Trays for chips

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CPC
H01L21/67333

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67333Trays for chips

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus and method of collecting residues
- Patent number 12,217,989
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ping-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device testing apparatus and electronic device testing m...
- Patent number 12,180,018
- Issue date Dec 31, 2024
- CHROMA ATE INC.
- Chin-Yi Ouyang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module tray for semiconductor device
- Patent number 12,119,248
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Taegeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier, chip testing module, and chip handling module
- Patent number 12,112,964
- Issue date Oct 8, 2024
- CHROMA ATE INC.
- Sheng-Hung Wang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic device pick-and-place system and electronic device testi...
- Patent number 12,103,789
- Issue date Oct 1, 2024
- CHROMA ATE INC.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip transfer apparatus
- Patent number 12,068,178
- Issue date Aug 20, 2024
- Samsung Electronics Co., Ltd.
- Dongkyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer system for wafer cassettes
- Patent number 12,046,497
- Issue date Jul 23, 2024
- Visera Technologies Company Ltd
- Yi-Feng Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mass transfer method and mass transfer device thereof for micro led...
- Patent number 12,033,876
- Issue date Jul 9, 2024
- Beijing Boe Display Technology Co., Ltd.
- Bohua Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for packaging electronic components using a t...
- Patent number 12,035,478
- Issue date Jul 9, 2024
- CSP Technologies, Inc.
- Tzu-Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip tray positioning device
- Patent number 11,970,342
- Issue date Apr 30, 2024
- CHROMA ATE INC.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature control and method for devices under test and image sen...
- Patent number 11,932,498
- Issue date Mar 19, 2024
- CHROMA ATE INC.
- Chin-Yi Ouyang
- G01 - MEASURING TESTING
Information Patent Grant
Dual applicator fluid dispensing methods and systems
- Patent number 11,919,020
- Issue date Mar 5, 2024
- Nordson Corporation
- Christopher L. Giusti
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Apparatus for attaching semiconductor parts
- Patent number 11,823,920
- Issue date Nov 21, 2023
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chamber module and test handler including the same
- Patent number 11,762,009
- Issue date Sep 19, 2023
- Semes Co., Ltd.
- Hyon Jin Lee
- G01 - MEASURING TESTING
Information Patent Grant
Tray
- Patent number 11,764,090
- Issue date Sep 19, 2023
- Chipbond Technology Corporation
- Hsu-Chi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,764,133
- Issue date Sep 19, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tape system and methods of making and using the same
- Patent number 11,725,120
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,682,571
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automatic tray loading system and use method of the same
- Patent number 11,628,993
- Issue date Apr 18, 2023
- QINGDAO UNIVERSITY OF TECHNOLOGY
- Changhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal spring anchor for advanced packaging
- Patent number 11,626,312
- Issue date Apr 11, 2023
- Dong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for tray cassette warehousing
- Patent number 11,527,425
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier tray
- Patent number 11,521,877
- Issue date Dec 6, 2022
- Disco Corporation
- Kentaro Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-row carrier tape with alternating, staggered dummy pockets
- Patent number 11,452,247
- Issue date Sep 20, 2022
- Advantek, Inc.
- Todd M. Oliverius
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for handling die carriers
- Patent number 11,398,396
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape carrier assemblies having an integrated adhesive film
- Patent number 11,362,025
- Issue date Jun 14, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for die container warehousing
- Patent number 11,348,816
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure and micro device structure
- Patent number 11,302,547
- Issue date Apr 12, 2022
- PlayNitride Display Co., Ltd.
- Pei-Hsin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods related to preparation of a stencil to receive a plurality...
- Patent number 11,183,413
- Issue date Nov 23, 2021
- Rokko Systems Pte Ltd.
- Seung Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped component assembly accommodated within a stepped cavity in...
- Patent number 11,129,314
- Issue date Sep 21, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Gernot Grober
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automation line for processing a molded panel
- Patent number 11,107,716
- Issue date Aug 31, 2021
- PYXIS CF PTE. LTD.
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022730
