to produce devices, each consisting of a single circuit element

Industry

CPC
H01L21/782

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/782to produce devices, each consisting of a single circuit element

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure
- Patent number 11,855,007
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 11,488,933
- Issue date Nov 1, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,348,879
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device comprising a paste la...
- Patent number 11,329,021
- Issue date May 10, 2022
- Infineon Technologies AG
- Francisco Javier Santos Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating packaged integrated circuits and resulting s...
- Patent number 10,964,595
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated semiconductor tri-gate and split dual-gate FinFET...
- Patent number 10,923,399
- Issue date Feb 16, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- DeYuan Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package comprising the same
- Patent number 10,886,234
- Issue date Jan 5, 2021
- Samsung Electronics Co., Ltd.
- Jun Ho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cutting element chip by laser scribing
- Patent number 10,818,553
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 10,818,612
- Issue date Oct 27, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming embedded wafer level chi...
- Patent number 10,777,528
- Issue date Sep 15, 2020
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Washable mold for conformable layer formation on semiconductor devices
- Patent number 10,326,040
- Issue date Jun 18, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 10,276,514
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating packaged integrated circuits and resulting s...
- Patent number 10,269,640
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress-resilient chip structure and dicing process
- Patent number 10,211,175
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device
- Patent number 10,211,372
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Jin Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated semiconductor tri-gate and split dual-gate FinFET...
- Patent number 9,922,878
- Issue date Mar 20, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- De Yuan Xiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged wafer manufacturing method and device chip manufacturing m...
- Patent number 9,892,986
- Issue date Feb 13, 2018
- Disco Corporation
- Hideki Koshimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective (wafer-scale) fabrication of electronic devic...
- Patent number 9,870,947
- Issue date Jan 16, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,564,366
- Issue date Feb 7, 2017
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Using a double-cut for mechanical protection of a wafer-level chip...
- Patent number 9,245,804
- Issue date Jan 26, 2016
- NXP B.V.
- Christian Zenz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,721
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 9,202,720
- Issue date Dec 1, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Protection of a wafer-level chip scale package (WLCSP)
- Patent number 9,196,537
- Issue date Nov 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for singulating a component composite assembly
- Patent number 9,165,816
- Issue date Oct 20, 2015
- Osram Opto Semiconductors GmbH
- Heribert Zull
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test line placement to improve die sawing quality
- Patent number 8,993,355
- Issue date Mar 31, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,980,764
- Issue date Mar 17, 2015
- Plasma-Therm LLC
- Linnell Martinez
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating semiconductor dice by separating a substrate...
- Patent number 8,921,204
- Issue date Dec 30, 2014
- SemiLEDs Optoelectronics Co., Ltd.
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,865,567
- Issue date Oct 21, 2014
- Fuji Electric Co., Ltd.
- Akira Tamenori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plasma dicing a semi-conductor wafer
- Patent number 8,691,702
- Issue date Apr 8, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for fabricating array-molded package-on-package
- Patent number 8,574,967
- Issue date Nov 5, 2013
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230154797
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Seonghyun Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD
- Publication number 20230142363
- Publication date May 11, 2023
- Disco Corporation
- Hayato IGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20230012958
- Publication date Jan 19, 2023
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220254737
- Publication date Aug 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIPS AND TAPE STICKING APPARATUS
- Publication number 20220246461
- Publication date Aug 4, 2022
- Disco Corporation
- Shuzo MITANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDING METHOD AND DIVIDING APPARATUS
- Publication number 20220238379
- Publication date Jul 28, 2022
- Disco Corporation
- Kenji FURUTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID INTEGRATED SEMICONDUCTOR TRI-GATE AND SPLIT DUAL-GATE FINFET...
- Publication number 20210134675
- Publication date May 6, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20210013159
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Rung-De Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Embedded Wafer Level Chi...
- Publication number 20200335478
- Publication date Oct 22, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Singulating Packaged Integrated Circuits and Resulting S...
- Publication number 20190244861
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Ping Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
- Publication number 20190013243
- Publication date Jan 10, 2019
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE
- Publication number 20180286704
- Publication date Oct 4, 2018
- Intel Corporation
- Elizabeth M. Nofen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTEGRATED SEMICONDUCTOR TRI-GATE AND SPLIT DUAL-GATE FINFET...
- Publication number 20180174909
- Publication date Jun 21, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- DE YUAN XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...
- Publication number 20180005889
- Publication date Jan 4, 2018
- STMicroelectronics (Grenoble 2) SAS
- Didier Campos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS
- Publication number 20140151879
- Publication date Jun 5, 2014
- Disco Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20140154869
- Publication date Jun 5, 2014
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140138855
- Publication date May 22, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...
- Publication number 20140110842
- Publication date Apr 24, 2014
- NXP B.V.
- Christian ZENZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SINGULATING A COMPONENT COMPOSITE ASSEMBLY
- Publication number 20140080287
- Publication date Mar 20, 2014
- Osram Opto Semiconductors GmbH
- Heribert Zull
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Array-Molded Package-on-Package
- Publication number 20140030851
- Publication date Jan 30, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test Line Placement to Improve Die Sawing Quality
- Publication number 20130316471
- Publication date Nov 28, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DICE BY SEPARATING A SUBSTRATE...
- Publication number 20130302926
- Publication date Nov 14, 2013
- Chen-Fu Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
- Publication number 20130240919
- Publication date Sep 19, 2013
- VERTICLE, INC.
- Moo Keun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230968
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230972
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Chris Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230969
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230971
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Dwarakanath Geerpuram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
- Publication number 20130230970
- Publication date Sep 5, 2013
- Plasma-Therm LLC
- Linnell Martinez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20130203238
- Publication date Aug 8, 2013
- Fuji Electric Co., Ltd.
- Akira Tamenori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating Array-Molded Package-on-Package
- Publication number 20130189814
- Publication date Jul 25, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS

