Tool for a process not provided for in H05K3/00

Industry

CPC
H05K2203/0195

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0195Tool for a process not provided for in H05K3/00

Industries

Patents Grantslast 30 patents

Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring micro device on curved surface and apparatu...
- Patent number 12,127,349
- Issue date Oct 22, 2024
- Korea Institute of Machinery & Materials
- Bongkyun Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for creating orthogonal solder interconnects
- Patent number 12,108,542
- Issue date Oct 1, 2024
- Raytheon Company
- Justin A. Kasemodel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for manufacturing composite substrate
- Patent number 12,082,348
- Issue date Sep 3, 2024
- Doosan Corporation
- Sungmoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Positioning fixture
- Patent number 11,865,674
- Issue date Jan 9, 2024
- Pegatron Corporation
- Chun-Nan Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electrical element, method of preparing an electrical element for a...
- Patent number 11,864,321
- Issue date Jan 2, 2024
- TE Connectivity Germany GmbH
- Rudi Blumenschein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies and methods of manufacturing electronics ass...
- Patent number 11,710,676
- Issue date Jul 25, 2023
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal body formed on a component carrier by additive manufacturing
- Patent number 11,659,648
- Issue date May 23, 2023
- AT&S Austria Technologie & Systemtechnik AG
- Marco Gavagnin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System for creating interconnections between a substrate and electr...
- Patent number 11,606,864
- Issue date Mar 14, 2023
- SunRay Scientific, Inc.
- Andrew Stemmermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 11,575,816
- Issue date Feb 7, 2023
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- G02 - OPTICS
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,570,907
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable light with curved chip-on-board assembly
- Patent number 11,532,604
- Issue date Dec 20, 2022
- KNOG PTY LTD
- Malcolm McKechnie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Protective heat shields for thermally sensitive components and meth...
- Patent number 11,516,924
- Issue date Nov 29, 2022
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire fixation apparatus and soldering method
- Patent number 11,471,967
- Issue date Oct 18, 2022
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating Z-axis vertical launch
- Patent number 11,470,725
- Issue date Oct 11, 2022
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Camera module, molded circuit board assembly, molded photosensitive...
- Patent number 11,363,184
- Issue date Jun 14, 2022
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire embedding system with a curved delivery path
- Patent number 11,317,515
- Issue date Apr 26, 2022
- Board of Regents, The University of Texas System
- David Espalin
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for connecting surface-mount electronic components to a circ...
- Patent number 11,317,517
- Issue date Apr 26, 2022
- PulseForge Incorporated
- Rudresh Ghosh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board interconnection and methods
- Patent number 11,304,308
- Issue date Apr 12, 2022
- Metrospec Technology, LLC
- Henry V. Holec
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tool for shaping contact tab interconnects at a circuit card edge
- Patent number 11,245,238
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Timothy P. Younger
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Drilling template
- Patent number 11,246,222
- Issue date Feb 8, 2022
- Airbus Operations S.L.
- Alvaro Jara Rodelgo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for assembling screws into printed circuit board
- Patent number 11,197,378
- Issue date Dec 7, 2021
- HONG FU JIN PRECISION INDUSTRY (TAIYUAN) CO., LTD.
- Gang-Qiang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for assembling hook type heatsink
- Patent number 11,141,822
- Issue date Oct 12, 2021
- ARRIS Enterprises LLC
- Ti-Hsing Hsieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics assemblies and methods of manufacturing electronics ass...
- Patent number 11,114,361
- Issue date Sep 7, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fabricating Z-axis vertical launch within a printed c...
- Patent number 11,109,489
- Issue date Aug 31, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Manufacturing apparatus for display device and method of using the...
- Patent number 11,096,289
- Issue date Aug 17, 2021
- Samsung Display Co. Ltd.
- Jun Hee Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder gathering apparatus
- Patent number 11,052,399
- Issue date Jul 6, 2021
- ELITE MATERIAL CO., LTD.
- Hui-Ting Shih
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Grant
Reel-to-reel laser sintering methods and devices in FPC fabrication
- Patent number 11,026,333
- Issue date Jun 1, 2021
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES
- Publication number 20240284603
- Publication date Aug 22, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Eitan Ariel Caplan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240237198