- Publication date Jan 16, 2025
- TES CO., LTD.
- Jin-Hyung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240404855
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240404856
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOLDING PLATE, HOLDING SYSTEM, USE OF THE HOLDING PLATE, USE OF THE...
- Publication number 20240355657
- Publication date Oct 24, 2024
- ASMPT GmbH & Co. KG
- Christoph OECKL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALI...
- Publication number 20240321618
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Suhwan SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...
- Publication number 20240322068
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Youngtek OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACEPLATE LOADING PLATFORM
- Publication number 20240312815
- Publication date Sep 19, 2024
- Applied Materials, Inc.
- Thyagarajan Kathavarayan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Calibration Device
- Publication number 20240304479
- Publication date Sep 12, 2024
- DIODES INCORPORATED
- WanHui Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HANDLING DEVICE AND SUCKER MODULE THEREOF
- Publication number 20240194515
- Publication date Jun 13, 2024
- Wistron Corporation
- Shun-Chi YEH
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CLIP AND LID SYSTEM FOR A CHIP TRAY
- Publication number 20240170315
- Publication date May 23, 2024
- BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC
- Richard Rochford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY MODULE
- Publication number 20240092552
- Publication date Mar 21, 2024
- SAMSUNG DISPLAY CO., LTD.
- MINJONG CHEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASS-TRANSFER METHOD AND MASS-TRANSFER DEVICE FOR MICRO SEMICONDUCT...
- Publication number 20240079395
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Joonyong Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE TRAY FOR SEMICONDUCTOR DEVICE
- Publication number 20240055286
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Taegeon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER SYSTEM FOR WAFER CASSETTES
- Publication number 20240047249
- Publication date Feb 8, 2024
- VisEra Technologies Company Ltd.
- Yi-Feng YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP WET TRANSFER APPARATUS
- Publication number 20240006199
- Publication date Jan 4, 2024
- Samsung Electronics Co., Ltd.
- Hyunjoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME
- Publication number 20230340298
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Ming Kuo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND METHODS FOR HANDLING DIE CARRIERS
- Publication number 20230298919
- Publication date Sep 21, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SECURING SEMICONDUCTOR DEVICE CARRYING BOA...
- Publication number 20230268210
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHUN-YU LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER
- Publication number 20230253226
- Publication date Aug 10, 2023
- Po-Hsiang CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-SEMICONDUCTOR CHIP TRANSFER APPARATUS AND CHIP EXTRACTION APP...
- Publication number 20230197477
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY CARRIER AND CORRESPONDING METHOD
- Publication number 20230170236
- Publication date Jun 1, 2023
- STMicroelectronics (Malta) Ltd.
- Silvio SPITERI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SU...
- Publication number 20230170239
- Publication date Jun 1, 2023
- TOKYO ELECTRON LIMITED
- Takehiro SHINDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP DISPENSER FOR SELF-ASSEMBLY
- Publication number 20230163007
- Publication date May 25, 2023
- LG ELECTRONICS INC.
- Inbum YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRANSFER APPARATUS
- Publication number 20230154769
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Dongkyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY A...
- Publication number 20230141485
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR TRAY CASSETTE WAREHOUSING
- Publication number 20230095609
- Publication date Mar 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRAY AND DESTRUCTIVE ANALYSIS AUTOMATION APPARATUS INCLUDING THE SAME
- Publication number 20230101674
- Publication date Mar 30, 2023
- Samsung Electronics Co., Ltd.
- Youn Gon OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip tray positioning device
- Publication number 20230089716
- Publication date Mar 23, 2023
- CHROMA ATE INC.
- Chien-Ming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP TRAY FOR SELF-ASSEMBLY, AND METHOD FOR SUPPLYING SEMICONDUCTOR...
- Publication number 20230083951
- Publication date Mar 16, 2023
- LG ELECTRONICS INC.
- Dohee KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT-ASSISTING TRAY, ALIGNMENT-CONTROL APPARATUS AND ALIGNMENT...
- Publication number 20220384225
- Publication date Dec 1, 2022
- TOHOKU-MICROTEC CO., LTD.
- Makoto MOTOYOSHI
- H01 - BASIC ELECTRIC ELEMENTS

Trays for chips

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus and method of collecting residues

Electronic device testing apparatus and electronic device testing m...

