Unidirectional or parallel fibers

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CPC
H05K2201/0287

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/0287Unidirectional or parallel fibers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Integrally formed product, and composite material, terminal for ele...
- Patent number 11,361,876
- Issue date Jun 14, 2022
- Furukawa Electric Co., Ltd.
- Masayasu Kasahara
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board trace for galvanic effect reduction
- Patent number 11,234,327
- Issue date Jan 25, 2022
- Western Digital Technologies, Inc.
- Songtao Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and semiconductor package using the same
- Patent number 10,616,998
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Seung Yeol Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foldable display
- Patent number 9,639,121
- Issue date May 2, 2017
- Samsung Display Co., Ltd.
- Gui-Nam Min
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of attaching electronic module on fabrics by stitching metal...
- Patent number 9,398,714
- Issue date Jul 19, 2016
- Flextronics AP, LLC
- Weifeng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer-wired substrate
- Patent number 8,377,543
- Issue date Feb 19, 2013
- NEC Corporation
- Toshinobu Ogatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,284,557
- Issue date Oct 9, 2012
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight circuit board with conductive constraining cores
- Patent number 8,097,335
- Issue date Jan 17, 2012
- Stablcor Technology, Inc.
- Kalu K. Vasoya
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fiber-reinforced resin and method for manufacturing the same
- Patent number 8,012,561
- Issue date Sep 6, 2011
- Kyocera Corporation
- Masaaki Harazono
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight circuit board with conductive constraining cores
- Patent number 7,667,142
- Issue date Feb 23, 2010
- Stablcor, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Lightweight circuit board with conductive constraining cores
- Patent number 7,635,815
- Issue date Dec 22, 2009
- Stablcor, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Selective PCB stiffening with preferentially oriented fibers
- Patent number 7,041,357
- Issue date May 9, 2006
- Intel Corporation
- George Hsieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 6,996,902
- Issue date Feb 14, 2006
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lightweight circuit board with conductive constraining cores
- Patent number 6,869,664
- Issue date Mar 22, 2005
- ThermalWorks, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,686,029
- Issue date Feb 3, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective PCB stiffening with preferentially oriented fibers
- Patent number 6,682,802
- Issue date Jan 27, 2004
- Intel Corporation
- George Hsieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Circuit board and method for manufacturing the same
- Patent number 6,558,780
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polyolefin composites for printed circuit board and antenna base ma...
- Patent number 6,168,855
- Issue date Jan 2, 2001
- Polyeitan Composites Ltd.
- Yachin Cohen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a multilayer printed wire board
- Patent number 6,016,598
- Issue date Jan 25, 2000
- Akzo Nobel N.V.
- Erik Middelman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid/flex printed circuit board using angled prepreg
- Patent number 5,997,983
- Issue date Dec 7, 1999
- TeledyneIndustries, Inc.
- A. Roland Caron
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrahigh molecular weight polyethylene composite for printed circu...
- Patent number 5,972,484
- Issue date Oct 26, 1999
- Polyeitan Composites Ltd.
- Yachin Cohen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of making a composite laminate and a PWB substrate so made
- Patent number 5,874,152
- Issue date Feb 23, 1999
- AMP-AKzo Linlam VoF
- Erik Middelman
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Laminates for printed circuits using unidirectional glass fabric
- Patent number 5,807,793
- Issue date Sep 15, 1998
- Gividi Italia S.p.A.
- Diego Armando Scari
- D03 - WEAVING
Information Patent Grant
Warpwise unidirectional glass fabric with leno binding threads
- Patent number 5,752,550
- Issue date May 19, 1998
- Gividi Italia S.p.A.
- Diego A. Scari'
- D03 - WEAVING
Information Patent Grant
Method of manufacturing a UD-reinforced PWB laminate
- Patent number 5,662,761
- Issue date Sep 2, 1997
- AMP-Akzo Lin Lam VOF
- Erik Middelman
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of manufacturing a multilayer printed wire board
- Patent number 5,633,072
- Issue date May 27, 1997
- Akzo Nobel N.V.
- Erik Middelman
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing a multilayer printed wire board
- Patent number 5,592,737
- Issue date Jan 14, 1997
- Akzo Nobel N.V.
- Erik Middelman
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for making circuit boards by vacuum impregnation
- Patent number 5,512,224
- Issue date Apr 30, 1996
- Compositech Ltd.
- Jonas Medney
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Printed wire boards and method of making same
- Patent number 5,496,613
- Issue date Mar 5, 1996
- AMP-Akzo LinLim VOF
- Erik Middelman
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for making composite structures by filament winding
- Patent number 5,478,421
- Issue date Dec 26, 1995
- Compositech Ltd.
- Jonas Medney
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER INTERCONNECTED ELECTRO-THERMAL SYSTEM HAVING A THERMALL...
- Publication number 20190387615
- Publication date Dec 19, 2019
- Microsoft Technology Licensing, LLC
- Michael NIKKHOO
- G01 - MEASURING TESTING
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20190053371
- Publication date Feb 14, 2019
- Samsung Electronics Co., Ltd.
- Seung Yeol Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES
- Publication number 20120097431
- Publication date Apr 26, 2012
- Stablcor Technology, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES
- Publication number 20100319969
- Publication date Dec 23, 2010
- Stablcor, Inc.
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20100254098
- Publication date Oct 7, 2010
- Kyocera Corporation
- Yutaka Tsukada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fiber-Reinforced Resin and Method for Manufacturing the Same
- Publication number 20100136284
- Publication date Jun 3, 2010
- KYOCERA CORPORATION
- Masaaki Harazono
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
MULTILAYER-WIRED SUBSTRATE
- Publication number 20100051327
- Publication date Mar 4, 2010
- Toshinobu Ogatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070126095
- Publication date Jun 7, 2007
- Hitachi, Ltd
- Hisashi Tanie
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Polymer composite formed article, printed wiring board using the fo...
- Publication number 20070116938
- Publication date May 24, 2007
- Masayuki Tobita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Lightweight circuit board with conductive constraining cores
- Publication number 20050019541
- Publication date Jan 27, 2005
- Shri Diksha Corporation
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Lightweight circuit board with conductive constraining cores
- Publication number 20050019535
- Publication date Jan 27, 2005
- Shri Diksha Corporation
- Kalu K. Vasoya
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Selective PCB stiffening with preferentially oriented fibers
- Publication number 20040131824
- Publication date Jul 8, 2004
- Intel Corporation
- George Hsieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030170434
- Publication date Sep 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20030157307
- Publication date Aug 21, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lightweight circuit board with conductive constraining cores
- Publication number 20020157859
- Publication date Oct 31, 2002
- Kalu K. Vasoya
- B32 - LAYERED PRODUCTS
Information Patent Application
Circuit board and method for manufacturing the same
- Publication number 20020127379
- Publication date Sep 12, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Selective PCB stiffening with preferentially oriented fibers
- Publication number 20020076522
- Publication date Jun 20, 2002
- Intel Corporation
- George Hsieh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Unidirectional or parallel fibers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrally formed product, and composite material, terminal for ele...