- Publication date Jul 11, 2024
- CARUX TECHNOLOGY PTE. LTD.
- Chueh-Yuan Nien
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240120243
- Publication date Apr 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE
- Publication number 20240015893
- Publication date Jan 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Masayuki MANTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ETCHING DEVICE AND METHOD FOR IMPROVING ETCHING FACTOR
- Publication number 20230300989
- Publication date Sep 21, 2023
- TEMG TAI PCB MACHINERY CO., LTD.
- PATRICK LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR CREATING INTERCONNECTIONS BETWEEN A SUBSTRATE AND ELECTR...
- Publication number 20230189449
- Publication date Jun 15, 2023
- SunRay Scientific, Inc.
- Andrew Stemmermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Press-in machine for pressing components into a substrate, in parti...
- Publication number 20230139895
- Publication date May 4, 2023
- ERSA GMBH
- Kathrin Englert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...
- Publication number 20230086271
- Publication date Mar 23, 2023
- Flex Ltd.
- Zohair Mehkri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITIONING FIXTURE
- Publication number 20230049869
- Publication date Feb 16, 2023
- PEGATRON CORPORATION
- Chun-Nan Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SYSTEM AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
- Publication number 20220322536
- Publication date Oct 6, 2022
- Doosan Corporation
- Sungmoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR CONNECTING SURFACE-MOUNT ELECTRONIC COMPONENTS TO A CIRC...
- Publication number 20210392756
- Publication date Dec 16, 2021
- NCC NANO, LLC
- RUDRESH GHOSH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronics Assemblies and Methods of Manufacturing Electronics Ass...
- Publication number 20210384098
- Publication date Dec 9, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210368629
- Publication date Nov 25, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...
- Publication number 20210345497
- Publication date Nov 4, 2021
- Samsung Display Co. Ltd.
- Jun Hee LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...
- Publication number 20210337674
- Publication date Oct 28, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR TRANSFERRING MICRO DEVICE ON CURVED SURFACE AND APPARATU...
- Publication number 20210235588
- Publication date Jul 29, 2021
- Korea Institute of Machinery and Materials
- Bongkyun JANG
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication
- Publication number 20210092854
- Publication date Mar 25, 2021
- Manaflex, LLC
- Robert Clinton Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210051805
- Publication date Feb 18, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Electronics Assemblies and Methods of Manufacturing Electronics Ass...
- Publication number 20210043531
- Publication date Feb 11, 2021
- INTELLIGENT PLATFORMS, LLC
- Bernd Sporer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ASSEMBLING SCREWS INTO PRINTED CIRCUIT BOARD
- Publication number 20210014973
- Publication date Jan 14, 2021
- HONG FU JIN PRECISION INDUSTRY (TAIYUAN) CO., LTD.
- GANG-QIANG LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SERVER AND PRINTED CIRCUIT BOARD PRINTING METHOD
- Publication number 20200383212
- Publication date Dec 3, 2020
- HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO.,LTD.
- YAO-HUA GONG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MAINTAINING THE SHAPE OF A CIRCUIT BOARD
- Publication number 20200253041
- Publication date Aug 6, 2020
- Teradyne, Inc.
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REPAIRING DEFECTIVE THROUGH-HOLES
- Publication number 20200245469
- Publication date Jul 30, 2020
- International Business Machines Corporation
- Prabjit SINGH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING DEVICE FOR A DISPLAY PANEL AND BONDING METHOD FOR SAME
- Publication number 20200201086
- Publication date Jun 25, 2020
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Dingwei ZHANG
- B32 - LAYERED PRODUCTS
Information Patent Application
IMAGING UNIT AND ENDOSCOPE
- Publication number 20200163535
- Publication date May 28, 2020
- OLYMPUS CORPORATION
- Takanori SEKIDO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD FOR IMPROVED ELECTRONIC COMPONENT INTERCONNECTIONS
- Publication number 20200163225
- Publication date May 21, 2020
- SunRay Scientific, LLC
- Andrew Stemmermann
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK-DRILLED VIA PROBING TECHNIQUES
- Publication number 20200146194
- Publication date May 7, 2020
- International Business Machines Corporation
- LAYNE A. BERGE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire Fixation Apparatus And Soldering Method
- Publication number 20200114447
- Publication date Apr 16, 2020
- Tyco Electronics (Shanghai) Co. Ltd.
- Yingcong Deng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PLANARIZATION WITH IN-SITU SURFACE TOPOGRAPHY CONTROL AND MET...
- Publication number 20200078884
- Publication date Mar 12, 2020
- Intel Corporation
- Bai Nie
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Tool for a process not provided for in H05K3/00

