transforming an insulating layer into a conductive layer

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H01L21/76823

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76823transforming an insulating layer into a conductive layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Nanoscale resolution, spatially-controlled conductivity modulation...
- Patent number 12,112,982
- Issue date Oct 8, 2024
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 12,074,193
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning interconnects and other structures by photo-sensitizing...
- Patent number 12,033,890
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,942,362
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,749,711
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device and method for fabricating the vertic...
- Patent number 11,751,395
- Issue date Sep 5, 2023
- SK hynix Inc.
- In-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning interconnects and other structures by photo-sensitizing...
- Patent number 11,676,855
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,637,081
- Issue date Apr 25, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element covered by pol...
- Patent number 11,621,317
- Issue date Apr 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maskless air gap enabled by a single damascene process
- Patent number 11,610,810
- Issue date Mar 21, 2023
- Intel Corporation
- Miriam R. Reshotko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 11,600,521
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 11,532,514
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device and method for fabricating the vertic...
- Patent number 11,244,956
- Issue date Feb 8, 2022
- SK hynix Inc.
- In-Su Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with magnetic element
- Patent number 11,233,116
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lattice bump interconnect
- Patent number 11,145,598
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,145,611
- Issue date Oct 12, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,133,216
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding and connecting substrates
- Patent number 11,107,855
- Issue date Aug 31, 2021
- Sony Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with magneti...
- Patent number 11,094,776
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with conduct...
- Patent number 10,957,587
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chieh Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal gate including de-oxidation of an oxidiz...
- Patent number 10,854,472
- Issue date Dec 1, 2020
- GLOBALFOUNDRIES Inc.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dissimilar material interface having lattices
- Patent number 10,804,201
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and formation method of semiconductor device with magneti...
- Patent number 10,756,162
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with multiple substrates electrically connecte...
- Patent number 10,707,258
- Issue date Jul 7, 2020
- Sony Corporation
- Nobutoshi Fujii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Surface modification layer for conductive feature formation
- Patent number 10,699,944
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structure having graphene-capped metal i...
- Patent number 10,651,279
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemoepitaxy etch trim using a self aligned hard mask for metal lin...
- Patent number 10,600,680
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Markus Brink
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resistors with controlled resistivity
- Patent number 10,325,978
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemoepitaxy etch trim using a self aligned hard mask for metal lin...
- Patent number 10,256,139
- Issue date Apr 9, 2019
- International Business Machines Corporation
- Markus Brink
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of forming resistors with controlled resistivity
- Patent number 10,217,809
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20240363676
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING INTERCONNECTS AND OTHER STRUCTURES BY PHOTO-SENSITIZING...
- Publication number 20240332068
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION
- Publication number 20240194522
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20230403855
- Publication date Dec 14, 2023
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230361156
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Interconnects and Other Structures by Photo-Sensitizing...
- Publication number 20230268224
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20230238422
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Modification Layer for Conductive Feature Formation
- Publication number 20230207384
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20220140065
- Publication date May 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20220123020
- Publication date Apr 21, 2022
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...
- Publication number 20220020635
- Publication date Jan 20, 2022
- Northwestern University
- Hooman Mohseni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407940
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20210376054
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20210366958
- Publication date Nov 25, 2021
- SONY GROUP CORPORATION
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20210343581
- Publication date Nov 4, 2021
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Hongmin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Interconnects and Other Structures by Photo-Sensitizing...
- Publication number 20210265204
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Formation Method of Semiconductor Device with Conduct...
- Publication number 20210210383
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chieh Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200411458
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Jongyoun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT
- Publication number 20200350395
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...
- Publication number 20200328226
- Publication date Oct 15, 2020
- SK HYNIX INC.
- In-Su PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Modification Layer for Conductive Feature Formation
- Publication number 20200328110
- Publication date Oct 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS
- Publication number 20200203212
- Publication date Jun 25, 2020
- Intel Corporation
- Miriam R. RESHOTKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Modification Layer for Conductive Feature Formation
- Publication number 20200105587
- Publication date Apr 2, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Jou Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH MAGNETI...
- Publication number 20200075448
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Cheng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Formation Method of Semiconductor Device with Conduct...
- Publication number 20200043786
- Publication date Feb 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Chieh Wu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20190386056
- Publication date Dec 19, 2019
- SONY CORPORATION
- Nobutoshi Fujii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20190371656
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMOEPITAXY ETCH TRIM USING A SELF ALIGNED HARD MASK FOR METAL LIN...
- Publication number 20190043754
- Publication date Feb 7, 2019
- International Business Machines Corporation
- Markus Brink
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
- Publication number 20180269248
- Publication date Sep 20, 2018
- SONY CORPORATION
- Nobutoshi Fujii
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TUNABLE RESISTOR WITH CURVED RESISTOR ELEMENTS
- Publication number 20180197937
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS

transforming an insulating layer into a conductive layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Nanoscale resolution, spatially-controlled conductivity modulation...

Semiconductor device structure with magnetic element

Patterning interconnects and other structures by photo-sensitizing...

Surface modification layer for conductive feature formation

Semiconductor device structure with magnetic element

Vertical semiconductor device and method for fabricating the vertic...

Patterning interconnects and other structures by photo-sensitizing...

Semiconductor package and method of manufacturing the same

Semiconductor device structure with magnetic element covered by pol...

Maskless air gap enabled by a single damascene process

Surface modification layer for conductive feature formation

Structure and formation method of semiconductor device with conduct...

Vertical semiconductor device and method for fabricating the vertic...

Semiconductor device structure with magnetic element

Lattice bump interconnect

Semiconductor package and method of manufacturing the same

Interconnect structure

Method for bonding and connecting substrates

Structure and formation method of semiconductor device with magneti...

Structure and formation method of semiconductor device with conduct...

Method for forming a metal gate including de-oxidation of an oxidiz...

Dissimilar material interface having lattices

Structure and formation method of semiconductor device with magneti...

Semiconductor device with multiple substrates electrically connecte...

Surface modification layer for conductive feature formation

Semiconductor interconnect structure having graphene-capped metal i...

Chemoepitaxy etch trim using a self aligned hard mask for metal lin...

Resistors with controlled resistivity

Chemoepitaxy etch trim using a self aligned hard mask for metal lin...

Method of forming resistors with controlled resistivity

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

PATTERNING INTERCONNECTS AND OTHER STRUCTURES BY PHOTO-SENSITIZING...

SURFACE MODIFICATION LAYER FOR CONDUCTIVE FEATURE FORMATION

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

Patterning Interconnects and Other Structures by Photo-Sensitizing...

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

Surface Modification Layer for Conductive Feature Formation

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

NANOSCALE RESOLUTION, SPATIALLY-CONTROLLED CONDUCTIVITY MODULATION...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME

Patterning Interconnects and Other Structures by Photo-Sensitizing...

Structure and Formation Method of Semiconductor Device with Conduct...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT

VERTICAL SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE VERTIC...

Surface Modification Layer for Conductive Feature Formation

MASKLESS AIR GAP ENABLED BY A SINGLE DAMASCENE PROCESS

Surface Modification Layer for Conductive Feature Formation

STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH MAGNETI...

Structure and Formation Method of Semiconductor Device with Conduct...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

INTERCONNECT STRUCTURE

CHEMOEPITAXY ETCH TRIM USING A SELF ALIGNED HARD MASK FOR METAL LIN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD

TUNABLE RESISTOR WITH CURVED RESISTOR ELEMENTS