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ELECTRICITY
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Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/76894
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Patents Grants
last 30 patents
Information
Patent Grant
Substrate dividing method using an expansion tape and a roller
Patent number
12,295,174
Issue date
May 6, 2025
Disco Corporation
Masamitsu Agari
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing methods of wafer and chips and position adjustment me...
Patent number
12,263,539
Issue date
Apr 1, 2025
Disco Corporation
Kazuki Hashimoto
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
Patent number
12,033,926
Issue date
Jul 9, 2024
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device including laser treatm...
Patent number
12,009,255
Issue date
Jun 11, 2024
RNR LAB INC.
Jeong Do Ryu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, display panel and display device
Patent number
11,764,227
Issue date
Sep 19, 2023
BOE Technology Group Co., Ltd.
Chunping Long
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,705,368
Issue date
Jul 18, 2023
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processing method of wafer
Patent number
11,600,513
Issue date
Mar 7, 2023
Disco Corporation
Masaru Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laser marked code pattern for representing tracing number of chip
Patent number
11,562,928
Issue date
Jan 24, 2023
OmniVision Technologies, Inc.
Wei-Feng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer processing method including uniting wafer, ring frame and pol...
Patent number
11,545,393
Issue date
Jan 3, 2023
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Display substrate, method of testing the same, and display device i...
Patent number
11,543,709
Issue date
Jan 3, 2023
Samsung Display Co., Ltd.
Seung-Kyu Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for increasing the electrical functionality, and/or service...
Patent number
11,521,899
Issue date
Dec 6, 2022
Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christoph Friedrich Bayer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate, display device and method for repairing wire break...
Patent number
11,515,336
Issue date
Nov 29, 2022
FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
Shanshan Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method for array substrate
Patent number
11,443,945
Issue date
Sep 13, 2022
TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Jinyang Zhao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing a thin-film solar module
Patent number
11,444,217
Issue date
Sep 13, 2022
CNBM RESEARCH INSTITUTE FOR ADVANCED GLASS MATERIALS GROUP CO., LTD.
Andreas Heiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate dividing method
Patent number
11,424,162
Issue date
Aug 23, 2022
Hamamatsu Photonics K.K.
Yoshimaro Fujii
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Information
Patent Grant
Substrate processing method
Patent number
11,424,161
Issue date
Aug 23, 2022
Disco Corporation
Karl Heinz Priewasser
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,393,721
Issue date
Jul 19, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
Patent number
11,380,588
Issue date
Jul 5, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method including uniting a wafer, a ring frame and...
Patent number
11,380,587
Issue date
Jul 5, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method
Patent number
11,322,403
Issue date
May 3, 2022
Disco Corporation
Masaru Nakamura
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Wafer processing method including applying a polyester sheet to a w...
Patent number
11,322,407
Issue date
May 3, 2022
Disco Corporation
Shigenori Harada
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for manufacturing backside metalized compound semiconductor...
Patent number
11,264,231
Issue date
Mar 1, 2022
Xiamen Sanan Integrated Circuit Co., Ltd.
Tsung-Te Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Repairing metal wire(s) and external connection wire(s) of a displa...
Patent number
11,222,819
Issue date
Jan 11, 2022
HKC CORPORATION LIMITED
Bei Zhou Huang
G02 - OPTICS
Information
Patent Grant
Method of processing a semiconductor wafer
Patent number
11,189,518
Issue date
Nov 30, 2021
Advanced Semiconductor Engineering, Inc.
Yan Ting Shen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor devices with a paddle and ele...
Patent number
11,145,582
Issue date
Oct 12, 2021
STMicroelectronics S.r.l.
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,121,031
Issue date
Sep 14, 2021
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing perovskite solar cell module and perovskit...
Patent number
11,114,252
Issue date
Sep 7, 2021
CPC CORPORATION, TAIWAN
Kuan-Chieh Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages and methods of manufacturing the same
Patent number
11,114,370
Issue date
Sep 7, 2021
Advanced Semiconductor Engineering, Inc.
Shun-Tsat Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with backside inductor using through silicon vias
Patent number
11,101,211
Issue date
Aug 24, 2021
International Business Machines Corporation
Hassan Naser
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package authentication feature
Patent number
11,063,000
Issue date
Jul 13, 2021
Infineon Technologies AG
Stefan Dankowski
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ASSEMBLY AND METHOD FOR PREVENTING WARPAGE IN A SEMICONDUCTOR PACKAGE
Publication number
20250201605
Publication date
Jun 19, 2025
Intel Corporation
Sonja Koller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER FABRICATION WITH POLYIMIDE TO GRAPHENE CONVERSION
Publication number
20250096113
Publication date
Mar 20, 2025
NXP USA, Inc.
