using a coherent radiation

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H01L21/02354

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/02354using a coherent radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solid body and multi-component arrangement
- Patent number 12,211,702
- Issue date Jan 28, 2025
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,191,287
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of treating target film and method of manufacturing semicond...
- Patent number 11,978,626
- Issue date May 7, 2024
- SK Hynix Inc.
- Won Tae Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure
- Patent number 11,817,437
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing gallium nitride semiconductor device
- Patent number 11,784,039
- Issue date Oct 10, 2023
- Denso Corporation
- Jun Kojima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge exclusion apparatus and methods of using the same
- Patent number 11,664,220
- Issue date May 30, 2023
- Canon Kabushiki Kaisha
- Byung-Jin Choi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Base substrate, functional element, and method for manufacturing ba...
- Patent number 11,437,233
- Issue date Sep 6, 2022
- NGK Insulators, Ltd.
- Masashi Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die containing silicon nitride stress compensating re...
- Patent number 11,430,745
- Issue date Aug 30, 2022
- SanDisk Technologies LLC
- Chen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus
- Patent number 11,282,699
- Issue date Mar 22, 2022
- Tokyo Electron Limited
- Syuji Nozawa
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method of forming package structure
- Patent number 11,164,852
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for manufacturing flexible light emission device
- Patent number 11,088,122
- Issue date Aug 10, 2021
- SAKAI DISPLAY PRODUCTS CORPORATION
- Katsuhiko Kishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing wafer
- Patent number 11,075,071
- Issue date Jul 27, 2021
- Tokyo Seimitsu Co., Ltd.
- Ryosuke Kataoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package thermal conduit
- Patent number 11,004,680
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning solid body layers provided with components
- Patent number 10,978,311
- Issue date Apr 13, 2021
- Siltectra GmbH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fuse element resistance enhancement by laser anneal and ion implant...
- Patent number 10,903,162
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Liying Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film and method of manufacturing the same
- Patent number 10,879,208
- Issue date Dec 29, 2020
- Samsung Electronics Co., Ltd.
- Jae Min Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device production system
- Patent number 10,879,272
- Issue date Dec 29, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carbide, nitride and silicide enhancers for laser absorption
- Patent number 10,854,554
- Issue date Dec 1, 2020
- Ferro Corporation
- Joseph E. Sarver
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,685,867
- Issue date Jun 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device production system
- Patent number 10,515,983
- Issue date Dec 24, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for polymer-assisted chip transfer
- Patent number 10,388,516
- Issue date Aug 20, 2019
- Facebook Technologies, LLC
- Oscar Torrents Abad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device production system
- Patent number 10,361,222
- Issue date Jul 23, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and method of forming thereof
- Patent number 10,204,889
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compositions and methods using same for carbon doped silicon contai...
- Patent number 10,145,008
- Issue date Dec 4, 2018
- VERSUM MATERIALS US, LLC
- Haripin Chandra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bottom processing
- Patent number 10,128,197
- Issue date Nov 13, 2018
- Applied Materials, Inc.
- Joseph M. Ranish
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of semiconductor integrated circuit fabrication
- Patent number 10,115,624
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Raster-planarized substrate interlayers and methods of planarizing...
- Patent number 10,068,776
- Issue date Sep 4, 2018
- Intel Corporation
- Frank Truong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for laser annealing with laser beam radiated via through hole
- Patent number 10,020,193
- Issue date Jul 10, 2018
- TDK Corporation
- Koji Shimazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device production system
- Patent number 9,899,419
- Issue date Feb 20, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sacrificial layer for post-laser debris removal systems
- Patent number 9,779,932
- Issue date Oct 3, 2017
- SUSS MICROTEC PHOTONIC SYSTEMS INC.
- Habib Hichri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME
- Publication number 20240420951
- Publication date Dec 19, 2024
- FENG CHIA UNIVERSITY
- Chang-Ho YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20240412970
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Kiyotaka IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE METHOD FOR SECURITY BARRIERS
- Publication number 20240379582
- Publication date Nov 14, 2024
- Raytheon Company
- Christopher J. Bett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20240290613
- Publication date Aug 29, 2024
- Disco Corporation
- Naoki KITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY THERMAL TREATMENT U...
- Publication number 20240249937
- Publication date Jul 25, 2024
- SK HYNIX INC.
- Won Tae KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES
- Publication number 20240112971
- Publication date Apr 4, 2024
- Intel Corporation
- Yiqun Bai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240014192
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...
- Publication number 20230367941
- Publication date Nov 16, 2023
- Applied Materials, Inc.
- Pradeep Subrahmanyan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE
- Publication number 20230317873
- Publication date Oct 5, 2023
- ENKRIS SEMICONDUCTOR, INC.
- Kai CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230197442
- Publication date Jun 22, 2023
- DENSO CORPORATION
- TAKASHI USHIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF TREATING TARGET FILM AND METHOD OF MANUFACTURING SEMICOND...
- Publication number 20230005742
- Publication date Jan 5, 2023
- SK HYNIX INC.
- Won Tae KOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Fabrication of Lead Selenide Thin Film
- Publication number 20220359226
- Publication date Nov 10, 2022
- United States of America, as Represented by the Secretary of the Navy
- Joel T. Harrison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR UNIFORMLY IRRADIATING A FRAME OF A PROCESSED...
- Publication number 20220088714
- Publication date Mar 24, 2022
- Laser Systems & Solutions of Europe
- Fulvio MAZZAMUTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20220059515
- Publication date Feb 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20210327702
- Publication date Oct 21, 2021
- DENSO CORPORATION
- Jun KOJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE CONTAINING SILICON NITRIDE STRESS COMPENSATING RE...
- Publication number 20210272912
- Publication date Sep 2, 2021
- SANDISK TECHNOLOGIES LLC
- Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
- Publication number 20210272804
- Publication date Sep 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid Body and Multi-Component Arrangement
- Publication number 20210225659
- Publication date Jul 22, 2021
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM
- Publication number 20210118916
- Publication date Apr 22, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EDGE EXCLUSION APPARATUS AND METHODS OF USING THE SAME
- Publication number 20210104400
- Publication date Apr 8, 2021
- Canon Kabushiki Kaisha
- Byung-Jin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20200294797
- Publication date Sep 17, 2020
- TOKYO ELECTRON LIMITED
- Syuji NOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUSE ELEMENT RESISTANCE ENHANCEMENT BY LASER ANNEAL AND ION IMPLANT...
- Publication number 20200286827
- Publication date Sep 10, 2020
- International Business Machines Corporation
- Liying Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING WAFER
- Publication number 20200266047
- Publication date Aug 20, 2020
- TOKYO SEIMITSU CO., LTD.
- Ryosuke KATAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM
- Publication number 20200135770
- Publication date Apr 30, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Thinning Solid Body Layers Provided with Components
- Publication number 20200066542
- Publication date Feb 27, 2020
- SILTECTRA GMBH
- Wolfram Drescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM
- Publication number 20190341404
- Publication date Nov 7, 2019
- Semiconductor Energy Laboratory Co., Ltd.
- Atsuo Isobe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbide, Nitride And Silicide Enhancers For Laser Absorption
- Publication number 20190229067
- Publication date Jul 25, 2019
- FERRO CORPORATION
- Joseph E. Sarver
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE
- Publication number 20190172818
- Publication date Jun 6, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION
- Publication number 20190067083
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- De-Wei YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A 3-DIMENSIONAL PRINTING PROCESS FOR INTEGRATED MAGNETICS
- Publication number 20180286940
- Publication date Oct 4, 2018
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Lulu PENG
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

