Thermal treatment leading to a different chemical state of a material

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H05K2203/1194

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1194Thermal treatment leading to a different chemical state of a material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Insulated circuit board
- Patent number 12,089,342
- Issue date Sep 10, 2024
- Mitsubishi Materials Corporation
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Glass circuit board and stress relief layer
- Patent number 11,516,911
- Issue date Nov 29, 2022
- Toppan Printing Co., Ltd.
- Masahiko Kijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,201,109
- Issue date Dec 14, 2021
- Corning Incorporated
- Mandakini Kanungo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 11,195,969
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 11,152,294
- Issue date Oct 19, 2021
- Corning Incorporated
- Tian Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 11,056,610
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Conductive graphene interfacial barriers for liquid metal electronics
- Patent number 11,057,994
- Issue date Jul 6, 2021
- Northwestern University
- Mark C. Hersam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,993,331
- Issue date Apr 27, 2021
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 10,887,985
- Issue date Jan 5, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Natsuko Kitajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped, low-temperature co-fired glass-ceramic (LTCC) insulating sub...
- Patent number 10,858,282
- Issue date Dec 8, 2020
- QUALCOMM Incorporated
- Klaus Dieter Aichholzer
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates for stretchable electronics and method of manufacture
- Patent number 10,736,212
- Issue date Aug 4, 2020
- ARES MATERIALS INC.
- Radu Reit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with transparent electrode and method for manufacturing same
- Patent number 10,662,521
- Issue date May 26, 2020
- Kaneka Corporation
- Hironori Hayakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Circuit board and method for manufacturing same
- Patent number 10,492,306
- Issue date Nov 26, 2019
- Kuraray Co., Ltd.
- Takeshi Takahashi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number 10,485,102
- Issue date Nov 19, 2019
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate
- Patent number 10,306,759
- Issue date May 28, 2019
- Shinko Electric Industries Co., Ltd.
- Natsuko Kitajo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal silicide transparent conductive electrode
- Patent number 10,147,839
- Issue date Dec 4, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for producing substrate with transparent electrode, and subs...
- Patent number 10,138,541
- Issue date Nov 27, 2018
- Kaneka Corporation
- Hironori Hayakawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-speed interconnects for printed circuit boards
- Patent number 10,051,746
- Issue date Aug 14, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication of intra-structure conductive traces and interconnects...
- Patent number 10,039,195
- Issue date Jul 31, 2018
- Facebook, Inc.
- Baback Elmieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Two-step, direct-write laser metallization
- Patent number 10,015,887
- Issue date Jul 3, 2018
- Orbotech Ltd.
- Michael Zenou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Substrate with transparent electrode and method for manufacturing same
- Patent number 9,903,015
- Issue date Feb 27, 2018
- Kaneka Corporation
- Hironori Hayakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
One up, one down connection structure for piezoelectric device in t...
- Patent number 9,780,287
- Issue date Oct 3, 2017
- Compagnie Generale des Etablissements Michelin
- David Alan Weston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible printed circuits with bend retention structures
- Patent number 9,769,920
- Issue date Sep 19, 2017
- Apple Inc.
- Colin M. Ely
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for assembling electronic devices with adhesive
- Patent number 9,565,773
- Issue date Feb 7, 2017
- Apple Inc.
- John J. Baker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for z-axis interconnection of multilayer electronic subs...
- Patent number 9,545,017
- Issue date Jan 10, 2017
- Ormet Circuits, Inc.
- Christopher A Hunrath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WIRING BOARD
- Publication number 20240147632
- Publication date May 2, 2024
- YAZAKI CORPORATION
- Mitsuaki Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION
- Publication number 20230413449
- Publication date Dec 21, 2023
- National Tsing-Hua University
- Ming-Tsang Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATED CIRCUIT BOARD
- Publication number 20230091454
- Publication date Mar 23, 2023
- MITSUBISHI MATERIALS CORPORATION
- Akira Sakurai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394843
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20220394842
- Publication date Dec 8, 2022
- FUJIFILM CORPORATION
- Genya TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20210076491
- Publication date Mar 11, 2021
- Toppan Printing Co.,Ltd.
- Masahiko KIJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE GRAPHENE INTERFACIAL BARRIERS FOR LIQUID METAL ELECTRONICS
- Publication number 20200229304
- Publication date Jul 16, 2020
- Northwestern University
- Mark C. HERSAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20190230791
- Publication date Jul 25, 2019
- Shinko Electric Industries Co., Ltd.
- NATSUKO KITAJO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD
- Publication number 20190215957
- Publication date Jul 11, 2019
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming a metal silicide transparent conductive electrode
- Publication number 20180358504
- Publication date Dec 13, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method of forming a metal silicide transparent conductive electrode
- Publication number 20180342642
- Publication date Nov 29, 2018
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS
- Publication number 20180332720
- Publication date Nov 15, 2018
- Amphenol Corporation
- Arthur E. Harkness
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME
- Publication number 20180187300
- Publication date Jul 5, 2018
- Kaneka Corporation
- Hironori Hayakawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES
- Publication number 20180166353
- Publication date Jun 14, 2018
- Corning Incorporated
- Sean Matthew Garner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING HEAT DISSIPATING BOARD
- Publication number 20160143126
- Publication date May 19, 2016
- Meiko Electronics Co., Ltd.
- Noriaki TANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20150313011
- Publication date Oct 29, 2015
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME
- Publication number 20150241269
- Publication date Aug 27, 2015
- HON HAI PRECISION INDUSTRY CO., LTD.
- CHIH-CHEN LAI
- B32 - LAYERED PRODUCTS
Information Patent Application
STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBS...
- Publication number 20140231126
- Publication date Aug 21, 2014
- INTEGRAL TECHNOLOGY, INC.
- Christopher A Hunrath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF
- Publication number 20140036463
- Publication date Feb 6, 2014
- GENERAL ELECTRIC COMPANY
- David Mulford Shaddock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC HEATING OF SILVER GRIDS
- Publication number 20130196269
- Publication date Aug 1, 2013
- Donald R. Preuss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AN...
- Publication number 20130146335
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Jeffrey P. Gambino
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF PROCESSING SOLDER BUMP BY VACUUM ANNEALING
- Publication number 20130143364
- Publication date Jun 6, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Jen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKING TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID
- Publication number 20130134996
- Publication date May 30, 2013
- Mitchell Stewart Burberry
- G02 - OPTICS
Information Patent Application
TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE
- Publication number 20130135548
- Publication date May 30, 2013
- Mitchell Stewart Burberry
- G02 - OPTICS
Information Patent Application
Methods of Forming Through-Substrate Vias
- Publication number 20130075268
- Publication date Mar 28, 2013
- Micron Technology, Inc.
- Luke G. England
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON MET...
- Publication number 20110311718
- Publication date Dec 22, 2011
- E.I. du Pont de Nemours and Company
- Cengiz Ahmet Palanduz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of the film substrate, a method of the semiconductor device...
- Publication number 20060079026
- Publication date Apr 13, 2006
- Tsutomu Matsuhira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Strain-resistant electrical connection
- Publication number 20050230148
- Publication date Oct 20, 2005
- Jay C. Sinnett
- B60 - VEHICLES IN GENERAL
Information Patent Application
Graduated stiffness for electrical connections in tires
- Publication number 20050231343
- Publication date Oct 20, 2005
- MICHELIN Recherche et Technique S.A.
- Jay C. Sinnett
- B60 - VEHICLES IN GENERAL
Information Patent Application
Preconditioning via plug material for a via-in-pad ball grid array...
- Publication number 20040089700
- Publication date May 13, 2004
- Daryl Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Thermal treatment leading to a different chemical state of a material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wiring board and method for manufacturing wiring board

