Use, recovery or regeneration of abrasive mediums

Industry

CPC
B28D5/007

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B28Stoneworking B28DWORKING STONE OR STONE-LIKE MATERIALS B28D5/00Fine working of gems, jewels, crystals

Current Industry

B28D5/007Use, recovery or regeneration of abrasive mediums

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,311,455
- Issue date May 27, 2025
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for solving bright line scratched during lifting of large-si...
- Patent number 12,275,164
- Issue date Apr 15, 2025
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan Fu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for separating a plurality of slices from workpieces by mean...
- Patent number 12,251,767
- Issue date Mar 18, 2025
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable-step-distance micro-milling repair cutter path generating...
- Patent number 12,194,657
- Issue date Jan 14, 2025
- Harbin Institute of Technology
- Jian Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot wafering systems and methods for slicing a silicon ingot
- Patent number 12,115,699
- Issue date Oct 15, 2024
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw having dust collecting apparatus
- Patent number 12,109,729
- Issue date Oct 8, 2024
- EGUN CO., LTD.
- Sung Jun Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor wafers using a wire saw, wire sa...
- Patent number 12,083,705
- Issue date Sep 10, 2024
- Siltronic AG
- Axel Beyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for slicing workpiece and wire saw
- Patent number 11,958,160
- Issue date Apr 16, 2024
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of wafer
- Patent number 11,890,783
- Issue date Feb 6, 2024
- Disco Corporation
- Xiaoming Qiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slurry sprayers, adjustable supports for same, and methods for slic...
- Patent number 11,752,665
- Issue date Sep 12, 2023
- GlobalWafers Co., Ltd.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Cutting apparatus
- Patent number 11,521,867
- Issue date Dec 6, 2022
- Disco Corporation
- Satoshi Hanajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Peeling apparatus
- Patent number 11,358,306
- Issue date Jun 14, 2022
- Disco Corporation
- Kazuyuki Hinohara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus with auto chuck cleaning mechanism
- Patent number 11,338,472
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dividing apparatus
- Patent number 11,254,029
- Issue date Feb 22, 2022
- Disco Corporation
- Takayuki Masada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting apparatus
- Patent number 11,173,631
- Issue date Nov 16, 2021
- Disco Corporation
- Takeomi Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 11,167,446
- Issue date Nov 9, 2021
- Disco Corporation
- Naoko Yamamoto
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Cutting apparatus
- Patent number 11,018,031
- Issue date May 25, 2021
- Disco Corporation
- Hiromitsu Ueyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting blade mounting mechanism
- Patent number 10,974,364
- Issue date Apr 13, 2021
- Disco Corporation
- Kazuma Sekiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting apparatus
- Patent number 10,950,451
- Issue date Mar 16, 2021
- Disco Corporation
- Hisashi Arakida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Blade mounting and dismounting jig, blade mounting and dismounting...
- Patent number 10,933,500
- Issue date Mar 2, 2021
- Disco Corporation
- Hayato Kiuchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ingot clamping device and wire sawing apparatus for slicing ingot h...
- Patent number 10,882,214
- Issue date Jan 5, 2021
- SKSILTRON CO., LTD.
- Woo Tae Kim
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Chuck table and processing apparatus including the same
- Patent number 10,870,220
- Issue date Dec 22, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Saw wire and cutting apparatus
- Patent number 10,723,042
- Issue date Jul 28, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tomohiro Kanazawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor sawing method and system
- Patent number 10,703,016
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Chi-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting apparatus with auto chuck cleaning mechanism
- Patent number 10,695,952
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Tseng
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wire saw apparatus
- Patent number 10,589,446
- Issue date Mar 17, 2020
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Wafer processing method
- Patent number 10,562,207
- Issue date Feb 18, 2020
- Disco Corporation
- Kazuma Sekiya
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of processing workpiece including cutting step that uses cut...
- Patent number 10,522,405
- Issue date Dec 31, 2019
- Disco Corporation
- Kenji Takenouchi
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Ingot pressing apparatus and ingot slicing apparatus including the...
- Patent number 10,486,333
- Issue date Nov 26, 2019
- SK SILTRON CO., LTD.
- Su In Jeon
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for evaluating abrasive grains, and method for manufacturing...
- Patent number 10,416,145