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Maintaining the shape of a circuit board

Method for transferring micro device on curved surface and apparatu...

System and method for creating orthogonal solder interconnects

System and method for manufacturing composite substrate

Positioning fixture

Electrical element, method of preparing an electrical element for a...

Electronics assemblies and methods of manufacturing electronics ass...

Metal body formed on a component carrier by additive manufacturing

System for creating interconnections between a substrate and electr...

Camera module, molded circuit board assembly, molded photosensitive...

Manufacturing apparatus for display device and method of using the...

Portable light with curved chip-on-board assembly

Reel-to-reel lamination methods and devices in FPC fabrication

Protective heat shields for thermally sensitive components and meth...

Reel-to-reel laser ablation methods and devices in FPC fabrication

Wire fixation apparatus and soldering method

Method for fabricating Z-axis vertical launch

Camera module, molded circuit board assembly, molded photosensitive...

Wire embedding system with a curved delivery path

Method for connecting surface-mount electronic components to a circ...

Flexible circuit board interconnection and methods

Tool for shaping contact tab interconnects at a circuit card edge

Drilling template

Device for assembling screws into printed circuit board

System and method for assembling hook type heatsink

Electronics assemblies and methods of manufacturing electronics ass...

Apparatus for fabricating Z-axis vertical launch within a printed c...

Manufacturing apparatus for display device and method of using the...

Powder gathering apparatus

Reel-to-reel laser sintering methods and devices in FPC fabrication

Patents Applicationslast 30 patents

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

REMOVABLE LID FOR FLIP CHIP-BALL GRID ARRAY (FC-BGA) PACKAGES

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

MOUNTING BOARD MANUFACTURING METHOD AND FLUX COATING DEVICE

CIRCUIT BOARD ETCHING DEVICE AND METHOD FOR IMPROVING ETCHING FACTOR

SYSTEM FOR CREATING INTERCONNECTIONS BETWEEN A SUBSTRATE AND ELECTR...

Press-in machine for pressing components into a substrate, in parti...

PROTECTIVE HEAT SHIELDS FOR THERMALLY SENSITIVE COMPONENTS AND METH...

POSITIONING FIXTURE

SYSTEM AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE

METHOD FOR CONNECTING SURFACE-MOUNT ELECTRONIC COMPONENTS TO A CIRC...

Electronics Assemblies and Methods of Manufacturing Electronics Ass...

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

MANUFACTURING APPARATUS FOR DISPLAY DEVICE AND METHOD OF USING THE...

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...

METHOD FOR TRANSFERRING MICRO DEVICE ON CURVED SURFACE AND APPARATU...

Reel-to-Reel Laser Welding Methods and Devices in FPC Fabrication

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

Electronics Assemblies and Methods of Manufacturing Electronics Ass...

DEVICE FOR ASSEMBLING SCREWS INTO PRINTED CIRCUIT BOARD

SERVER AND PRINTED CIRCUIT BOARD PRINTING METHOD

MAINTAINING THE SHAPE OF A CIRCUIT BOARD

REPAIRING DEFECTIVE THROUGH-HOLES

BONDING DEVICE FOR A DISPLAY PANEL AND BONDING METHOD FOR SAME

IMAGING UNIT AND ENDOSCOPE

SYSTEM AND METHOD FOR IMPROVED ELECTRONIC COMPONENT INTERCONNECTIONS

BACK-DRILLED VIA PROBING TECHNIQUES

Wire Fixation Apparatus And Soldering Method

LASER PLANARIZATION WITH IN-SITU SURFACE TOPOGRAPHY CONTROL AND MET...