Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773

Industry

CPC
H05K2203/0776

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0776Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic circuit production method using 3D layer shaping
- Patent number 12,048,102
- Issue date Jul 23, 2024
- FUJI CORPORATION
- Ryojiro Tominaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated pressure control system and method for a cleaner
- Patent number 11,975,343
- Issue date May 7, 2024
- Illinois Tool Works Inc.
- Eric Wayne Becker
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Resin composition, and prepreg, metal-clad laminate, and printed ci...
- Patent number 11,414,532
- Issue date Aug 16, 2022
- Taiwan Union Technology Corporation
- Chih-Wei Liao
- G01 - MEASURING TESTING
Information Patent Grant
Manufacturing method of display panel
- Patent number 11,414,774
- Issue date Aug 16, 2022
- Jinyang Zhao
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for repairing conductor tracks
- Patent number 11,419,219
- Issue date Aug 16, 2022
- XTPL S.A.
- Piotr Kowalczewski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for bonding electronic components on substrates...
- Patent number 11,337,312
- Issue date May 17, 2022
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming redistribution layer using photo-sintering
- Patent number 11,229,124
- Issue date Jan 18, 2022
- Research & Business Foundation Sungkyunkwan University
- SeungBoo Jung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a flexible circuit to other structures
- Patent number 11,219,124
- Issue date Jan 4, 2022
- Microsoft Technology Licensing, LLC
- James David Holbery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microetchant for copper and method for producing wiring board
- Patent number 11,053,594
- Issue date Jul 6, 2021
- MEC Company Ltd.
- Keisuke Matsumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
LED-based UV radiation source machine
- Patent number 10,980,128
- Issue date Apr 13, 2021
- Brian A. Stumm
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Structure, wiring board, substrate for wiring board, copper clad la...
- Patent number 10,912,193
- Issue date Feb 2, 2021
- Kabushiki Kaisha Toshiba
- Hajime Nakashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slot die with variable nozzles
- Patent number 10,820,424
- Issue date Oct 27, 2020
- SUNG AN MACHINERY CO., LTD.
- Yong Sung Kim
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method and apparatus for improving drilling electronics performance
- Patent number 10,595,418
- Issue date Mar 17, 2020
- China Petroleum and Chemical Corporation
- Sheng Zhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED-based UV radiation source machine to process coatings
- Patent number 10,548,226
- Issue date Jan 28, 2020
- Brian A. Stumm
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Printed circuit board and electronic component
- Patent number 10,537,020
- Issue date Jan 14, 2020
- Sumitomo Electric Industries, Ltd.
- Kohei Okamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and process for producing it
- Patent number 10,448,506
- Issue date Oct 15, 2019
- AGC Inc.
- Tomoya Hosoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,368,438
- Issue date Jul 30, 2019
- Ibiden Co., Ltd.
- Hiroyuki Nishioka
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multilayer circuit board and method of manufacturing the same
- Patent number 10,349,533
- Issue date Jul 9, 2019
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Li-Kun Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting a flexible circuit to other structures
- Patent number 10,327,332
- Issue date Jun 18, 2019
- Microsoft Technology Licensing, LLC
- James David Holbery
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method for forming substrate structure comprising vias
- Patent number 10,306,767
- Issue date May 28, 2019
- UNIFLEX Technology Inc.
- Yi-Chun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Biodegradable materials for multilayer transient printed circuit bo...
- Patent number 10,292,263
- Issue date May 14, 2019
- The Board of Trustees of the University of Illinois
- John A. Rogers
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tamper-proof electronic packages with two-phase dielectric fluid
- Patent number 10,169,624
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Levi A. Campbell
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Materials, electronic systems and modes for active and passive tran...
- Patent number 10,154,592
- Issue date Dec 11, 2018
- The Board of Trustees of the University of Illinois
- John A. Rogers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pretreatment agent for electroless plating, and pretreatment and pr...
- Patent number 10,138,558
- Issue date Nov 27, 2018
- C. Uyemura & Co., Ltd.
- Yoshikazu Saijo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Transient electronic devices comprising inorganic or hybrid inorgan...
- Patent number 10,143,086
- Issue date Nov 27, 2018
- The Board of Trustees of the University of Illinois
- John A. Rogers
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LED-based UV radiation source machine to process coatings
- Patent number 10,111,337
- Issue date Oct 23, 2018
- Brian A. Stumm
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing conductive layer and wiring board
- Patent number 10,015,890
- Issue date Jul 3, 2018
- Fujikura Ltd.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Recyclable circuit assembly
- Patent number 9,706,693
- Issue date Jul 11, 2017
- IN2TEC LIMITED
