Transfer laminating of insulating material

Industry

CPC
H05K2203/066

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/066Transfer laminating of insulating material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Photosensitive dry film and uses of the same
- Patent number 11,353,791
- Issue date Jun 7, 2022
- Eternal Materials Co., Ltd.
- Tsung-Hsiu Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method for producing the same
- Patent number 10,869,389
- Issue date Dec 15, 2020
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Kohei Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,412,837
- Issue date Sep 10, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,368,449
- Issue date Jul 30, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Anisotropic conductive film and method of producing the same
- Patent number 10,306,771
- Issue date May 28, 2019
- Dexerials Corporation
- Kouichi Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing an electronic sticker
- Patent number 9,999,128
- Issue date Jun 12, 2018
- CHIBITRONICS PRIVATE LIMITED
- Andrew Shane Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive element, photosensitive element roll, method for pro...
- Patent number 9,971,244
- Issue date May 15, 2018
- Hitachi Chemical Company, Ltd.
- Naoki Sasahara
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,648,760
- Issue date May 9, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 9,526,168
- Issue date Dec 20, 2016
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wiring board
- Patent number 9,468,109
- Issue date Oct 11, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Fumito Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,313,886
- Issue date Apr 12, 2016
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 8,992,713
- Issue date Mar 31, 2015
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Grant
8956492
- Patent number 8,956,492
- Issue date Feb 17, 2015
- B32 - LAYERED PRODUCTS
Information Patent Grant
Plating target material, polyamic solution and polyimide resin solu...
- Patent number 8,889,250
- Issue date Nov 18, 2014
- Kaneka Corporation
- Kanji Shimoosako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interlayer dielectric film with carrier material and multilayer pri...
- Patent number 8,637,151
- Issue date Jan 28, 2014
- Sumitomo Bakelite Co., Ltd.
- Toyoaki Kishi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Substrate having internal capacitor and method of making same
- Patent number 8,607,445
- Issue date Dec 17, 2013
- Endicott Interconnect Technologies, Inc.
- Rabindra N. Das
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wiring board
- Patent number 8,561,293
- Issue date Oct 22, 2013
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin sheet for circuit board and production process therefor
- Patent number 8,535,782
- Issue date Sep 17, 2013
- Sumitomo Bakelite Co., Ltd.
- Haruo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a printed circuit board
- Patent number 8,499,441
- Issue date Aug 6, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hwan Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring substrate
- Patent number 8,419,884
- Issue date Apr 16, 2013
- Murata Manufacturing Co., Ltd.
- Yasuyuki Sekimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulating resin sheet laminate and multi-layer printed circuit boa...
- Patent number 8,357,859
- Issue date Jan 22, 2013
- Sumitomo Bakelite Co., Ltd.
- Hiroaki Wakabayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing multilayer printed wiring board
- Patent number 8,337,655
- Issue date Dec 25, 2012
- Ajinomoto Co., Inc.
- Shigeo Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer film for plating, method of manufacturing metal film-coa...
- Patent number 8,273,463
- Issue date Sep 25, 2012
- FUJIFILM Corporation
- Mitsuyuki Tsurumi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing wiring board
- Patent number 8,196,296
- Issue date Jun 12, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji Yukiiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating multilayer circuit board, circuit plate, and...
- Patent number 8,153,901
- Issue date Apr 10, 2012
- Sumitomo Bakelite Co., Ltd.
- Masayoshi Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-clad laminate, wiring circuit board, and processes for pr...
- Patent number 8,099,866
- Issue date Jan 24, 2012
- Nitto Denko Corporation
- Daisuke Yamauchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing an electronic part
- Patent number 7,987,590
- Issue date Aug 2, 2011
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...
- Publication number 20180255646
- Publication date Sep 6, 2018
- JX NIPPON MINING & METALS CORPORATION
- Terumasa Moriyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLORED THIN COVERING FILM AND MANUFACTURING METHOD
- Publication number 20180249572
- Publication date Aug 30, 2018
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD
- Publication number 20170318670
- Publication date Nov 2, 2017
- UBE EXSYMO CO., LTD.
- Eisuke TACHIBANA
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTRONIC STICKERS WITH RE-USABILITY ENHANCEMENTS
- Publication number 20170135212
- Publication date May 11, 2017
- Chibitronics Private Limited
- Andrew Shane HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PREPREG AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170086292
- Publication date Mar 23, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Eun-Sil KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
CONDUCTIVE STIFFENER, METHOD OF MAKING A CONDUCTIVE STIFFENER, AND...
- Publication number 20170019988
- Publication date Jan 19, 2017
- MC10, Inc.
- Bryan McGrane
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD FOR FABRICATING WIRING BOARD
- Publication number 20160205789
- Publication date Jul 14, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- FUMITO SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150342039
- Publication date Nov 26, 2015
- IBIDEN CO., LTD.
- Youhong WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME
- Publication number 20150319867
- Publication date Nov 5, 2015
- DEXERIALS CORPORATION
- Kouichi SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150313007
- Publication date Oct 29, 2015
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE FOIL ASSEMBLY FOR A PRINTED PRODUCT APPARATUS AND METHOD O...
- Publication number 20150195903
- Publication date Jul 9, 2015
- lllinois Tool Works Inc.
- Sundareshwaran Sadasivan
- B32 - LAYERED PRODUCTS
Information Patent Application
INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING TH...
- Publication number 20140037889
- Publication date Feb 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Jong-Yoon JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20130067742
- Publication date Mar 21, 2013
- AJINOMOTO CO., INC.
- Shigeo NAKAMURA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20120204424
- Publication date Aug 16, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD
- Publication number 20120144666
- Publication date Jun 14, 2012
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20120030938
- Publication date Feb 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120018195
- Publication date Jan 26, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board
- Publication number 20120012379
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Ho-Sik Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board and manufacturing method of the same
- Publication number 20110139499
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jung-Hwan Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...
- Publication number 20110135883
- Publication date Jun 9, 2011
- Houssam Jomaa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A...
- Publication number 20110120630
- Publication date May 26, 2011
- SUMITOMO BAKELITE CO., LTD.
- Maroshi YUASA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method of manufacturing printed circuit board
- Publication number 20110079349
- Publication date Apr 7, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Suk Hyeon Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE
- Publication number 20100236698
- Publication date Sep 23, 2010
- Murata Manufacturing Co., Ltd.
- Yasuyuki SEKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD
- Publication number 20100206471
- Publication date Aug 19, 2010
- AJINOMOTO CO., INC.
- Shigeo Nakamura
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN SHEET FOR CIRCUIT BOARD AND PRODUCTION PROCESS THEREFOR
- Publication number 20100183849
- Publication date Jul 22, 2010
- SUMITOMO BAKELITE CO., LTD.
- Haruo Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOA...
- Publication number 20100101843
- Publication date Apr 29, 2010
- SUMITOMO BAKELITE CO., LTD.
- Hiroaki Wakabayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20100097770
- Publication date Apr 22, 2010
- Samsung Electro-Mechanics CO., LTD.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLAYER DIELECTRIC FILM WITH CARRIER MATERIAL AND MULTILAYER PRI...
- Publication number 20100032192
- Publication date Feb 11, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toyoaki Kishi
- B32 - LAYERED PRODUCTS
Information Patent Application
Device Carrying an Intergrated Circuit/Components and Method of Pro...
- Publication number 20100025095
- Publication date Feb 4, 2010
- Li Hui Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Transfer laminating of insulating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming flexible interconnect circuits