Printed circuit board trace for galvanic effect reduction

Circuit board and semiconductor package using the same

Foldable display

Method of attaching electronic module on fabrics by stitching metal...

Multilayer-wired substrate

Circuit board, mounting structure, and method for manufacturing cir...

Lightweight circuit board with conductive constraining cores

Fiber-reinforced resin and method for manufacturing the same

Lightweight circuit board with conductive constraining cores

Lightweight circuit board with conductive constraining cores

Selective PCB stiffening with preferentially oriented fibers

Method for manufacturing a circuit board

Lightweight circuit board with conductive constraining cores

Circuit board and method for manufacturing the same

Selective PCB stiffening with preferentially oriented fibers

Circuit board and method for manufacturing the same

Polyolefin composites for printed circuit board and antenna base ma...

Method of manufacturing a multilayer printed wire board

Rigid/flex printed circuit board using angled prepreg

Ultrahigh molecular weight polyethylene composite for printed circu...

Method of making a composite laminate and a PWB substrate so made

Laminates for printed circuits using unidirectional glass fabric

Warpwise unidirectional glass fabric with leno binding threads

Method of manufacturing a UD-reinforced PWB laminate

Method of manufacturing a multilayer printed wire board

Method of manufacturing a multilayer printed wire board

Methods for making circuit boards by vacuum impregnation

Printed wire boards and method of making same

Method for making composite structures by filament winding

Patents Applicationslast 30 patents

MULTI-LAYER INTERCONNECTED ELECTRO-THERMAL SYSTEM HAVING A THERMALL...

CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE USING THE SAME

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

Fiber-Reinforced Resin and Method for Manufacturing the Same

MULTILAYER-WIRED SUBSTRATE

Semiconductor device and manufacturing method thereof

Polymer composite formed article, printed wiring board using the fo...

Lightweight circuit board with conductive constraining cores

Lightweight circuit board with conductive constraining cores

Selective PCB stiffening with preferentially oriented fibers

Circuit board and method for manufacturing the same

Circuit board and method for manufacturing the same

Lightweight circuit board with conductive constraining cores

Circuit board and method for manufacturing the same

Selective PCB stiffening with preferentially oriented fibers