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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,288,739
Issue date
Apr 29, 2025
Rohm Co., Ltd.
Motoharu Haga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive composition for semiconductor circuit connection, adhesive...
Patent number
12,286,564
Issue date
Apr 29, 2025
LG Chem, Ltd.
Youngsam Kim
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Display device using micro LED, and method for manufacturing same
Patent number
12,289,934
Issue date
Apr 29, 2025
LG Electronics Inc.
Hwanjoon Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing laminate
Patent number
12,288,768
Issue date
Apr 29, 2025
Lintec Corporation
Isao Ichikawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Methods of operating die attach systems
Patent number
12,288,711
Issue date
Apr 29, 2025
Assembleon B.V.
Alain De Bock
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible electronic structure
Patent number
12,283,561
Issue date
Apr 22, 2025
PRAGMATIC SEMICONDUCTOR LIMITED
Brian Cobb
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
12,283,551
Issue date
Apr 22, 2025
KIOXIA CORPORATION
Akihito Sawanobori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Symbiotic network on layers
Patent number
12,283,572
Issue date
Apr 22, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Javier A. DeLaCruz
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
12,283,481
Issue date
Apr 22, 2025
United Microelectronics Corp.
Yu Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and heat distribution devices for thermal management of chi...
Patent number
12,278,160
Issue date
Apr 15, 2025
Google LLC
Woon-Seong Kwon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device and manufacturing method therefor
Patent number
12,278,320
Issue date
Apr 15, 2025
Stanley Electric Co., Ltd.
Yoshiaki Yasuda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing nitride mesas each intended to form an electro...
Patent number
12,278,224
Issue date
Apr 15, 2025
Commissariat a l'Energie Atomique et Aux Energies Alternatives
Guy Feuillet
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of fabricating semiconductor structure including a barrier s...
Patent number
12,278,208
Issue date
Apr 15, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
Patent number
12,272,673
Issue date
Apr 8, 2025
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacking structure, package structure and method of fabricating the...
Patent number
12,272,674
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Fa Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal-bump sidewall protection
Patent number
12,272,663
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Jung-Hua Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Adhesive member, display device, and manufacturing method of displa...
Patent number
12,272,667
Issue date
Apr 8, 2025
Samsung Display Co., Ltd.
Jung Hoon Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
Patent number
12,272,616
Issue date
Apr 8, 2025
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-aligned interconnect structures and methods of fabrication
Patent number
12,266,570
Issue date
Apr 1, 2025
Intel Corporation
Kimin Jun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate bonding method
Patent number
12,266,623
Issue date
Apr 1, 2025
SHENZHEN XIUYUAN ELECTRONIC TECHNOLOGY CO., LTD
Yunzhi Ling
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Full-color LED display using ultra-thin LED element and method for...
Patent number
12,266,740
Issue date
Apr 1, 2025
Kookmin University Industry Academy Cooperation Foundation
Young Rag Do
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
12,266,627
Issue date
Apr 1, 2025
Mitsubishi Electric Corporation
Shinji Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing substrate layered body and layered body
Patent number
12,261,143
Issue date
Mar 25, 2025
Mitsui Chemicals, Inc.
Yasuhisa Kayaba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Pressing group for a sintering press for sintering electronic compo...
Patent number
12,257,801
Issue date
Mar 25, 2025
AMX—AUTOMATRIX S.R.L.
Nicola Schivalocchi
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
12,261,102
Issue date
Mar 25, 2025
Taiwan Semiconductor Manufacturing Company, Ltd
Li-Ling Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating a semiconductor device
Patent number
12,261,144
Issue date
Mar 25, 2025
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Joined structure, joining method, and joining material
Patent number
12,257,650
Issue date
Mar 25, 2025
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Takahiro Kumakawa
B22 - CASTING POWDER METALLURGY
Information
Patent Grant
Semiconductor packages with an intermetallic layer
Patent number
12,255,167
Issue date
Mar 18, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Michael J. Seddon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
Patent number
12,255,076
Issue date
Mar 18, 2025
STMicroelectronics, Inc.
Ian Harvey Arellano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device with multi-layer contact and system
Patent number
12,255,168
Issue date
Mar 18, 2025
Infineon Technologies AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20250140686
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing company Ltd.
JEN-YUAN CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING...
