Unevenly distributed heat load

Industry

CPC
H05K7/20518

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20518Unevenly distributed heat load

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic control of a compressor, compressor and cooling equipment
- Patent number 12,144,153
- Issue date Nov 12, 2024
- NIDEC GLOBAL APPLIANCE BRASIL LTDA.
- Felipe Guilherme Stein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Combination heat sink
- Patent number 12,052,846
- Issue date Jul 30, 2024
- Quanta Computer Inc.
- Yi-Chieh Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Split enclosure for fan-less cooling
- Patent number 11,940,661
- Issue date Mar 26, 2024
- Cisco Technology, Inc.
- Joseph F. Jacques
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computational heat dissipation structure, computing device comprisi...
- Patent number 11,895,802
- Issue date Feb 6, 2024
- CANAAN CREATIVE CO., LTD.
- Ning Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computational heat dissipation structure, computing device comprisi...
- Patent number 11,882,669
- Issue date Jan 23, 2024
- CANAAN CREATIVE CO., LTD.
- Ning Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fluid cooling system
- Patent number 11,778,790
- Issue date Oct 3, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooling system
- Patent number 11,737,247
- Issue date Aug 22, 2023
- ICEOTOPE GROUP LIMITED
- Neil Edmunds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vehicular sensing device with cooling feature
- Patent number 11,683,911
- Issue date Jun 20, 2023
- Magna Electronics Inc.
- Wilhelm Johann Wolfgang Wöhlte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanically flexible cold plates for low power components
- Patent number 11,497,143
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Jet vectoring fluid impingement cooling using pivoting nozzles
- Patent number 11,439,037
- Issue date Sep 6, 2022
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hot spot cooling for data storage system
- Patent number 11,429,163
- Issue date Aug 30, 2022
- Western Digital Technologies, Inc.
- Shaomin Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat radiation structure
- Patent number 11,425,843
- Issue date Aug 23, 2022
- NEC Platforms, Ltd.
- Takahiro Yagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computational heat dissipation structure, computing device comprisi...
- Patent number 11,425,839
- Issue date Aug 23, 2022
- CANAAN CREATIVE CO., LTD.
- Ning Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Case assembly and electronic device
- Patent number 11,330,734
- Issue date May 10, 2022
- HTC Corporation
- Chih-Kuang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector assembly having floating heat sink in resilien...
- Patent number 11,322,871
- Issue date May 3, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Chun-Chieh Yang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-zone heat sink for printed circuit boards
- Patent number 11,310,903
- Issue date Apr 19, 2022
- dspace digital signal processing and control engineering GmbH
- Robert Breicher
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite pin fin heat sink with improved heat dissipation performance
- Patent number 11,252,842
- Issue date Feb 15, 2022
- Pusan National University Industry-University Cooperation Foundation
- Ji Hwan Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double sided heat exchanger cooling unit
- Patent number 11,184,996
- Issue date Nov 23, 2021
- Advanced Cooling Technologies, Inc.
- Scott D. Garner
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Modular thermoelectric-based cooling device for heterogeneous packages
- Patent number 11,178,795
- Issue date Nov 16, 2021
- BAIDU USA LLC
- Tianyi Gao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, system, and method for electromagnetic interference miti...
- Patent number 11,129,302
- Issue date Sep 21, 2021
- Juniper Networks, Inc.
- Philippe C. Sochoux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation structure for electronic device and electronic device
- Patent number 11,122,710
- Issue date Sep 14, 2021
- Huawei Technologies Co., Ltd.
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cold plate with flex regions between fin areas
- Patent number 11,058,030
- Issue date Jul 6, 2021
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Tailored coldplate geometries for forming multiple coefficient of t...
- Patent number 11,032,947
- Issue date Jun 8, 2021
- Raytheon Company
- Craig H. McCordic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,966,352
- Issue date Mar 30, 2021
- Google LLC
- Madhusudan Krishnan Iyengar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crossflow heat-exchangers
- Patent number 10,905,035
- Issue date Jan 26, 2021
- AMSCREEN GROUP LIMITED
- Stephen Whitehead
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Crossflow heat-exchangers
- Patent number 10,863,655
- Issue date Dec 8, 2020
- AMSCREEN GROUP LIMITED
- Stephen Whitehead
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Techniques for mitigating temperature spikes and dissipating heat
- Patent number 10,750,640
- Issue date Aug 18, 2020
- QUALCOMM Incorporated
- Sean Charles Andrews
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Heat sink, preparation method therefor, and communications device
- Patent number 10,736,237
- Issue date Aug 4, 2020
- Huawei Technologies Co., Ltd.
- Yan Xu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation structure for electronic device and electronic device
- Patent number 10,729,036
- Issue date Jul 28, 2020
- Huawei Technologies Co., Ltd.
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forced flow cooling temperature control method, system, and apparatus
- Patent number 10,645,845