- Issue date Sep 17, 2019
- Sumco Corporation
- Yuuji Minamihata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SPRAYER FOR SQUARING CRYSTAL ROD AND CRYSTAL ROD SQUARING DEVICE
- Publication number 20250083357
- Publication date Mar 13, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xiaopeng WANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD
- Publication number 20250083359
- Publication date Mar 13, 2025
- SEMES CO., LTD.
- Changhoon OK
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
UNDER-WIRE SPRAY CLEANING DEVICE FOR WIRE CUTTING MACHINE
- Publication number 20250073955
- Publication date Mar 6, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Yannan LI
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR CUTTING SILICON INGOT
- Publication number 20250050542
- Publication date Feb 13, 2025
- SUMCO CORPORATION
- Daisuke HASHIMOTO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS
- Publication number 20250026042
- Publication date Jan 23, 2025
- GLOBALWAFERS CO., LTD.
- Jung-Chiang Liao
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CLEANING DEVICE FOR NET MONITOR AND SLICER
- Publication number 20250018437
- Publication date Jan 16, 2025
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xuzhou YANG
- B08 - CLEANING
Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20240416556
- Publication date Dec 19, 2024
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...
- Publication number 20240416557
- Publication date Dec 19, 2024
- QINGDAO GAOCE TECHNOLOGY CO., LTD
- Shengen HOU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SYSTEM AND METHOD FOR SQUARING INGOT
- Publication number 20240253271
- Publication date Aug 1, 2024
- TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
- Xiaopeng WANG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20240246260
- Publication date Jul 25, 2024
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method for Solving Bright Line Scratched During Lifting of Large-si...
- Publication number 20240217139
- Publication date Jul 4, 2024
- GUANGDONG JINWAN GOKIN SOLAR TECHNOLOGY CO., LTD
- Mingquan FU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT
- Publication number 20230271348
- Publication date Aug 31, 2023
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...
- Publication number 20230234149
- Publication date Jul 27, 2023
- Siltronic AG
- Peter Wiesner
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...
- Publication number 20230050459
- Publication date Feb 16, 2023
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...
- Publication number 20220234250
- Publication date Jul 28, 2022
- Siltronic AG
- Georg PIETSCH
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
VARIABLE-STEP-DISTANCE MICRO-MILLING REPAIR CUTTER PATH GENERATING...
- Publication number 20220152873
- Publication date May 19, 2022
- HARBIN INSTITUTE OF TECHNOLOGY
- Jian Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...
- Publication number 20220040882
- Publication date Feb 10, 2022
- Siltronic AG
- Axel BEYER
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD
- Publication number 20220024073
- Publication date Jan 27, 2022
- GLOBALWAFERS CO., LTD.
- Ching-Shan Lin
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD FOR SLICING WORKPIECE AND WIRE SAW
- Publication number 20220016802
- Publication date Jan 20, 2022
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
PRODUCTION METHOD OF WAFER
- Publication number 20210339428
- Publication date Nov 4, 2021
- Disco Corporation
- Xiaoming QIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20210252742
- Publication date Aug 19, 2021
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING APPARATUS
- Publication number 20200391410
- Publication date Dec 17, 2020
- Disco Corporation
- Takeomi FUKUOKA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
METHOD AND APPARATUS FOR RESUMING THE WIRE SAWING PROCESS OF A WORK...
- Publication number 20200316817
- Publication date Oct 8, 2020
- Silteronic AG
- Alexander RIEGER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM
- Publication number 20200307022
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER DIVIDING APPARATUS
- Publication number 20200171707
- Publication date Jun 4, 2020
- Disco Corporation
- Takayuki MASADA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
SLURRY SPRAYERS, ADJUSTABLE SUPPORTS FOR SAME, AND METHODS FOR SLIC...
- Publication number 20200171706
- Publication date Jun 4, 2020
- GLOBALWAFERS CO., LTD.
- Chia Ming Liu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM
- Publication number 20200086527
- Publication date Mar 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min TSENG
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Semiconductor Sawing Method and System
- Publication number 20190389091
- Publication date Dec 26, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Chi-Hung Chen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CUTTING APPARATUS
- Publication number 20190326136
- Publication date Oct 24, 2019
- Disco Corporation
- Hiromitsu UEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING APPARATUS
- Publication number 20190295850
- Publication date Sep 26, 2019
- Disco Corporation
- Hisashi ARAKIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Use, recovery or regeneration of abrasive mediums

