Treatment of workpiece between coating steps

Industry

CPC
Y10S205/917

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S205/00Electrolysis: processes, compositions used therein, and methods of preparing the compositions

Current Industry

Y10S205/917Treatment of workpiece between coating steps

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for the selectively electroplating a strip-shaped, metal sup...
- Patent number 6,972,082
- Issue date Dec 6, 2005
- IMO Ingo Müller e.K.
- Michail Kotsias
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of coloring magnesium material, and housing made of colored...
- Patent number 6,936,349
- Issue date Aug 30, 2005
- Fujitsu Limited
- Yasuo Naganuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating damascene structures in mechanically weak int...
- Patent number 6,790,336
- Issue date Sep 14, 2004
- Intel Corporation
- Tatyana Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated plating and planarization process and apparatus therefor
- Patent number 6,773,570
- Issue date Aug 10, 2004
- International Business Machines Corporation
- Laertis Economikos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plating for filling via holes
- Patent number 6,755,957
- Issue date Jun 29, 2004
- Shinko Electric Industries Co., Ltd.
- Kenji Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for plating substrate with copper
- Patent number 6,638,411
- Issue date Oct 28, 2003
- Ebara Corporation
- Koji Mishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplating apparatus
- Patent number 6,554,976
- Issue date Apr 29, 2003
- TDK Corporation
- Satoshi Inoue
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrodeposition method of forming an oxide film
- Patent number 6,471,848
- Issue date Oct 29, 2002
- Canon Kabushiki Kaisha
- Kozo Arao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for preparing anode electrode for high voltage electrolytic...
- Patent number 6,440,288
- Issue date Aug 27, 2002
- Korea Advanced Institute of Science and Technology
- Su Il Pyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anodized tantalum pellet for an electrolytic capacitor
- Patent number 6,231,993
- Issue date May 15, 2001
- Wilson Greatbatch Ltd.
- Donald H. Stephenson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating method
- Patent number 6,090,260
- Issue date Jul 18, 2000
- TDK Corporation
- Satoshi Inoue
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of microetching a conductive polymer on multilayer circuit b...
- Patent number 6,036,835
- Issue date Mar 14, 2000
- Shipley Company, L.L.C.
- Wade Sonnenberg
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrodeposited copper foil for printed wiring board and method fo...
- Patent number 5,897,761
- Issue date Apr 27, 1999
- Mitsui Mining & Smleting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Nickel/gold plating of a copper-refractory metal material
- Patent number 5,858,557
- Issue date Jan 12, 1999
- Sunghee Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrodeposited copper foil for printed wiring board and method of...
- Patent number 5,858,517
- Issue date Jan 12, 1999
- Mitsui Mining & Smelting Co., Ltd.
- Hideyasu Tagusari
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating process
- Patent number 5,858,198
- Issue date Jan 12, 1999
- Shipley Company, L.L.C.
- Steven M. Florio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for coating metal cookware
- Patent number 5,827,573
- Issue date Oct 27, 1998
- Tung-Hung Tsai
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Durable platinum/polyimide sensing structures
- Patent number 5,780,173
- Issue date Jul 14, 1998
- General Motors Corporation
- Charles Robert Harrington
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electroplating process
- Patent number 5,738,776
- Issue date Apr 14, 1998
- Shipley Company, L.L.C.
- Steven M. Florio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Mass air flow sensor structure with bi-directional airflow incident...
- Patent number 5,631,417
- Issue date May 20, 1997
- General Motors Corporation
- Charles R. Harrington
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Partially plated resin products and partial plating process therefor
- Patent number 5,441,626
- Issue date Aug 15, 1995
- Toyoda Gosei Co., Ltd.
- Ysauhiko Ogisu
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Method of making a cast-to-size mold for molding finished plastic p...
- Patent number 5,427,676
- Issue date Jun 27, 1995
- General Motors Corporation
- Edward M. Domanski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Surface-treated steel sheet having improved weldability and plating...
- Patent number 5,421,969
- Issue date Jun 6, 1995
- Kawasaki Steel Corporation
- Chiaki Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wiring boards and manufacturing methods thereof
- Patent number 5,407,557
- Issue date Apr 18, 1995
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective coatings for metal parts to be used at high temperatures
- Patent number 5,382,347
- Issue date Jan 17, 1995
- Joseph Yahalom
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Process and apparatus for electroplating
- Patent number 5,372,701
- Issue date Dec 13, 1994
- Louis J. Gerdon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electroplating metal onto a non-conductive substrate tre...
- Patent number 5,342,501
- Issue date Aug 30, 1994
- Harnden; Eric F.
- Kiyoshi Okabayashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surface-treated steel sheet having improved weldability and plating...
- Patent number 5,326,648
- Issue date Jul 5, 1994
- Kawasaki Steel Corporation
- Chiaki Kato
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for adhering metal coatings to thermoplastic addition polymers
- Patent number 5,316,867
- Issue date May 31, 1994
- General Electric Company
- Herbert S. Chao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring boards and manufacturing methods thereof
- Patent number 5,310,966
- Issue date May 10, 1994
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for the selectively electroplating a strip-shaped, metal sup...
- Publication number 20040206629
- Publication date Oct 21, 2004
- Michail Kotsias
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR
- Publication number 20040094427
- Publication date May 20, 2004
- International Business Machines Corporation
- Laertis Economikos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and apparatus for plating substrate with copper
- Publication number 20040050711
- Publication date Mar 18, 2004
- Koji Mishima
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of fabricating damascene structures in mechanically weak int...
- Publication number 20030234182
- Publication date Dec 25, 2003
- Tatyana Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of coloring magnesium material, and housing made of colored...
- Publication number 20030052012
- Publication date Mar 20, 2003
- FUJITSU LIMITED
- Yasuo Naganuma
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of plating for filling via holes
- Publication number 20010013472
- Publication date Aug 16, 2001
- Kenji Nakamura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Treatment of workpiece between coating steps

