Thermoplastic polymer

Industry

CPC
H05K2201/0129

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0129Thermoplastic polymer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electrically conductive film
- Patent number 12,177,967
- Issue date Dec 24, 2024
- Gentherm GmbH
- Martin Schaetzle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 12,167,545
- Issue date Dec 10, 2024
- Murata Manufacturing Co., Ltd.
- Takayuki Shimamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 12,160,949
- Issue date Dec 3, 2024
- FUJIFILM Corporation
- Genya Tanaka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method therefor
- Patent number 12,101,891
- Issue date Sep 24, 2024
- Avary Holding (Shenzhen) Co., Limited.
- Chao Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preventing liquid ingress in a device
- Patent number 12,101,887
- Issue date Sep 24, 2024
- Koninklijke Philips N.V.
- Marinus Arnoldus Martinus Vugts
- F21 - LIGHTING
Information Patent Grant
Flexible and stretchable structures
- Patent number 12,096,563
- Issue date Sep 17, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-coated liquid-crystal polymer film
- Patent number 12,089,327
- Issue date Sep 10, 2024
- Kuraray Co., Ltd.
- Kikuo Arimoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic component on flexible substrate
- Patent number 12,069,808
- Issue date Aug 20, 2024
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Margaretha Maria De Kok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer board and manufacturing method thereof
- Patent number 12,058,811
- Issue date Aug 6, 2024
- AZOTEK CO., LTD.
- Hung-Jung Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structure
- Patent number 12,035,467
- Issue date Jul 9, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work vehicle systems including multilayer wiring panels
- Patent number 11,987,187
- Issue date May 21, 2024
- Deere & Company
- Kunal Gupta
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Protection tape for printed circuit board and display device includ...
- Patent number 11,987,031
- Issue date May 21, 2024
- Samsung Display Co., Ltd.
- Jun Namkung
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating a substrate with metal reflection layer
- Patent number 11,979,980
- Issue date May 7, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing electronics assembly
- Patent number 11,950,367
- Issue date Apr 2, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical chips mounted on a deformed carrier
- Patent number 11,942,572
- Issue date Mar 26, 2024
- OSRAM OLED GmbH
- Siegfried Herrmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive leadwire for physiological patient monitoring
- Patent number 11,931,177
- Issue date Mar 19, 2024
- General Electric Company
- Jussi Halinen
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for manufacturing a substrate structure with high reflectance
- Patent number 11,937,370
- Issue date Mar 19, 2024
- UNIFLEX Technology Inc.
- Cheng-I Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illuminated multilayer structure with embedded light sources
- Patent number 11,934,004
- Issue date Mar 19, 2024
- TACTOTEK OY
- Antti Keränen
- G02 - OPTICS
Information Patent Grant
Thermoplastic composition for laser direct structuring
- Patent number 11,912,863
- Issue date Feb 27, 2024
- MEP EUROPE B.V.
- Bernardus Antonius Gerardus Schrauwen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for manufacturing electronics assembly and electronics assembly
- Patent number 11,910,530
- Issue date Feb 20, 2024
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Organic insulating body, metal-clad laminate, and wiring board
- Patent number 11,879,049
- Issue date Jan 23, 2024
- Kyocera Corporation
- Satoshi Kajita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoplastic liquid crystal polymer film and circuit board using same
- Patent number 11,877,395
- Issue date Jan 16, 2024
- Kuraray Co., Ltd.
- Minoru Onodera
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer resin substrate and method of manufacturing multilayer r...
- Patent number 11,856,713
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Masanori Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect, an electronic assembly and a method for manufacturing...
- Patent number 11,856,692
- Issue date Dec 26, 2023
- Imec VZW
- Steven Nagels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional molded circuit component
- Patent number 11,839,023
- Issue date Dec 5, 2023
- MAXELL, LTD.
- Atsushi Yusa
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS
- Publication number 20250048548
- Publication date Feb 6, 2025
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...
- Publication number 20250031317
- Publication date Jan 23, 2025
- JCET STATS ChipPAC Korea Limited
- SeungHyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD
- Publication number 20250024596
- Publication date Jan 16, 2025
- Sumitomo Electric Industries, Ltd.
- Ryo IRIGUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240341036
- Publication date Oct 10, 2024
- Darwin Precisions Corporation
- Yi Feng Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Glass Bubbles and Articles Therefrom
- Publication number 20240327270
- Publication date Oct 3, 2024
- 3M Innovative Properties Company
- Yong K. Wu
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240324100
- Publication date Sep 26, 2024
- AZOTEK CO., LTD.
- Hung-Jung LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...
- Publication number 20240300208
- Publication date Sep 12, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jun NAMKUNG
- B32 - LAYERED PRODUCTS
Information Patent Application
Method for preparing novel material layer structure of circuit boar...
- Publication number 20240284599
- Publication date Aug 22, 2024
- LongKai LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20240237218
- Publication date Jul 11, 2024
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SHEET, SENSOR SHEET, AND COATING FILM-FORMING COMPOSITION
- Publication number 20240182743
- Publication date Jun 6, 2024
- SEKISUI POLYMATECH CO., LTD.
- Shinichi Tomooka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...
- Publication number 20240064907
- Publication date Feb 22, 2024
- FICT LIMITED
- Taiji Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...
- Publication number 20240032191
- Publication date Jan 25, 2024
- Denka Company Limited
- Yusuke MASUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240008168
- Publication date Jan 4, 2024
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230389184
- Publication date Nov 30, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20230371188
- Publication date Nov 16, 2023
- Denka Company Limited
- Shun UCHIYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Structure
- Publication number 20230354515
- Publication date Nov 2, 2023
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Articles and Structures with Laser Breakable and Platable Compounds
- Publication number 20230340226
- Publication date Oct 26, 2023
- SHPP Global Technologies B.V.
- Yunan CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY
- Publication number 20230309231
- Publication date Sep 28, 2023
- TactoTek Oy
- Vinski BRÄYSY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...
- Publication number 20230300988
- Publication date Sep 21, 2023
- Dätwyler Schweiz AG
- Ronny VRIJENS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE
- Publication number 20230284381
- Publication date Sep 7, 2023
- Murata Manufacturing Co., Ltd.
- Kosuke NISHIO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND CONNECTION STRUCTURE MANUFACTURING METHOD
- Publication number 20230262895
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...
- Publication number 20230262876
- Publication date Aug 17, 2023
- Murata Manufacturing Co., Ltd.
- Mineto MITSUHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20230247779
- Publication date Aug 3, 2023
- IRISO Electronics Co., Ltd.
- Yujiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS, ROBOT, AND MOTION STAGE
- Publication number 20230247766
- Publication date Aug 3, 2023
- SEIKO EPSON CORPORATION
- Mitsumi KISHIDA
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Method for manufacturing a component
- Publication number 20230209703
- Publication date Jun 29, 2023
- Scio Holding GmbH
- Marius Sillmann
- B60 - VEHICLES IN GENERAL
Information Patent Application
STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...
- Publication number 20230189444
- Publication date Jun 15, 2023
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20230118261
- Publication date Apr 20, 2023
- Murata Manufacturing Co., Ltd.
- Takayuki SHIMAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, SINGLE-SIDED METAL-CLAD LAMINATED SHEET, AND MULTI-LAYER...
- Publication number 20230106839
- Publication date Apr 6, 2023
- Kaneka Corporation
- Kanji Shimoosako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS

Thermoplastic polymer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electrically conductive film

Multilayer substrate

Wiring board and method for manufacturing wiring board

Bent laminated printed circuit board

Circuit board and manufacturing method therefor

Preventing liquid ingress in a device

Flexible and stretchable structures

Metal-coated liquid-crystal polymer film

Electronic component on flexible substrate

Multilayer board and manufacturing method thereof

Resin multilayer substrate

Laminated component carrier with a thermoplastic structure

Circuit structure

Work vehicle systems including multilayer wiring panels

Protection tape for printed circuit board and display device includ...

Method of fabricating a substrate with metal reflection layer

Multilayer resin substrate, and method of manufacturing multilayer...

Method for manufacturing electronics assembly

Optical chips mounted on a deformed carrier

Capacitive leadwire for physiological patient monitoring

Method for manufacturing a substrate structure with high reflectance

Illuminated multilayer structure with embedded light sources

Thermoplastic composition for laser direct structuring

Method for manufacturing electronics assembly and electronics assembly

Structure for embedding and packaging multiple devices by layer and...

Organic insulating body, metal-clad laminate, and wiring board

Thermoplastic liquid crystal polymer film and circuit board using same

Multilayer resin substrate and method of manufacturing multilayer r...

Interconnect, an electronic assembly and a method for manufacturing...

Three-dimensional molded circuit component

Patents Applicationslast 30 patents

ULTRATHIN COMPOSITE DIELECTRICS FOR USE IN PRINTED CIRCUIT BOARDS

METHOD FOR MOUNTING AN ELECTRONIC DEVICE ON A FLEXIBLE SUBSTRATE AN...

SUBSTRATE FOR PRINTED WIRING BOARD

ELECTRONIC DEVICE

Glass Bubbles and Articles Therefrom

MULTILAYER BOARD AND MANUFACTURING METHOD THEREOF

PROTECTION TAPE FOR PRINTED CIRCUIT BOARD AND DISPLAY DEVICE INCLUD...

Method for preparing novel material layer structure of circuit boar...

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

CIRCUIT SHEET, SENSOR SHEET, AND COATING FILM-FORMING COMPOSITION

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRON...

LCP EXTRUDED FILM AND METHOD FOR MANUFACTURING THE SAME, LCP EXTRUD...

CIRCUIT BOARD

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

INSULATING MATERIAL FOR CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTU...

Circuit Structure

Articles and Structures with Laser Breakable and Platable Compounds

METHOD FOR MANUFACTURING ELECTRONICS ASSEMBLY AND ELECTRONICS ASSEMBLY

METHOD FOR PRODUCING AN ELASTOMERIC COMPONENT COMPRISING A PRINTED...

MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

CONNECTION STRUCTURE AND CONNECTION STRUCTURE MANUFACTURING METHOD

RESIN FILM WITH CONDUCTOR LAYER, MULTILAYER SUBSTRATE, AND METHOD F...

ELECTRICAL DEVICE

ELECTRONIC APPARATUS, ROBOT, AND MOTION STAGE

Method for manufacturing a component

STRUCTURE FOR EMBEDDING AND PACKAGING MULTIPLE DEVICES BY LAYER AND...

MULTILAYER SUBSTRATE

LAMINATE, SINGLE-SIDED METAL-CLAD LAMINATED SHEET, AND MULTI-LAYER...

Laminated Component Carrier With a Thermoplastic Structure