Hermetic metallized via with improved reliability

Insulated circuit board

Flexible laminated board and multilayer circuit board

Substrate for high-frequency printed wiring board

Glass circuit board and stress relief layer

Hermetic metallized via with improved reliability

Method of forming a metal silicide transparent conductive electrode

Hermetic metallized via with improved reliability

Method of forming a metal silicide transparent conductive electrode

Conductive graphene interfacial barriers for liquid metal electronics

High-speed interconnects for printed circuit boards

Wiring substrate

Doped, low-temperature co-fired glass-ceramic (LTCC) insulating sub...

Method of processing solder bump by vacuum annealing

Substrates for stretchable electronics and method of manufacture

Substrate with transparent electrode and method for manufacturing same

Circuit board and method for manufacturing same

Substrate for high-frequency printed wiring board

Wiring substrate

Method of forming a metal silicide transparent conductive electrode

Method for producing substrate with transparent electrode, and subs...

High-speed interconnects for printed circuit boards

Fabrication of intra-structure conductive traces and interconnects...

Two-step, direct-write laser metallization

Substrate with transparent electrode and method for manufacturing same

One up, one down connection structure for piezoelectric device in t...

Flexible printed circuits with bend retention structures

Methods for assembling electronic devices with adhesive

Structures for z-axis interconnection of multilayer electronic subs...

Patents Applicationslast 30 patents

WIRING BOARD

METHOD FOR FABRICATING ELECTRONIC CIRCUIT AND METAL ION SOLUTION

INSULATED CIRCUIT BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD

GLASS CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME

CONDUCTIVE GRAPHENE INTERFACIAL BARRIERS FOR LIQUID METAL ELECTRONICS

WIRING SUBSTRATE

SUBSTRATE FOR HIGH-FREQUENCY PRINTED WIRING BOARD

Method of forming a metal silicide transparent conductive electrode

Method of forming a metal silicide transparent conductive electrode

HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS

SUBSTRATE WITH TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME

GLASS SUBSTRATE ASSEMBLIES HAVING LOW DIELECTRIC PROPERTIES

METHOD OF FABRICATING HEAT DISSIPATING BOARD

POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...

OPTICAL COMMUNICATION MODULE AND METHOD FOR ASSEMBLING SAME

STRUCTURES FOR Z-AXIS INTERCONNECTION OF MULTILAYER ELECTRONIC SUBS...

ELECTRONIC CIRCUIT BOARD, ASSEMBLY AND A RELATED METHOD THEREOF

PHOTONIC HEATING OF SILVER GRIDS

STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AN...

METHOD OF PROCESSING SOLDER BUMP BY VACUUM ANNEALING

MAKING TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID

TRANSPARENT CAPACITOR WITH MULTI-LAYER GRID STRUCTURE

Methods of Forming Through-Substrate Vias

METHOD OF MANUFACTURING THIN-FILM DIELECTRICS AND CAPACITORS ON MET...

Method of the film substrate, a method of the semiconductor device...

Strain-resistant electrical connection

Graduated stiffness for electrical connections in tires

Preconditioning via plug material for a via-in-pad ball grid array...