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for separating a plurality of slices from workpieces by mean...

Method for solving bright line scratched during lifting of large-si...

Method for separating a plurality of slices from workpieces by mean...

Variable-step-distance micro-milling repair cutter path generating...

Ingot wafering systems and methods for slicing a silicon ingot

Wire saw having dust collecting apparatus

Method for producing semiconductor wafers using a wire saw, wire sa...

Method for slicing workpiece and wire saw

Production method of wafer

Slurry sprayers, adjustable supports for same, and methods for slic...

Cutting apparatus

Peeling apparatus

Cutting apparatus with auto chuck cleaning mechanism

Wafer dividing apparatus

Cutting apparatus

Workpiece processing method

Cutting apparatus

Cutting blade mounting mechanism

Cutting apparatus

Blade mounting and dismounting jig, blade mounting and dismounting...

Ingot clamping device and wire sawing apparatus for slicing ingot h...

Chuck table and processing apparatus including the same

Saw wire and cutting apparatus

Semiconductor sawing method and system

Cutting apparatus with auto chuck cleaning mechanism

Wire saw apparatus

Wafer processing method

Method of processing workpiece including cutting step that uses cut...

Ingot pressing apparatus and ingot slicing apparatus including the...

Method for evaluating abrasive grains, and method for manufacturing...

Patents Applicationslast 30 patents

SPRAYER FOR SQUARING CRYSTAL ROD AND CRYSTAL ROD SQUARING DEVICE

SEMICONDUCTOR PACKAGE CUTTING SYSTEM AND METHOD

UNDER-WIRE SPRAY CLEANING DEVICE FOR WIRE CUTTING MACHINE

METHOD FOR CUTTING SILICON INGOT

METHODS FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS

CLEANING DEVICE FOR NET MONITOR AND SLICER

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

Cutting Device of Silicon Rod Cutting System, and Silicon Rod Cutti...

SYSTEM AND METHOD FOR SQUARING INGOT

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

Method for Solving Bright Line Scratched During Lifting of Large-si...

INGOT WAFERING SYSTEMS AND METHODS FOR SLICING A SILICON INGOT

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES BY MEAN...

METHOD FOR SEPARATING MULTIPLE SLICES OF WORKPIECES BY MEANS OF A W...

METHOD FOR SEPARATING A PLURALITY OF SLICES FROM WORKPIECES DURING...

VARIABLE-STEP-DISTANCE MICRO-MILLING REPAIR CUTTER PATH GENERATING...

METHOD FOR PRODUCING SEMICONDUCTOR WAFERS USING A WIRE SAW, WIRE SA...

CRYSTAL INGOT CUTTING DEVICE AND CRYSTAL INGOT CUTTING METHOD

METHOD FOR SLICING WORKPIECE AND WIRE SAW

PRODUCTION METHOD OF WAFER

WORKPIECE PROCESSING METHOD

CUTTING APPARATUS

METHOD AND APPARATUS FOR RESUMING THE WIRE SAWING PROCESS OF A WORK...

CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM

WAFER DIVIDING APPARATUS

SLURRY SPRAYERS, ADJUSTABLE SUPPORTS FOR SAME, AND METHODS FOR SLIC...

CUTTING APPARATUS WITH AUTO CHUCK CLEANING MECHANISM

Semiconductor Sawing Method and System

CUTTING APPARATUS

CUTTING APPARATUS