- Issue date May 5, 2020
- Northrop Grumman Systems Corporation
- Martin Brokner Christiansen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...
- Publication number 20240121910
- Publication date Apr 11, 2024
- CANAAN CREATIVE CO., LTD.
- Ning ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240107714
- Publication date Mar 28, 2024
- Abaco Systems, Inc.
- Lucius AKALANNE
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Passive Thermal Transport Network for Power Supply
- Publication number 20240057301
- Publication date Feb 15, 2024
- AA Power Inc.
- Qun Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240032255
- Publication date Jan 25, 2024
- Abaco Systems, Inc.
- Joo Han KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20230363115
- Publication date Nov 9, 2023
- CLEVO CO.
- Chi-Hsueh YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SINK BASE AND HEAT SINK
- Publication number 20230292462
- Publication date Sep 14, 2023
- Beijing Deepcool Industries Co., Ltd.
- Dangsheng ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...
- Publication number 20230254991
- Publication date Aug 10, 2023
- CANAAN CREATIVE CO., LTD.
- Ning ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE
- Publication number 20230200022
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- CHENG-SHU PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATER WITH MOUNTING PADS FOR MECHANICAL, THERMAL, AND OPTO-MECHANI...
- Publication number 20230164467
- Publication date May 25, 2023
- Lumentum Operations LLC
- Roozbeh AHMADI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
REFRIGERANT COOLED HEAT SINK FOR POWER ELECTRONIC MODULES
- Publication number 20230138320
- Publication date May 4, 2023
- Carrier Corporation
- Konstantin Borisov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...
- Publication number 20220361363
- Publication date Nov 10, 2022
- CANAAN CREATIVE CO., LTD.
- Ning ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
High Efficiency Thermal Management Devices For Use With Electronic...
- Publication number 20220232728
- Publication date Jul 21, 2022
- The California State University - Northridge
- Shadi Mahjoob
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS
- Publication number 20220225536
- Publication date Jul 14, 2022
- The Intel Corporation
- Arunpandi R.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC CONTROL OF A COMPRESSOR, COMPRESSOR AND COOLING EQUIPMENT
- Publication number 20220192056
- Publication date Jun 16, 2022
- EMBRACO INDÚSTRIA DE COMPRESSORES E SOLUÇÕES EM REFRIGERAÇÃO LTDA.
- Felipe Guilherme STEIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipation Structure for Electronic Device and Electronic Device
- Publication number 20200344915
- Publication date Oct 29, 2020
- Huawei Technologies Co., Ltd
- Linfang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE WITH FLEX REGIONS BETWEEN FIN AREAS
- Publication number 20200337181
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Shurong Tian
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS
- Publication number 20200221610
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Paul W. Coteus
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...
- Publication number 20200178417
- Publication date Jun 4, 2020
- CANAAN CREATIVE CO., LTD.
- Ning ZHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VEHICULAR SENSING DEVICE WITH COOLING FEATURE
- Publication number 20200137926
- Publication date Apr 30, 2020
- MAGNA ELECTRONICS INC.
- Wilhelm Johann Wolfgang Wöhlte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Dissipation Structure for Electronic Device and Electronic Device
- Publication number 20190394905
- Publication date Dec 26, 2019
- HUAWEI TECHNOLOGIES CO., LTD.
- Linfang JIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JET VECTORING FLUID IMPINGEMENT COOLING USING PIVOTING NOZZLES
- Publication number 20190364691
- Publication date Nov 28, 2019
- Intel Corporation
- Prabhakar Subrahmanyam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE
- Publication number 20190253803
- Publication date Aug 15, 2019
- Nokia Technologies Oy
- Ian DAVIS
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Thermally Resistive Electronics Case
- Publication number 20190212792
- Publication date Jul 11, 2019
- Clark Bailey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS
- Publication number 20190200485
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Paul W. Coteus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR MITIGATING TEMPERATURE SPIKES AND DISSIPATING HEAT
- Publication number 20190159364
- Publication date May 23, 2019
- QUALCOMM Incorprorated
- Sean Charles ANDREWS
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FIRST AND SECOND SHIELDS FOR THERMAL ISOLATION
- Publication number 20190150319
- Publication date May 16, 2019
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Kevin Leigh
- G02 - OPTICS
Information Patent Application
DUAL-MODE PASSIVE THERMAL MANAGEMENT SYSTEM AND METHOD
- Publication number 20180132383
- Publication date May 10, 2018
- Lockheed Martin Corporation
- David T. Howe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Graphene Based Conformal Heat Sink and Method Therefor
- Publication number 20170315596
- Publication date Nov 2, 2017
- DELL PRODUCTS, L.P.
- Christopher A. Torres
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT DISSIPATION CASE AND METHODS FOR NAVIGATING HEAT FROM AN ELECT...
- Publication number 20170064869
- Publication date Mar 2, 2017
- Apple Inc.
- Edward L. SIAHAAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS
- Publication number 20160320815
- Publication date Nov 3, 2016
- Hewlett-Packard Development Company, L.P.
- Lee Warren Atkinson
- G06 - COMPUTING CALCULATING COUNTING