Module tray for semiconductor device

Chip carrier, chip testing module, and chip handling module

Electronic device pick-and-place system and electronic device testi...

Chip transfer apparatus

Transfer system for wafer cassettes

Mass transfer method and mass transfer device thereof for micro led...

Apparatus and methods for packaging electronic components using a t...

Chip tray positioning device

Temperature control and method for devices under test and image sen...

Dual applicator fluid dispensing methods and systems

Apparatus for attaching semiconductor parts

Chamber module and test handler including the same

Tray

Tape carrier assemblies having an integrated adhesive film

Carrier tape system and methods of making and using the same

Apparatus and methods for handling die carriers

Automatic tray loading system and use method of the same

Metal spring anchor for advanced packaging

Systems and methods for tray cassette warehousing

Carrier tray

Multi-row carrier tape with alternating, staggered dummy pockets

Apparatus and methods for handling die carriers

Tape carrier assemblies having an integrated adhesive film

Systems and methods for die container warehousing

Carrier structure and micro device structure

Methods related to preparation of a stencil to receive a plurality...

Stepped component assembly accommodated within a stepped cavity in...

Automation line for processing a molded panel

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS

MODULE TRAY FOR SEMICONDUCTOR DEVICE

MODULE TRAY FOR SEMICONDUCTOR DEVICE

HOLDING PLATE, HOLDING SYSTEM, USE OF THE HOLDING PLATE, USE OF THE...

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR PACKAGE ALI...

MICRO SEMICONDUCTOR CHIP TRANSFER METHOD AND MICRO SEMICONDUCTOR CH...

FACEPLATE LOADING PLATFORM

Calibration Device

WAFER HANDLING DEVICE AND SUCKER MODULE THEREOF

CLIP AND LID SYSTEM FOR A CHIP TRAY

TRAY MODULE

MASS-TRANSFER METHOD AND MASS-TRANSFER DEVICE FOR MICRO SEMICONDUCT...

MODULE TRAY FOR SEMICONDUCTOR DEVICE

TRANSFER SYSTEM FOR WAFER CASSETTES

CHIP WET TRANSFER APPARATUS

CARRIER TAPE SYSTEM AND METHODS OF MAKING AND USING THE SAME

APPARATUS AND METHODS FOR HANDLING DIE CARRIERS

METHOD AND APPARATUS FOR SECURING SEMICONDUCTOR DEVICE CARRYING BOA...

CHIP CARRIER

MICRO-SEMICONDUCTOR CHIP TRANSFER APPARATUS AND CHIP EXTRACTION APP...

TRAY CARRIER AND CORRESPONDING METHOD

APPARATUS FOR TRANSFERRING SUBSTRATE AND METHOD FOR TRANSFERRING SU...

CHIP DISPENSER FOR SELF-ASSEMBLY

CHIP TRANSFER APPARATUS

DEVICE TRANSFER SUBSTRATE, DEVICE TRANSFER STRUCTURE, AND DISPLAY A...

SYSTEMS AND METHODS FOR TRAY CASSETTE WAREHOUSING

TRAY AND DESTRUCTIVE ANALYSIS AUTOMATION APPARATUS INCLUDING THE SAME

Chip tray positioning device

CHIP TRAY FOR SELF-ASSEMBLY, AND METHOD FOR SUPPLYING SEMICONDUCTOR...

ALIGNMENT-ASSISTING TRAY, ALIGNMENT-CONTROL APPARATUS AND ALIGNMENT...