- Kai-Yang Tung
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fully redundant cooling unit with phase change flow control unit
- Patent number 11,963,331
- Issue date Apr 16, 2024
- BAIDU USA LLC
- Tianyi Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling system of server
- Patent number 11,956,925
- Issue date Apr 9, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Kai-Yang Tung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for immersion-cooled datacenters
- Patent number 11,910,567
- Issue date Feb 20, 2024
- Microsoft Technology Licensing, LLC
- Husam Atallah Alissa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat recovery for datacenter cooling systems
- Patent number 11,910,576
- Issue date Feb 20, 2024
- NVIDIA Corporation
- Ali Heydari
- B60 - VEHICLES IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE
- Publication number 20250008682
- Publication date Jan 2, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Ulf AHLBERG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...
- Publication number 20240431075
- Publication date Dec 26, 2024
- Microsoft Technology Licensing, LLC
- Dennis TRIEU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT EXCHANGER
- Publication number 20240414882
- Publication date Dec 12, 2024
- Rolls-Royce plc
- Daniele M GORLA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING APPARATUS AND ELECTRONIC DEVICE
- Publication number 20240389267
- Publication date Nov 21, 2024
- Bitmain Technologies Inc.
- Ketuan ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite Thermostatic Cooling System
- Publication number 20240389265
- Publication date Nov 21, 2024
- Wexten Precise Industries Co., Ltd.
- Ling-Chun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID IMMERSION COOLING PLATFORM AND COMPONENTS THEREOF
- Publication number 20240381576
- Publication date Nov 14, 2024
- Modine LLC
- John David Enright
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...
- Publication number 20240365513
- Publication date Oct 31, 2024
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUID BREAKDOWN DETECTION SYSTEMS AND PROCESSES USEFUL FOR LIQUID I...
- Publication number 20240349451
- Publication date Oct 17, 2024
- Modine LLC
- John David Enright
- G01 - MEASURING TESTING
Information Patent Application
METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...
- Publication number 20240349453
- Publication date Oct 17, 2024
- The Durbin Group, LLC
- Joseph Marsala
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EVAPORATIVE THERMAL MANAGEMENT SYSTEMS AND METHODS
- Publication number 20240310085
- Publication date Sep 19, 2024
- GE AVIATION SYSTEMS LLC
- Brian Magann Rush
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES
- Publication number 20240314977
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Nicholas Andrew KEEHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...
- Publication number 20240276678
- Publication date Aug 15, 2024
- ZTE Corporation
- Cheng TAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION COOLING SYSTEM THAT ENABLES INCREASED HEAT FLUX AT HEAT-G...
- Publication number 20240268069
- Publication date Aug 8, 2024
- Microsoft Technology Licensing, LLC
- Husam Atallah ALISSA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL TRANSFER STRUCTURES FOR IMMERSION COOLING
- Publication number 20240215203
- Publication date Jun 27, 2024
- Microsoft Technology Licensing, LLC
- Sreya SARKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WASTE COLD RECUPERATION IN FUEL CELL BASED POWER GENERATION SYSTEMS...
- Publication number 20240206117
- Publication date Jun 20, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Evaporative Cooling Logic Control Method and Apparatus of Inductive...
- Publication number 20240206121
- Publication date Jun 20, 2024
- ETS SOLUTIONS (BEIJING) LTD.
- Yaming QIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT DEVICE FOR CIRCUIT BREAKERS
- Publication number 20240206123
- Publication date Jun 20, 2024
- Eaton Intelligent Power Limited
- Ankit Bhagat
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COOLING DEVICE FOR SEMICONDUCTOR DEVICE
- Publication number 20240188253
- Publication date Jun 6, 2024
- KIOXIA Corporation
- Tomoya SANUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING APPARATUS FOR SUPERCONDUCTING FAULT CURRENT LIMITER
- Publication number 20240164058
- Publication date May 16, 2024
- LS ELECTRIC CO., LTD.
- Ki Nam RYU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS
- Publication number 20240147663
- Publication date May 2, 2024
- Microsoft Technology Licensing, LLC
- Husam Atallah ALISSA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR IMMERSION COOLING WITH SUBCOOLED SPRAY
- Publication number 20240138112
- Publication date Apr 25, 2024
- Microsoft Technology Licensing, LLC
- Eric C. PETERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIMODE IMMERSION COOLING
- Publication number 20240130086
- Publication date Apr 18, 2024
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Wai Chung LI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
AUTOMATIC DUAL PUMP SYSTEM WITH THREE-WAY VALVE
- Publication number 20240111314
- Publication date Apr 4, 2024
- Opticool Solutions, LLC
- David Laslo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION COOLING APPARATUS
- Publication number 20240090170
- Publication date Mar 14, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- XUE-FENG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUID IMMERSION COOLING SYSTEM WITH LOW FLASH POINT HYDROCARBON DIE...
- Publication number 20240064936
- Publication date Feb 22, 2024
- SUPER MICRO COMPUTER, INC.
- Yueh-Ming LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...
- Publication number 20240057291
- Publication date Feb 15, 2024
- Wiwynn Corporation
- Tai-Ying Tu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE
- Publication number 20240049428
- Publication date Feb 8, 2024
- VAST GLORY ELECTRONIC & HARDWARE & PLASTIC (HUI ZHOU) LTD
- Xiao-Yao LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM FOR COOLING
- Publication number 20240023282
- Publication date Jan 18, 2024
- Accelsius, LLC
- Raffaele Luca AMALFI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate Transport Vacuum Platform
- Publication number 20240014057
- Publication date Jan 11, 2024
- PERSIMMON TECHNOLOGIES CORPORATION
- Christopher Hofmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...
- Publication number 20240008226
- Publication date Jan 4, 2024
- Intel Corporation
- Je-Young CHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Thermal management