Publication number
20250140732
Publication date
May 1, 2025
Resonac Corporation
Tomoya MASUDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit with Enhanced Thermal Dissipation Structure
Publication number
20250140639
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Che Chi Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT (IC) STRUCTURES WITH THERMAL COMPONENTS
Publication number
20250140641
Publication date
May 1, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Isha Datye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID QUAD FLAT PACKAGE ELECTRONIC DEVICE
Publication number
20250140653
Publication date
May 1, 2025
TEXAS INSTRUMENTS INCORPORATED
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250140731
Publication date
May 1, 2025
Siliconware Precision Industries Co., Ltd.
Sung-Hua Chung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
Publication number
20250140730
Publication date
May 1, 2025
STATS ChipPAC Pte Ltd.
Yaojian Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BONDING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20250140733
Publication date
May 1, 2025
AG MATERIALS TECHNOLOGY CO., LTD.
Tung-Han CHUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILVER PASTE, AND PREPARATION METHOD AND USE THEREOF
Publication number
20250140437
Publication date
May 1, 2025
SOLDERWELL MICROELECTRONIC PACKAGING MATERIALS CO., LTD
Yunhui Mei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PA...
Publication number
20250140709
Publication date
May 1, 2025
Samsung Electronics Co., Ltd.
Junghoon Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS, METHOD OF MANUFACTURING SEMI...
Publication number
20250140738
Publication date
May 1, 2025
Mitsubishi Electric Corporation
Takeru ZAIMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NON-CONDUCTIVE FILM FILLET CONTROL IN SEMICONDUCTOR DEVICE ASSEMBLY
Publication number
20250132279
Publication date
Apr 24, 2025
Micron Technology, Inc.
Brandon P. Wirz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
Publication number
20250132163
Publication date
Apr 24, 2025
Applied Materials, Inc.
Raghuveer Satya MAKALA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR FLIP CHIP PACKAGING
Publication number
20250132288
Publication date
Apr 24, 2025
YIN-JUI SHIH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIGHT EMITTING DEVICE
Publication number
20250132299
Publication date
Apr 24, 2025
InnoLux Corporation
Yuan-Lin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES AND A METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20250132220
Publication date
Apr 24, 2025
Amkor Technology Singapore Holding Pte. Ltd.
Dong Hyeon Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20250132276
Publication date
Apr 24, 2025
KIOXIA Corporation
Masayoshi TAGAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR ASSEMBLIES
Publication number
20250132289
Publication date
Apr 24, 2025
NEXPERIA B.V.
Antonio B. Dimaano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Heat-Electricity Discrete Power Module Including Two-Way Heat-Dissi...
Publication number
20250132233
Publication date
Apr 24, 2025
ICP TECHNOLOGY CO., LTD.
HO-CHIEH YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID STACKING OF SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSE...
Publication number
20250132302
Publication date
Apr 24, 2025
Micron Technology, Inc.
Kwun-Han Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20250132214
Publication date
Apr 24, 2025
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PAC...
Publication number
20250125276
Publication date
Apr 17, 2025
AP MEMORY TECHNOLOGY CORPORATION
RU-YI CAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED THERMAL CONTROL OF A HYBRID CHIP ASSEMBLY
Publication number
20250125300
Publication date
Apr 17, 2025
CIENA CORPORATION
Raphael Beaupré-Laflamme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NON-CONDUCTIVE SUPPORT LAYER
Publication number
20250125302
Publication date
Apr 17, 2025
Samsung Electronics Co., Ltd.
Jing Cheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A CHIP STRUCTURE AND CHIP STRUCTURE
Publication number
20250125304
Publication date
Apr 17, 2025
INFINEON TECHNOLOGIES AG
Joachim MAHLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE HAVING A CLIP CONNECTED TO A SEMICONDUCTOR PACKAGE
Publication number
20250125218
Publication date
Apr 17, 2025
Infineon Technologies Austria AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
Publication number
20250125297
Publication date
Apr 17, 2025
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Maria Cristina ESTACIO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RELIABLE SEMICONDUCTORS PACKAGES
Publication number
20250126909
Publication date
Apr 17, 2025
UTAC Headquarters Pte. Ltd.
Il Kwon SHIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Packaging electronic device with liquid thermal interface material
Publication number
20250118618
Publication date
Apr 10, 2025
Marvell Asia Pte Ltd.
Janak Patel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING A HEAT DISSIPATION STRUCTURE AND METHOD...
Publication number
20250118615
Publication date
Apr 10, 2025
Taiwan Semiconductor Manufacturing Company Limited
Jui Shen Chang
H01 - BASIC ELECTRIC ELEMENTS