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for the selectively electroplating a strip-shaped, metal sup...

Method of coloring magnesium material, and housing made of colored...

Method of fabricating damascene structures in mechanically weak int...

Integrated plating and planarization process and apparatus therefor

Method of plating for filling via holes

Method and apparatus for plating substrate with copper

Electroplating apparatus

Electrodeposition method of forming an oxide film

Method for preparing anode electrode for high voltage electrolytic...

Anodized tantalum pellet for an electrolytic capacitor

Electroplating method

Method of microetching a conductive polymer on multilayer circuit b...

Electrodeposited copper foil for printed wiring board and method fo...

Nickel/gold plating of a copper-refractory metal material

Electrodeposited copper foil for printed wiring board and method of...

Electroplating process

Method for coating metal cookware

Durable platinum/polyimide sensing structures

Electroplating process

Mass air flow sensor structure with bi-directional airflow incident...

Partially plated resin products and partial plating process therefor

Method of making a cast-to-size mold for molding finished plastic p...

Surface-treated steel sheet having improved weldability and plating...

Wiring boards and manufacturing methods thereof

Protective coatings for metal parts to be used at high temperatures

Process and apparatus for electroplating

Method for electroplating metal onto a non-conductive substrate tre...

Surface-treated steel sheet having improved weldability and plating...

Method for adhering metal coatings to thermoplastic addition polymers

Wiring boards and manufacturing methods thereof

Patents Applicationslast 30 patents

Method for the selectively electroplating a strip-shaped, metal sup...

INTEGRATED PLATING AND PLANARIZATION PROCESS AND APPARATUS THEREFOR

Method and apparatus for plating substrate with copper

Method of fabricating damascene structures in mechanically weak int...

Method of coloring magnesium material, and housing made of colored...

Method of plating for filling via holes