to produce devices, each consisting of a single circuit element

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure

Semiconductor device and method of forming embedded wafer level chi...

Semiconductor structure

Method for fabricating a semiconductor device comprising a paste la...

Method for singulating packaged integrated circuits and resulting s...

Hybrid integrated semiconductor tri-gate and split dual-gate FinFET...

Semiconductor device and semiconductor package comprising the same

Method for cutting element chip by laser scribing

Manufacturing method of semiconductor structure

Semiconductor device and method of forming embedded wafer level chi...

Washable mold for conformable layer formation on semiconductor devices

Semiconductor structure and manufacturing method thereof

Method for singulating packaged integrated circuits and resulting s...

Stress-resilient chip structure and dicing process

Semiconductor light emitting device

Hybrid integrated semiconductor tri-gate and split dual-gate FinFET...

Packaged wafer manufacturing method and device chip manufacturing m...

Method for collective (wafer-scale) fabrication of electronic devic...

Method and apparatus for plasma dicing a semi-conductor wafer

Using a double-cut for mechanical protection of a wafer-level chip...

Method and apparatus for plasma dicing a semi-conductor wafer

Method and apparatus for plasma dicing a semi-conductor wafer

Protection of a wafer-level chip scale package (WLCSP)

Method for singulating a component composite assembly

Test line placement to improve die sawing quality

Method and apparatus for plasma dicing a semi-conductor wafer

Method for fabricating semiconductor dice by separating a substrate...

Method of manufacturing semiconductor device

Method and apparatus for plasma dicing a semi-conductor wafer

Method for fabricating array-molded package-on-package

Patents Applicationslast 30 patents

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES

PROCESSING METHOD

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

SEMICONDUCTOR STRUCTURE

MANUFACTURING METHOD OF CHIPS AND TAPE STICKING APPARATUS

WAFER DIVIDING METHOD AND DIVIDING APPARATUS

HYBRID INTEGRATED SEMICONDUCTOR TRI-GATE AND SPLIT DUAL-GATE FINFET...

SEMICONDUCTOR STRUCTURE

Semiconductor Device and Method of Forming Embedded Wafer Level Chi...

Method for Singulating Packaged Integrated Circuits and Resulting S...

METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER

PROCESSES AND METHODS FOR APPLYING UNDERFILL TO SINGULATED DIE

HYBRID INTEGRATED SEMICONDUCTOR TRI-GATE AND SPLIT DUAL-GATE FINFET...

METHOD FOR COLLECTIVE (WAFER-SCALE) FABRICATION OF ELECTRONIC DEVIC...

STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESS

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...

METHOD FOR SINGULATING A COMPONENT COMPOSITE ASSEMBLY

Method for Fabricating Array-Molded Package-on-Package

Test Line Placement to Improve Die Sawing Quality

METHOD FOR FABRICATING SEMICONDUCTOR DICE BY SEPARATING A SUBSTRATE...

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

Method and Apparatus for Plasma Dicing a Semi-conductor Wafer

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for Fabricating Array-Molded Package-on-Package