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H01L21/76894

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76894using a laser

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate dividing method using an expansion tape and a roller
- Patent number 12,295,174
- Issue date May 6, 2025
- Disco Corporation
- Masamitsu Agari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of wafer and chips and position adjustment me...
- Patent number 12,263,539
- Issue date Apr 1, 2025
- Disco Corporation
- Kazuki Hashimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 12,033,926
- Issue date Jul 9, 2024
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including laser treatm...
- Patent number 12,009,255
- Issue date Jun 11, 2024
- RNR LAB INC.
- Jeong Do Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,764,227
- Issue date Sep 19, 2023
- BOE Technology Group Co., Ltd.
- Chunping Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,705,368
- Issue date Jul 18, 2023
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of wafer
- Patent number 11,600,513
- Issue date Mar 7, 2023
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser marked code pattern for representing tracing number of chip
- Patent number 11,562,928
- Issue date Jan 24, 2023
- OmniVision Technologies, Inc.
- Wei-Feng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method including uniting wafer, ring frame and pol...
- Patent number 11,545,393
- Issue date Jan 3, 2023
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display substrate, method of testing the same, and display device i...
- Patent number 11,543,709
- Issue date Jan 3, 2023
- Samsung Display Co., Ltd.
- Seung-Kyu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for increasing the electrical functionality, and/or service...
- Patent number 11,521,899
- Issue date Dec 6, 2022
- Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Christoph Friedrich Bayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display device and method for repairing wire break...
- Patent number 11,515,336
- Issue date Nov 29, 2022
- FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shanshan Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for array substrate
- Patent number 11,443,945
- Issue date Sep 13, 2022
- TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Jinyang Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a thin-film solar module
- Patent number 11,444,217
- Issue date Sep 13, 2022
- CNBM RESEARCH INSTITUTE FOR ADVANCED GLASS MATERIALS GROUP CO., LTD.
- Andreas Heiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dividing method
- Patent number 11,424,162
- Issue date Aug 23, 2022
- Hamamatsu Photonics K.K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method
- Patent number 11,424,161
- Issue date Aug 23, 2022
- Disco Corporation
- Karl Heinz Priewasser
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,393,721
- Issue date Jul 19, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
- Patent number 11,380,588
- Issue date Jul 5, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
- Patent number 11,380,587
- Issue date Jul 5, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 11,322,403
- Issue date May 3, 2022
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method including applying a polyester sheet to a w...
- Patent number 11,322,407
- Issue date May 3, 2022
- Disco Corporation
- Shigenori Harada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing backside metalized compound semiconductor...
- Patent number 11,264,231
- Issue date Mar 1, 2022
- Xiamen Sanan Integrated Circuit Co., Ltd.
- Tsung-Te Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repairing metal wire(s) and external connection wire(s) of a displa...
- Patent number 11,222,819
- Issue date Jan 11, 2022
- HKC CORPORATION LIMITED
- Bei Zhou Huang
- G02 - OPTICS
Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 11,189,518
- Issue date Nov 30, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
- Patent number 11,145,582
- Issue date Oct 12, 2021
- STMicroelectronics S.r.l.
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,121,031
- Issue date Sep 14, 2021
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
- Patent number 11,114,252
- Issue date Sep 7, 2021
- CPC CORPORATION, TAIWAN
- Kuan-Chieh Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and methods of manufacturing the same
- Patent number 11,114,370
- Issue date Sep 7, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside inductor using through silicon vias
- Patent number 11,101,211
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Hassan Naser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package authentication feature
- Patent number 11,063,000
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Stefan Dankowski
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE
- Publication number 20250201605
- Publication date Jun 19, 2025
- Intel Corporation
- Sonja Koller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION
- Publication number 20250096113
- Publication date Mar 20, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING
- Publication number 20240429095
- Publication date Dec 26, 2024
- STMicroelectronics International N.V.
- Shei Meng LOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240404899
- Publication date Dec 5, 2024
- Innolux Corporation
- Ching-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIES
- Publication number 20240371693
- Publication date Nov 7, 2024
- Corning Incorporated
- Andreas Simon Gaab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM CUT WITH QRATE ADJUSTMENT
- Publication number 20240286224
- Publication date Aug 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Joseph Yehle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING
- Publication number 20240227075
- Publication date Jul 11, 2024
- SEMES CO., LTD.
- Tae Shin KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240170330
- Publication date May 23, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chanhoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF PROCESSING APPARATUS AND PROCESSING SYSTEM
- Publication number 20240153820
- Publication date May 9, 2024
- PlayNitride Display Co., Ltd.
- Chang-Rong Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING
- Publication number 20240131624
- Publication date Apr 25, 2024
- SEMES CO., LTD.
- Tae Shin KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SE...
- Publication number 20230360928
- Publication date Nov 9, 2023
- STMicroelectronics S.r.l
- Marco ROVITTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20230154794
- Publication date May 18, 2023
- Disco Corporation
- Yukinobu OHURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND DEVICE FOR REPAIRING CIRCUIT ON ARRAY SUBSTRATE, AND ARR...
- Publication number 20230126811
- Publication date Apr 27, 2023
- CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Tianhui QIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REPAIRING SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20230048168
- Publication date Feb 16, 2023
- InnoLux Corporation
- Ming-Chuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20230039486
- Publication date Feb 9, 2023
- Disco Corporation
- Masamitsu AGARI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20220352026
- Publication date Nov 3, 2022
- HAMAMATSU PHOTONICS K. K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHODS OF WAFER AND CHIPS AND POSITION ADJUSTMENT ME...
- Publication number 20220288722
- Publication date Sep 15, 2022
- Disco Corporation
- Kazuki HASHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DEFECT REPAIRING METHOD OF SAME
- Publication number 20220187664
- Publication date Jun 16, 2022
- Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Jing ZHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND METHOD OF RESTORING VERTICAL DARK LINES OF DISPLA...
- Publication number 20220050345
- Publication date Feb 17, 2022
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Mengyang LIU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
- Publication number 20220028769
- Publication date Jan 27, 2022
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210375676
- Publication date Dec 2, 2021
- RNR LAB INC.
- Jeong Do RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20210343591
- Publication date Nov 4, 2021
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20210335667
- Publication date Oct 28, 2021
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INCREASING THE ELECTRICAL FUNCTIONALITY, AND/OR SERVICE...
- Publication number 20210327755
- Publication date Oct 21, 2021
- Fraunhofer Gesellschaft zur Foerderung der angewandten Forschung e.V.
- Christoph Friedrich BAYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD
- Publication number 20210225703
- Publication date Jul 22, 2021
- HKC Corporation Limited
- BEI ZHOU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DIVIDING METHOD
- Publication number 20210210387
- Publication date Jul 8, 2021
- HAMAMATSU PHOTONICS K. K.
- Yoshimaro Fujii
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20210151342
- Publication date May 20, 2021
- Advanced Semiconductor Engineering, Inc.
- Yan Ting SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20210143064
- Publication date May 13, 2021
- Disco Corporation
- Shigenori HARADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20210134712
- Publication date May 6, 2021
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, METHOD OF TESTING THE SAME, AND DISPLAY DEVICE I...
- Publication number 20210134840
- Publication date May 6, 2021
- SAMSUNG DISPLAY CO., LTD.
- Seung-Kyu LEE
- H01 - BASIC ELECTRIC ELEMENTS