Douglas Michael Reber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-AXIS LASER DRILLING FOR WAFER-LEVEL PACKAGING
Publication number
20240429095
Publication date
Dec 26, 2024
STMicroelectronics International N.V.
Shei Meng LOO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20240404899
Publication date
Dec 5, 2024
Innolux Corporation
Ching-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES FOR DICING BONDED WAFERS USING LASER TECHNOLOGIES
Publication number
20240371693
Publication date
Nov 7, 2024
Corning Incorporated
Andreas Simon Gaab
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TRIM CUT WITH QRATE ADJUSTMENT
Publication number
20240286224
Publication date
Aug 29, 2024
TEXAS INSTRUMENTS INCORPORATED
Joseph Yehle
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING
Publication number
20240227075
Publication date
Jul 11, 2024
SEMES CO., LTD.
Tae Shin KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
Publication number
20240170330
Publication date
May 23, 2024
Samsung Electro-Mechanics Co., Ltd.
Chanhoon Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD OF PROCESSING APPARATUS AND PROCESSING SYSTEM
Publication number
20240153820
Publication date
May 9, 2024
PlayNitride Display Co., Ltd.
Chang-Rong Lin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SUBSTRATE TREATING APPARATUS AND METHOD FOR SUBSTRATE TREATING
Publication number
20240131624
Publication date
Apr 25, 2024
SEMES CO., LTD.
Tae Shin KIM
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SE...
Publication number
20230360928
Publication date
Nov 9, 2023
STMicroelectronics S.r.l
Marco ROVITTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PROCESSING WAFER
Publication number
20230154794
Publication date
May 18, 2023
Disco Corporation
Yukinobu OHURA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD AND DEVICE FOR REPAIRING CIRCUIT ON ARRAY SUBSTRATE, AND ARR...
Publication number
20230126811
Publication date
Apr 27, 2023
CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Tianhui QIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REPAIRING SUBSTRATE AND ELECTRONIC DEVICE
Publication number
20230048168
Publication date
Feb 16, 2023
InnoLux Corporation
Ming-Chuan WANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE DIVIDING METHOD
Publication number
20230039486
Publication date
Feb 9, 2023
Disco Corporation
Masamitsu AGARI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE DIVIDING METHOD
Publication number
20220352026
Publication date
Nov 3, 2022
HAMAMATSU PHOTONICS K. K.
Yoshimaro Fujii
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MANUFACTURING METHODS OF WAFER AND CHIPS AND POSITION ADJUSTMENT ME...
Publication number
20220288722
Publication date
Sep 15, 2022
Disco Corporation
Kazuki HASHIMOTO
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY PANEL AND DEFECT REPAIRING METHOD OF SAME
Publication number
20220187664
Publication date
Jun 16, 2022
Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
Jing ZHU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
DISPLAY PANEL AND METHOD OF RESTORING VERTICAL DARK LINES OF DISPLA...
Publication number
20220050345
Publication date
Feb 17, 2022
SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Mengyang LIU
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEM...
Publication number
20220028769
Publication date
Jan 27, 2022
STMicroelectronics S.r.l
Federico Giovanni Ziglioli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20210375676
Publication date
Dec 2, 2021
RNR LAB INC.
Jeong Do RYU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
Publication number
20210343591
Publication date
Nov 4, 2021
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSING METHOD OF WAFER
Publication number
20210335667
Publication date
Oct 28, 2021
Disco Corporation
Masaru Nakamura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR INCREASING THE ELECTRICAL FUNCTIONALITY, AND/OR SERVICE...
Publication number
20210327755
Publication date
Oct 21, 2021
Fraunhofer Gesellschaft zur Foerderung der angewandten Forschung e.V.
Christoph Friedrich BAYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY PANEL AND MANUFACTURING METHOD
Publication number
20210225703
Publication date
Jul 22, 2021
HKC Corporation Limited
BEI ZHOU HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE DIVIDING METHOD
Publication number
20210210387
Publication date
Jul 8, 2021
HAMAMATSU PHOTONICS K. K.
Yoshimaro Fujii
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
Publication number
20210151342
Publication date
May 20, 2021
Advanced Semiconductor Engineering, Inc.
Yan Ting SHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER PROCESSING METHOD
Publication number
20210143064
Publication date
May 13, 2021
Disco Corporation
Shigenori HARADA
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20210134712
Publication date
May 6, 2021
Advanced Semiconductor Engineering, Inc.
Shun-Tsat TU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY SUBSTRATE, METHOD OF TESTING THE SAME, AND DISPLAY DEVICE I...
Publication number
20210134840
Publication date
May 6, 2021
SAMSUNG DISPLAY CO., LTD.
Seung-Kyu LEE
H01 - BASIC ELECTRIC ELEMENTS