- Christopher Hunt
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
Component Carrier and Method Manufacturing the Same
- Publication number 20240334613
- Publication date Oct 3, 2024
- AT&S (Chongqing) Company Limited
- JyunMin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED PRESSURE CONTROL SYSTEM AND METHOD FOR A CLEANER
- Publication number 20240139764
- Publication date May 2, 2024
- Illinois Tool Works Inc.
- Eric Wayne Becker
- B08 - CLEANING
Information Patent Application
ELECTRONIC CIRCUIT HAVING GRAPHENE OXIDE PAPER SUBSTRATE AND METHOD...
- Publication number 20230049337
- Publication date Feb 16, 2023
- The Royal Institution for the advancement of Learning/McGill University
- Thomas SZKOPEK
- D21 - PAPER-MAKING PRODUCTION OF CELLULOSE
Information Patent Application
ELECTRONIC CIRCUIT PRODUCTION METHOD USING 3D LAYER SHAPING
- Publication number 20220279657
- Publication date Sep 1, 2022
- FUJI CORPORATION
- Ryojiro TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...
- Publication number 20220251712
- Publication date Aug 11, 2022
- NEXT INNOVATION INC.
- Hiroshi Michiwaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR BONDING ELECTRONIC COMPONENTS ON SUBSTRATES...
- Publication number 20220078917
- Publication date Mar 10, 2022
- Palo Alto Research Center Incorporated
- Ping Mei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVELY APPLIED PROTECTIVE LAYER ON EXPOSED MATERIALS OF ELECTR...
- Publication number 20210410292
- Publication date Dec 30, 2021
- Intel Corporation
- Jin YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR REPAIRING CONDUCTOR TRACKS
- Publication number 20210227700
- Publication date Jul 22, 2021
- Piotr KOWALCZEWSKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...
- Publication number 20200214126
- Publication date Jul 2, 2020
- KABUSHIKI KAISHA TOSHIBA
- Hajime NAKASHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
- Publication number 20200170118
- Publication date May 28, 2020
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20200141010
- Publication date May 7, 2020
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FORMING REDISTRIBUTION LAYER USING PHOTO-SINTERING
- Publication number 20190335590
- Publication date Oct 31, 2019
- Research & Business Foundation Sungkyunkwan University
- SeungBoo JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELF-ORIENTATION AND SELF-PLACEMENT OF COMPUTING DEVICES IN A FLUID
- Publication number 20190313533
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Spyridon Skordas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Improving Drilling Electronics Performance
- Publication number 20190208644
- Publication date Jul 4, 2019
- China Petroleum and Chemical Corporation
- Sheng ZHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUTYLPYRROLIDONE BASED CLEANING AGENT FOR REMOVAL OF CONTAMINATES F...
- Publication number 20190136159
- Publication date May 9, 2019
- Kyzen Corporation
- Kyle J Doyel
- B08 - CLEANING
Information Patent Application
SLOT DIE WITH VARIABLE NOZZLES
- Publication number 20190141838
- Publication date May 9, 2019
- Yong Sung KIM
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING SUBSTRATE AND PROCESS FOR PRODUCING IT
- Publication number 20190141833
- Publication date May 9, 2019
- AGC Inc.
- Tomoya HOSODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD
- Publication number 20190003062
- Publication date Jan 3, 2019
- MEC COMPANY LTD.
- Keisuke MATSUMOTO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MANUFACTURING METHOD FOR FORMING SUBSTRATE STRUCTURE COMPRISING VIAS
- Publication number 20190008049
- Publication date Jan 3, 2019
- UNIFLEX Technology Inc.
- Yi-Chun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY SURFACES AND ME...
- Publication number 20180312978
- Publication date Nov 1, 2018
- Atotech Deutschland GmbH
- Tatjana CUKIC
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD
- Publication number 20180223412
- Publication date Aug 9, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Satoshi MOGI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TAMPER-PROOF ELECTRONIC PACKAGES WITH TWO-PHASE DIELECTRIC FLUID
- Publication number 20180107848
- Publication date Apr 19, 2018
- International Business Machines Corporation
- Levi A. CAMPBELL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PR...
- Publication number 20180023197
- Publication date Jan 25, 2018
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD
- Publication number 20180027668
- Publication date Jan 25, 2018
- FUJIKURA LTD.
- Masahiro Kaizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170303396
- Publication date Oct 19, 2017
- IBIDEN CO., LTD.
- Hiroyuki Nishioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS
- Publication number 20150351253
- Publication date Dec 3, 2015
- IMEC
- Ann Witvrouw
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PR...
- Publication number 20150072070
- Publication date Mar 12, 2015
- C. Uyemura & Co., Ltd.
- Yoshikazu SAIJO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRAN...
- Publication number 20140323968
- Publication date Oct 30, 2014
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
TRANSIENT ELECTRONIC DEVICES COMPRISING INORGANIC OR HYBRID INORGAN...
- Publication number 20140305900
- Publication date Oct 16, 2014
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John A. ROGERS
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
CONTROL MODULE AND METHOD FOR PRODUCING SAME
- Publication number 20130314878
- Publication date Nov 28, 2013
- ROBERT BOSCH GmbH
- Harald Ott
- H01 - BASIC ELECTRIC ELEMENTS

Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic circuit production method using 3D layer shaping

Automated pressure control system and method for a cleaner

Resin composition, and prepreg, metal-clad laminate, and printed ci...

Manufacturing method of display panel

Method for repairing conductor tracks

Systems and methods for bonding electronic components on substrates...

Method for forming redistribution layer using photo-sintering

Connecting a flexible circuit to other structures

Method for manufacturing ceramic circuit board

Microetchant for copper and method for producing wiring board

LED-based UV radiation source machine

Structure, wiring board, substrate for wiring board, copper clad la...

Slot die with variable nozzles

Method and apparatus for improving drilling electronics performance

LED-based UV radiation source machine to process coatings

Printed circuit board and electronic component

Wiring substrate and process for producing it

Printed wiring board and method for manufacturing the same

Multilayer circuit board and method of manufacturing the same

Connecting a flexible circuit to other structures

Manufacturing method for forming substrate structure comprising vias

Biodegradable materials for multilayer transient printed circuit bo...

Roughened copper foil, copper clad laminate, and printed circuit board

Tamper-proof electronic packages with two-phase dielectric fluid

Materials, electronic systems and modes for active and passive tran...

Pretreatment agent for electroless plating, and pretreatment and pr...

Transient electronic devices comprising inorganic or hybrid inorgan...

LED-based UV radiation source machine to process coatings

Method of manufacturing conductive layer and wiring board

Recyclable circuit assembly

Patents Applicationslast 30 patents

Component Carrier and Method Manufacturing the Same

AUTOMATED PRESSURE CONTROL SYSTEM AND METHOD FOR A CLEANER

ELECTRONIC CIRCUIT HAVING GRAPHENE OXIDE PAPER SUBSTRATE AND METHOD...

ELECTRONIC CIRCUIT PRODUCTION METHOD USING 3D LAYER SHAPING

INSULATION LAYER FORMATION METHOD, MEMBER WITH INSULATION LAYER, RE...

SYSTEMS AND METHODS FOR BONDING ELECTRONIC COMPONENTS ON SUBSTRATES...

SELECTIVELY APPLIED PROTECTIVE LAYER ON EXPOSED MATERIALS OF ELECTR...

METHOD FOR REPAIRING CONDUCTOR TRACKS

STRUCTURE, WIRING BOARD, SUBSTRATE FOR WIRING BOARD, COPPER CLAD LA...

METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

METHOD FOR FORMING REDISTRIBUTION LAYER USING PHOTO-SINTERING

SELF-ORIENTATION AND SELF-PLACEMENT OF COMPUTING DEVICES IN A FLUID

Method and Apparatus for Improving Drilling Electronics Performance

BUTYLPYRROLIDONE BASED CLEANING AGENT FOR REMOVAL OF CONTAMINATES F...

SLOT DIE WITH VARIABLE NOZZLES

WIRING SUBSTRATE AND PROCESS FOR PRODUCING IT

MICROETCHANT FOR COPPER AND METHOD FOR PRODUCING WIRING BOARD

MANUFACTURING METHOD FOR FORMING SUBSTRATE STRUCTURE COMPRISING VIAS

SURFACE TREATMENT AGENT FOR COPPER AND COPPER ALLOY SURFACES AND ME...

ROUGHENED COPPER FOIL, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD

TAMPER-PROOF ELECTRONIC PACKAGES WITH TWO-PHASE DIELECTRIC FLUID

PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PR...

METHOD OF MANUFACTURING CONDUCTIVE LAYER AND WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD AND APPARATUS FOR FLUID GUIDED SELF-ASSEMBLY OF MICROCOMPONENTS

PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT AND PR...

MATERIALS, ELECTRONIC SYSTEMS AND MODES FOR ACTIVE AND PASSIVE TRAN...

TRANSIENT ELECTRONIC DEVICES COMPRISING INORGANIC OR HYBRID INORGAN...

CONTROL MODULE AND METHOD FOR PRODUCING SAME