using a laser

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate dividing method using an expansion tape and a roller

Manufacturing methods of wafer and chips and position adjustment me...

Method of manufacturing semiconductor devices with a paddle and ele...

Method of manufacturing semiconductor device including laser treatm...

Array substrate, display panel and display device

Manufacturing method of chip package and chip package

Processing method of wafer

Laser marked code pattern for representing tracing number of chip

Wafer processing method including uniting wafer, ring frame and pol...

Display substrate, method of testing the same, and display device i...

Method for increasing the electrical functionality, and/or service...

Array substrate, display device and method for repairing wire break...

Manufacturing method for array substrate

Method for producing a thin-film solar module

Substrate dividing method

Substrate processing method

Wafer processing method

Wafer processing method including uniting a wafer, a ring frame and...

Wafer processing method including uniting a wafer, a ring frame and...

Wafer processing method

Wafer processing method including applying a polyester sheet to a w...

Method for manufacturing backside metalized compound semiconductor...

Repairing metal wire(s) and external connection wire(s) of a displa...

Method of processing a semiconductor wafer

Method of manufacturing semiconductor devices with a paddle and ele...

Manufacturing method of chip package and chip package

Method for manufacturing perovskite solar cell module and perovskit...

Semiconductor device packages and methods of manufacturing the same

Semiconductor device with backside inductor using through silicon vias

Semiconductor package authentication feature

Patents Applicationslast 30 patents

ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION

MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIES

TRIM CUT WITH QRATE ADJUSTMENT

SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING

SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME

PROCESSING METHOD OF PROCESSING APPARATUS AND PROCESSING SYSTEM

SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SE...

METHOD OF PROCESSING WAFER

METHOD AND DEVICE FOR REPAIRING CIRCUIT ON ARRAY SUBSTRATE, AND ARR...

METHOD FOR REPAIRING SUBSTRATE AND ELECTRONIC DEVICE

SUBSTRATE DIVIDING METHOD

SUBSTRATE DIVIDING METHOD

MANUFACTURING METHODS OF WAFER AND CHIPS AND POSITION ADJUSTMENT ME...

DISPLAY PANEL AND DEFECT REPAIRING METHOD OF SAME

DISPLAY PANEL AND METHOD OF RESTORING VERTICAL DARK LINES OF DISPLA...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

PROCESSING METHOD OF WAFER

METHOD FOR INCREASING THE ELECTRICAL FUNCTIONALITY, AND/OR SERVICE...

DISPLAY PANEL AND MANUFACTURING METHOD

SUBSTRATE DIVIDING METHOD

METHOD OF PROCESSING A SEMICONDUCTOR WAFER

WAFER PROCESSING METHOD

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

DISPLAY SUBSTRATE, METHOD OF TESTING THE SAME, AND DISPLAY DEVICE I...