Thick film resistors

Industry

CPC
H01C7/003

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Parent Industries

HELECTRICITY H01Electric elements H01CRESISTORS H01C7/00Non-adjustable resistors formed as one or more layers or coatings Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material

Current Industry

H01C7/003Thick film resistors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Thick film resistor paste, thick film resistor, and electronic comp...
- Patent number 12,249,447
- Issue date Mar 11, 2025
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film resistor paste, thick film resistor, and electronic comp...
- Patent number 12,024,466
- Issue date Jul 2, 2024
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive material, resistor, and manufacturing method of resistive...
- Patent number 11,965,228
- Issue date Apr 23, 2024
- Koa Corporation
- Shuhei Matsubara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chip resistor and method of manufacturing chip resistor
- Patent number 11,967,443
- Issue date Apr 23, 2024
- KOA Corporation
- Taro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensor element
- Patent number 11,885,694
- Issue date Jan 30, 2024
- Sumitomo Chemical Company, Limited
- Megumi Hayasaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor component
- Patent number 11,862,365
- Issue date Jan 2, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jang Suk Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor component
- Patent number 11,830,641
- Issue date Nov 28, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ah Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free glass paste, chip resistor and method for producing same
- Patent number 11,802,076
- Issue date Oct 31, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hongkun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor and method for manufacturing chip resistor
- Patent number 11,798,714
- Issue date Oct 24, 2023
- KOA Corporation
- Naoto Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor structure
- Patent number 11,688,533
- Issue date Jun 27, 2023
- Cyntec Co., Ltd.
- Hsiu-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip component
- Patent number 11,657,932
- Issue date May 23, 2023
- Koa Corporation
- Naoto Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor and method of manufacturing chip resistor
- Patent number 11,646,136
- Issue date May 9, 2023
- KOA Corporation
- Homare Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor component for surface mounting on a printed circuit board...
- Patent number 11,547,000
- Issue date Jan 3, 2023
- HERAEUS NEXENSOS GMBH
- Stephan Urfels
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain gauge
- Patent number 11,499,877
- Issue date Nov 15, 2022
- MINEBEA MITSUMI INC.
- Eiji Misaizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain gauge and sensor module
- Patent number 11,499,876
- Issue date Nov 15, 2022
- MINEBEA MITSUMI INC.
- Satoshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain gauge
- Patent number 11,460,359
- Issue date Oct 4, 2022
- MINEBEA MITSUMI INC.
- Eiji Misaizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain gauge and sensor module
- Patent number 11,460,358
- Issue date Oct 4, 2022
- MINEBEA MITSUMI INC.
- Satoshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor
- Patent number 11,315,708
- Issue date Apr 26, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kwang Hyun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor
- Patent number 11,244,774
- Issue date Feb 8, 2022
- Koa Corporation
- Masaki Miyagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulated inductance module
- Patent number 11,201,007
- Issue date Dec 14, 2021
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Temperature sensors
- Patent number 11,199,456
- Issue date Dec 14, 2021
- Hewlett-Packard Development Company, L.P.
- Kevin P DeKam
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resistor component
- Patent number 11,139,092
- Issue date Oct 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hyung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor component
- Patent number 11,139,091
- Issue date Oct 5, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ah Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick film resistors having customizable resistances and methods of...
- Patent number 11,107,610
- Issue date Aug 31, 2021
- Raytheon Company
- Erika C. Klek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor component
- Patent number 11,094,436
- Issue date Aug 17, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Sook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite electronic component, composite electronic component pack...
- Patent number 10,991,513
- Issue date Apr 27, 2021
- Taiyo Yuden Co., Ltd.
- Shin Aida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip resistor
- Patent number 10,964,457
- Issue date Mar 30, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiko Izawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste having excellent low-temperature sinterability and meth...
- Patent number 10,940,534
- Issue date Mar 9, 2021
- Tanaka Kikinzoku Kogyo K.K.
- Teruhisa Iwai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Resistor, circuit board, and electronic device
- Patent number 10,923,252
- Issue date Feb 16, 2021
- Kyocera Corporation
- Shodai Takayoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistor component
- Patent number 10,923,253
- Issue date Feb 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Gwang Hyeon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE COMPONENT MODULE
- Publication number 20240297112
- Publication date Sep 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester Ankamah-Kusi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR
- Publication number 20240212890
- Publication date Jun 27, 2024
- ROHM CO., LTD.
- Takanori SHINOURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE FOR CHIP COMPONENT
- Publication number 20240096926
- Publication date Mar 21, 2024
- KOA Corporation
- Yasushi AKAHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20240049399
- Publication date Feb 8, 2024
- KOA Corporation
- Yasushi AKAHANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...
- Publication number 20230271874
- Publication date Aug 31, 2023
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR COMPONENT
- Publication number 20230260682
- Publication date Aug 17, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Jang Suk Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...
- Publication number 20230167011
- Publication date Jun 1, 2023
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...
- Publication number 20230170114
- Publication date Jun 1, 2023
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...
- Publication number 20230162896
- Publication date May 25, 2023
- Sumitomo Metal Mining Co., Ltd.
- Masaki Ando
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR STRUCTURE
- Publication number 20230134039
- Publication date May 4, 2023
- CYNTEC CO., LTD.
- Hsiu-Yu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR AND METHOD OF MANUFACTURING CHIP RESISTOR
- Publication number 20230133764
- Publication date May 4, 2023
- KOA CORPORATION
- Taro KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP COMPONENT
- Publication number 20220399140
- Publication date Dec 15, 2022
- KOA CORPORATION
- Naoto OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR AND METHOD FOR MANUFACTURING CHIP RESISTOR
- Publication number 20220399143
- Publication date Dec 15, 2022
- KOA CORPORATION
- Naoto OKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR AND METHOD OF MANUFACTURING CHIP RESISTOR
- Publication number 20220319745
- Publication date Oct 6, 2022
- KOA Corporation
- Homare SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR COMPONENT
- Publication number 20220270790
- Publication date Aug 25, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Ah Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Adhesion Resistive Composition
- Publication number 20220238261
- Publication date Jul 28, 2022
- FERRO CORPORATION
- Ponnusamy Palanisamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTIVE MATERIAL, RESISTOR, AND MANUFACTURING METHOD OF RESISTIVE...
- Publication number 20220157497
- Publication date May 19, 2022
- KOA Corporation
- Shuhei Matsubara
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING A LAYER STRUCTURE USING A PASTE ON THE BASIS O...
- Publication number 20220051834
- Publication date Feb 17, 2022
- ISABELLENHUTTE HEUSLER GMBH & CO. KG
- Jochen Langer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE GLASS PASTE, CHIP RESISTOR AND METHOD FOR PRODUCING SAME
- Publication number 20220024808
- Publication date Jan 27, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongkun SHEN
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
RESISTOR COMPONENT FOR MOUNTING ON THE SURFACE OF A PRINTED CIRCUIT...
- Publication number 20210307178
- Publication date Sep 30, 2021
- Heraeus Nexensos GmbH
- Stephan URFELS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR COMPONENT
- Publication number 20210202137
- Publication date Jul 1, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Ji Sook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR COMPONENT
- Publication number 20210193353
- Publication date Jun 24, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Min Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR
- Publication number 20210183543
- Publication date Jun 17, 2021
- KOA Corporation
- Masaki MIYAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR COMPONENT
- Publication number 20210183544
- Publication date Jun 17, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Ah Ra Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIN GAUGE
- Publication number 20210063259
- Publication date Mar 4, 2021
- MINEBEA MITSUMI INC.
- Eiji MISAIZU
- G01 - MEASURING TESTING
Information Patent Application
STRAIN GAUGE AND SENSOR MODULE
- Publication number 20210063258
- Publication date Mar 4, 2021
- MINEBEA MITSUMI INC.
- Satoshi SATO
- G01 - MEASURING TESTING
Information Patent Application
THICK FILM RESISTORS HAVING CUSTOMIZABLE RESISTANCES AND METHODS OF...
- Publication number 20200365300
- Publication date Nov 19, 2020
- Raytheon Company
- Erika C. Klek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM OXIDE POWDER, THICK FILM RESISTOR COMPOSITION, THICK FILM...
- Publication number 20200365299
- Publication date Nov 19, 2020
- Sumitomo Metal Mining Co., Ltd.
- Katsuhiro KAWAKUBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP RESISTOR
- Publication number 20200343025
- Publication date Oct 29, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIKO IZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULATED INDUCTANCE MODULE
- Publication number 20200328022
- Publication date Oct 15, 2020
- L. Pierre de Rochemont
- B82 - NANO-TECHNOLOGY