Unevenly distributed heat load

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic control of a compressor, compressor and cooling equipment

Combination heat sink

Split enclosure for fan-less cooling

Computational heat dissipation structure, computing device comprisi...

Computational heat dissipation structure, computing device comprisi...

Fluid cooling system

Fluid cooling system

Vehicular sensing device with cooling feature

Mechanically flexible cold plates for low power components

Jet vectoring fluid impingement cooling using pivoting nozzles

Hot spot cooling for data storage system

Heat radiation structure

Computational heat dissipation structure, computing device comprisi...

Case assembly and electronic device

Electrical connector assembly having floating heat sink in resilien...

Multi-zone heat sink for printed circuit boards

Composite pin fin heat sink with improved heat dissipation performance

Double sided heat exchanger cooling unit

Modular thermoelectric-based cooling device for heterogeneous packages

Apparatus, system, and method for electromagnetic interference miti...

Heat dissipation structure for electronic device and electronic device

Cold plate with flex regions between fin areas

Tailored coldplate geometries for forming multiple coefficient of t...

Cooling electronic devices in a data center

Crossflow heat-exchangers

Crossflow heat-exchangers

Techniques for mitigating temperature spikes and dissipating heat

Heat sink, preparation method therefor, and communications device

Heat dissipation structure for electronic device and electronic device

Forced flow cooling temperature control method, system, and apparatus

Patents Applicationslast 30 patents

COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...

IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

Passive Thermal Transport Network for Power Supply

COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

HEAT DISSIPATION MODULE

HEAT SINK BASE AND HEAT SINK

COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...

TWO-PHASE IMMERSION TYPE HEAT DISSIPATION SUBSTRATE

HEATER WITH MOUNTING PADS FOR MECHANICAL, THERMAL, AND OPTO-MECHANI...

REFRIGERANT COOLED HEAT SINK FOR POWER ELECTRONIC MODULES

COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...

High Efficiency Thermal Management Devices For Use With Electronic...

THERMAL MANAGEMENT SYSTEMS FOR ELECTRONIC DEVICES AND RELATED METHODS

ELECTRONIC CONTROL OF A COMPRESSOR, COMPRESSOR AND COOLING EQUIPMENT

Heat Dissipation Structure for Electronic Device and Electronic Device

COLD PLATE WITH FLEX REGIONS BETWEEN FIN AREAS

MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS

COMPUTATIONAL HEAT DISSIPATION STRUCTURE, COMPUTING DEVICE COMPRISI...

VEHICULAR SENSING DEVICE WITH COOLING FEATURE

Heat Dissipation Structure for Electronic Device and Electronic Device

JET VECTORING FLUID IMPINGEMENT COOLING USING PIVOTING NOZZLES

SPEAKER APPARATUS HAVING A HEAT DISSIPATION STRUCTURE

Thermally Resistive Electronics Case

MECHANICALLY FLEXIBLE COLD PLATES FOR LOW POWER COMPONENTS

TECHNIQUES FOR MITIGATING TEMPERATURE SPIKES AND DISSIPATING HEAT

FIRST AND SECOND SHIELDS FOR THERMAL ISOLATION

DUAL-MODE PASSIVE THERMAL MANAGEMENT SYSTEM AND METHOD

Graphene Based Conformal Heat Sink and Method Therefor

HEAT DISSIPATION CASE AND METHODS FOR NAVIGATING HEAT FROM AN ELECT...

DISSIPATING HEAT WITHIN HOUSINGS FOR ELECTRICAL COMPONENTS