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Fluid immersion cooling system with low flash point hydrocarbon die...

Active heat dissipating apparatus for a terminal, terminal, and act...

Thermal management device for circuit breakers

Evaporative cooling logic control method and apparatus of inductive...

Liquid immersion cooling apparatus

Temperature management system for autonomous vehicles

Liquid submerged, horizontal computer server rack and systems and m...

Systems and methods for vapor-compressed cooling

Heat dissipating device

Electronic device heat dissipation system with sugar alcohol phase...

3-D structured two-phase cooling boilers with nano structured boili...

Mode control method and system, and electronic device, and storage...

Systems and methods for thermal management of high-capacity devices...

Heat exchange system used for heat dissipation of electronic contro...

Cooling system in electronics cabinet comprising thermally coupled...

Thermal regulation for electrical devices

Method, apparatus, and computer program product for multiphase cool...

Intelligent dual function cold plate system with heat pipe for data...

Systems and methods for additive manufacturing of wick structure fo...

Liquid immersion cooling platform and components thereof

Evaporative thermal management systems and methods

Immersion liquid cooling tank assembly with fan

Liquid cooling while preventing electronic damage

Immersion cooling system that enables increased heat flux at heat-g...

Intelligent thermosyphon system for datacenter cooling systems

Cooling system and operation method thereof where a separation tank...

Fully redundant cooling unit with phase change flow control unit

Cooling system of server

Systems and methods for immersion-cooled datacenters

Heat recovery for datacenter cooling systems

Patents Applicationslast 30 patents

COOLING MODULE ASSEMBLY FOR POLE-MOUNTED NETWORK NODE

3-D STRUCTURED TWO-PHASE COOLING BOILERS WITH NANO STRUCTURED BOILI...

HEAT EXCHANGER

COOLING APPARATUS AND ELECTRONIC DEVICE

Composite Thermostatic Cooling System

LIQUID IMMERSION COOLING PLATFORM AND COMPONENTS THEREOF

OPTIMIZED AND AUTOMATED DYNAMIC THERMAL REGULATION METHOD AND APPAR...

FLUID BREAKDOWN DETECTION SYSTEMS AND PROCESSES USEFUL FOR LIQUID I...

METHOD AND APPARATUS FOR A PUMPED LIQUID COOLING SYSTEM USING A PHA...

EVAPORATIVE THERMAL MANAGEMENT SYSTEMS AND METHODS

SYSTEMS AND METHODS FOR THERMAL MANAGEMENT OF ELECTRONIC DEVICES

PUMP-DRIVEN TWO-PHASE LIQUID COOLING SYSTEM, AND LIQUID SUPPLEMENTA...

IMMERSION COOLING SYSTEM THAT ENABLES INCREASED HEAT FLUX AT HEAT-G...

THERMAL TRANSFER STRUCTURES FOR IMMERSION COOLING

WASTE COLD RECUPERATION IN FUEL CELL BASED POWER GENERATION SYSTEMS...

Evaporative Cooling Logic Control Method and Apparatus of Inductive...

THERMAL MANAGEMENT DEVICE FOR CIRCUIT BREAKERS

COOLING DEVICE FOR SEMICONDUCTOR DEVICE

COOLING APPARATUS FOR SUPERCONDUCTING FAULT CURRENT LIMITER

SYSTEMS AND METHODS FOR IMMERSION-COOLED DATACENTERS

SYSTEMS AND METHODS FOR IMMERSION COOLING WITH SUBCOOLED SPRAY

MULTIMODE IMMERSION COOLING

AUTOMATIC DUAL PUMP SYSTEM WITH THREE-WAY VALVE

LIQUID IMMERSION COOLING APPARATUS

FLUID IMMERSION COOLING SYSTEM WITH LOW FLASH POINT HYDROCARBON DIE...

IMMERSION LIQUID COOLING EQUIPMENT AND HEAT DISSIPATION METHOD FOR...

HEAT DISSIPATING DEVICE

APPARATUS AND SYSTEM FOR COOLING

Substrate Transport Vacuum Platform

METHOD AND APPARATUS FOR REAL TIME, IN-SITU IMMERSION COOLANT CHARA...