Thick film resistors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Thick film resistor paste, thick film resistor, and electronic comp...

Thick film resistor paste, thick film resistor, and electronic comp...

Resistive material, resistor, and manufacturing method of resistive...

Chip resistor and method of manufacturing chip resistor

Temperature sensor element

Resistor component

Chip resistor component

Lead-free glass paste, chip resistor and method for producing same

Chip resistor and method for manufacturing chip resistor

Chip resistor structure

Chip component

Chip resistor and method of manufacturing chip resistor

Resistor component for surface mounting on a printed circuit board...

Strain gauge

Strain gauge and sensor module

Strain gauge

Strain gauge and sensor module

Chip resistor

Resistor

Modulated inductance module

Temperature sensors

Resistor component

Resistor component

Thick film resistors having customizable resistances and methods of...

Resistor component

Composite electronic component, composite electronic component pack...

Chip resistor

Metal paste having excellent low-temperature sinterability and meth...

Resistor, circuit board, and electronic device

Resistor component

Patents Applicationslast 30 patents

PASSIVE COMPONENT MODULE

CHIP RESISTOR

MOUNTING STRUCTURE FOR CHIP COMPONENT

CHIP COMPONENT

THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...

RESISTOR COMPONENT

THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...

THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...

THICK FILM RESISTOR PASTE, THICK FILM RESISTOR, AND ELECTRONIC COMP...

CHIP RESISTOR STRUCTURE

CHIP RESISTOR AND METHOD OF MANUFACTURING CHIP RESISTOR

CHIP COMPONENT

CHIP RESISTOR AND METHOD FOR MANUFACTURING CHIP RESISTOR

CHIP RESISTOR AND METHOD OF MANUFACTURING CHIP RESISTOR

CHIP RESISTOR COMPONENT

High Adhesion Resistive Composition

RESISTIVE MATERIAL, RESISTOR, AND MANUFACTURING METHOD OF RESISTIVE...

METHOD FOR PRODUCING A LAYER STRUCTURE USING A PASTE ON THE BASIS O...

LEAD-FREE GLASS PASTE, CHIP RESISTOR AND METHOD FOR PRODUCING SAME

RESISTOR COMPONENT FOR MOUNTING ON THE SURFACE OF A PRINTED CIRCUIT...

RESISTOR COMPONENT

RESISTOR COMPONENT

RESISTOR

RESISTOR COMPONENT

STRAIN GAUGE

STRAIN GAUGE AND SENSOR MODULE

THICK FILM RESISTORS HAVING CUSTOMIZABLE RESISTANCES AND METHODS OF...

RUTHENIUM OXIDE POWDER, THICK FILM RESISTOR COMPOSITION, THICK FILM...

CHIP RESISTOR

MODULATED INDUCTANCE MODULE