using a coherent radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solid body and multi-component arrangement

Package structure

Method of treating target film and method of manufacturing semicond...

Method of forming package structure

Method for manufacturing gallium nitride semiconductor device

Edge exclusion apparatus and methods of using the same

Base substrate, functional element, and method for manufacturing ba...

Semiconductor die containing silicon nitride stress compensating re...

Substrate processing apparatus

Method of forming package structure

Method and device for manufacturing flexible light emission device

Method for processing wafer

Semiconductor device package thermal conduit

Method for thinning solid body layers provided with components

Fuse element resistance enhancement by laser anneal and ion implant...

Chip-on-film and method of manufacturing the same

Semiconductor device and semiconductor device production system

Carbide, nitride and silicide enhancers for laser absorption

Method of semiconductor integrated circuit fabrication

Semiconductor device and semiconductor device production system

Method for polymer-assisted chip transfer

Semiconductor device and semiconductor device production system

Package structure and method of forming thereof

Compositions and methods using same for carbon doped silicon contai...

Bottom processing

Method of semiconductor integrated circuit fabrication

Raster-planarized substrate interlayers and methods of planarizing...

Method for laser annealing with laser beam radiated via through hole

Semiconductor device and semiconductor device production system

Sacrificial layer for post-laser debris removal systems

Patents Applicationslast 30 patents

SEMICONDUCTOR PROCESSING EQUIPMENT PART AND METHOD FOR MAKING THE SAME

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

SCALABLE METHOD FOR SECURITY BARRIERS

WAFER PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY THERMAL TREATMENT U...

SINGULATION OF INTEGRATED CIRCUIT PACKAGE SUBSTRATES WITH GLASS CORES

PACKAGE STRUCTURE

DOSE MAPPING USING SUBSTRATE CURVATURE TO COMPENSATE FOR OUT-OF-PLA...

SUBSTRATE STRIPPING METHOD FOR SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF TREATING TARGET FILM AND METHOD OF MANUFACTURING SEMICOND...

Laser Fabrication of Lead Selenide Thin Film

METHOD AND SYSTEM FOR UNIFORMLY IRRADIATING A FRAME OF A PROCESSED...

METHOD OF FORMING PACKAGE STRUCTURE

METHOD FOR MANUFACTURING GALLIUM NITRIDE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE CONTAINING SILICON NITRIDE STRESS COMPENSATING RE...

SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT

Solid Body and Multi-Component Arrangement

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM

EDGE EXCLUSION APPARATUS AND METHODS OF USING THE SAME

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

FUSE ELEMENT RESISTANCE ENHANCEMENT BY LASER ANNEAL AND ION IMPLANT...

METHOD FOR PROCESSING WAFER

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM

Method for Thinning Solid Body Layers Provided with Components

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PRODUCTION SYSTEM

Carbide, Nitride And Silicide Enhancers For Laser Absorption

METHOD OF FORMING PACKAGE STRUCTURE

METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION

A 3-DIMENSIONAL PRINTING PROCESS FOR INTEGRATED MAGNETICS