Flexible laminated board and multilayer circuit board

Photosensitive dry film and uses of the same

Colored thin covering film and manufacturing method

Printed circuit board and method for producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Anisotropic conductive film and method of producing the same

Method of manufacturing an electronic sticker

Photosensitive element, photosensitive element roll, method for pro...

Substrate structure and manufacturing method thereof

Printed wiring board and method for manufacturing the same

Method for fabricating wiring board

Substrate structure and manufacturing method thereof

Process for producing multilayer printed wiring board

8956492

Plating target material, polyamic solution and polyimide resin solu...

Interlayer dielectric film with carrier material and multilayer pri...

Substrate having internal capacitor and method of making same

Method for manufacturing wiring board

Resin sheet for circuit board and production process therefor

Method of manufacturing a printed circuit board

Method for manufacturing multilayer wiring substrate

Insulating resin sheet laminate and multi-layer printed circuit boa...

Process for producing multilayer printed wiring board

Multilayer film for plating, method of manufacturing metal film-coa...

Method for manufacturing wiring board

Method for fabricating multilayer circuit board, circuit plate, and...

Conductor-clad laminate, wiring circuit board, and processes for pr...

Method for manufacturing an electronic part

Patents Applicationslast 30 patents

Interconnect Circuit Methods And Devices

Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated...

COLORED THIN COVERING FILM AND MANUFACTURING METHOD

FLEXIBLE LAMINATED BOARD AND MULTILAYER CIRCUIT BOARD

ELECTRONIC STICKERS WITH RE-USABILITY ENHANCEMENTS

PREPREG AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE STIFFENER, METHOD OF MAKING A CONDUCTIVE STIFFENER, AND...

METHOD FOR FABRICATING WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ANISOTROPIC CONDUCTIVE FILM AND METHOD OF PRODUCING THE SAME

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LAMINATE FOIL ASSEMBLY FOR A PRINTED PRODUCT APPARATUS AND METHOD O...

INSULATOR FOR BUILD-UP PCB AND METHOD OF MANUFACTURING PCB USING TH...

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD

METHOD FOR MANUFACTURING WIRING BOARD

Method of manufacturing printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board and manufacturing method of the same

METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, A...

MANUFACTURING PROCESS FOR A PREPREG WITH A CARRIER, PREPREG WITH A...

Method of manufacturing printed circuit board

METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE

PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD

RESIN SHEET FOR CIRCUIT BOARD AND PRODUCTION PROCESS THEREFOR

INSULATING RESIN SHEET LAMINATE AND MULTI-LAYER PRINTED CIRCUIT BOA...

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

INTERLAYER DIELECTRIC FILM WITH CARRIER MATERIAL AND MULTILAYER PRI...

Device Carrying an Intergrated Circuit/Components and Method of Pro...