Using a plurality of lasers or laser light with a plurality of wavelengths

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H05K2203/108

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/108Using a plurality of lasers or laser light with a plurality of wavelengths

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Lift printing using thin donor foils
- Patent number 12,162,294
- Issue date Dec 10, 2024
- Marc Altman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 11,503,718
- Issue date Nov 15, 2022
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lithographic exposure system and method for exposure and curing a s...
- Patent number 11,464,116
- Issue date Oct 4, 2022
- LIMATA GmbH
- Matthias Nagel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for direct writing on an uneven surface of a workpiece that...
- Patent number 11,284,517
- Issue date Mar 22, 2022
- Micronic Mydata AB
- Per Askebjer
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,905,014
- Issue date Jan 26, 2021
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,667,407
- Issue date May 26, 2020
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application specific electronics packaging systems, methods and dev...
- Patent number 10,433,428
- Issue date Oct 1, 2019
- Molex, LLC
- Marko Spiegel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printing method using two lasers
- Patent number 10,362,683
- Issue date Jul 23, 2019
- Centre National de la Recherche Scientifique
- Anne Patricia Blanche Alloncle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of laser trace post processing and depaneling of assembled...
- Patent number 10,194,533
- Issue date Jan 29, 2019
- Smart Wave Technologies, Inc.
- Scott Arthur McMullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Maskless writing of a workpiece using a plurality of exposures havi...
- Patent number 10,149,390
- Issue date Dec 4, 2018
- Mycronic AB
- Per Askebjer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-step, direct-write laser metallization
- Patent number 10,015,887
- Issue date Jul 3, 2018
- Orbotech Ltd.
- Michael Zenou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabricating a conductive trace structure and substrate having the s...
- Patent number 9,826,634
- Issue date Nov 21, 2017
- Taiwan Green Point Enterprises, Co., Ltd.
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,451,711
- Issue date Sep 20, 2016
- Ibiden Co., Ltd.
- Toshiaki Hibino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and manufacturing method thereof
- Patent number 9,288,913
- Issue date Mar 15, 2016
- Ricoh Company, Ltd.
- Hiroshi Miura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method and production method of multilayer flexibl...
- Patent number 9,148,963
- Issue date Sep 29, 2015
- Nippon Mektron, Ltd.
- Fumihiko Matsuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabricating wiring board
- Patent number 9,084,379
- Issue date Jul 14, 2015
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate and method of manufacturing the same
- Patent number 8,946,906
- Issue date Feb 3, 2015
- NGK Spark Plug Co., Ltd.
- Shinnosuke Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for integrating an electronic component into a printed circu...
- Patent number 8,914,974
- Issue date Dec 23, 2014
- AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for depositing and curing nanoparticle-based ink
- Patent number 8,916,796
- Issue date Dec 23, 2014
- Intrinsiq Materials, Inc.
- Sujatha Ramanujan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method and apparatus for laser machining relatively narrow and rela...
- Patent number 8,729,426
- Issue date May 20, 2014
- M-SOLV Ltd.
- Philip Thomas Rumsby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photonic heating of silver grids
- Patent number 8,722,322
- Issue date May 13, 2014
- Eastman Kodak Company
- Donald R. Preuss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring board and process for fabricating the same
- Patent number 8,450,621
- Issue date May 28, 2013
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating wiring board
- Patent number 8,387,241
- Issue date Mar 5, 2013
- NGK Spark Plug Co., Ltd.
- Masaki Muramatsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming micro-vias using a two stage laser drilling process
- Patent number 8,288,682
- Issue date Oct 16, 2012
- Intel Corporation
- Islam Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple laser wavelength and pulse width process drilling
- Patent number 8,116,341
- Issue date Feb 14, 2012
- Electro Scientific Industries, Inc.
- Weisheng Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method and laser processing apparatus
- Patent number 8,097,829
- Issue date Jan 17, 2012
- Hitachi Zosen Corporation
- Naoaki Fukuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of printed circuit board and printed circuit boa...
- Patent number 8,075,788
- Issue date Dec 13, 2011
- Hitachiviamechanics, Ltd.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING LASER-INDUCED GRAPHENE BASED E-TEXTILE AND...
- Publication number 20240196527
- Publication date Jun 13, 2024
- Korea Advanced Institute of Science and Technology
- Young-Jin KIM
- D03 - WEAVING
Information Patent Application
PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK
- Publication number 20240196544
- Publication date Jun 13, 2024
- Trillion Harvest Limited
- Pei-Chung PANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20220369473
- Publication date Nov 17, 2022
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lift Printing Using Thin Donor Foils
- Publication number 20220024223
- Publication date Jan 27, 2022
- ORBOTECH LTD.
- Marc Altman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Direct Exposure Device for the Direct Exposure of Solder Resists in...
- Publication number 20210092850
- Publication date Mar 25, 2021
- Matthias Nagel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...
- Publication number 20200022265
- Publication date Jan 16, 2020
- Molex, LLC
- Marko SPIEGEL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR DIRECT WRITING ON AN UNEVEN SURFACE OF A WORKPIECE THAT...
- Publication number 20190116673
- Publication date Apr 18, 2019
- Mycronic AB
- Per Askebjer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING METHOD USING TWO LASERS
- Publication number 20180110127
- Publication date Apr 19, 2018
- Centre National de la Recherche Scientifique
- Anne Patricia Blanche ALLONCLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of Laser Trace Post Processing and Depaneling of Assembled...
- Publication number 20160338204
- Publication date Nov 17, 2016
- Smart Wave Technologies Corp.
- Scott Arthur McMullen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Resolution Printing
- Publication number 20150056383
- Publication date Feb 26, 2015
- INTRINSIQ MATERIALS LTD.
- Jose Pedrosa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...
- Publication number 20140374141
- Publication date Dec 25, 2014
- Sheng-Hung Yi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140216794
- Publication date Aug 7, 2014
- IBIDEN CO., LTD.
- Toshiaki HIBINO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES
- Publication number 20140202742
- Publication date Jul 24, 2014
- CAMBRIOS TECHNOLOGIES CORPORATION
- David Jones
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE CONDITIONING FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK
- Publication number 20140065294
- Publication date Mar 6, 2014
- Intrinsiq Materials, Inc.
- Sujatha Ramanujan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS WRITING OF A WORKPIECE USING A PLURALITY OF EXPOSURES HAVI...
- Publication number 20140053399
- Publication date Feb 27, 2014
- Micronic Mydata AB
- Per Askebjer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK
- Publication number 20130337190
- Publication date Dec 19, 2013
- Intrinsiq Materials, Inc.
- Sujatha Ramanujan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK USING SPATI...
- Publication number 20130337191
- Publication date Dec 19, 2013
- Intrinsiq Materials, Inc.
- Sujatha Ramanujan
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PHOTONIC HEATING OF SILVER GRIDS
- Publication number 20130196269
- Publication date Aug 1, 2013
- Donald R. Preuss
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LASER PROCESSING METHOD AND PRODUCTION METHOD OF MULTILAYER FLEXIBL...
- Publication number 20130089658
- Publication date Apr 11, 2013
- NIPPON MEKTRON LTD.
- Fumihiko Matsuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING MICROSTRUCTURES, LASER IRRADIATION DEVICE, AND SU...
- Publication number 20130029092
- Publication date Jan 31, 2013
- FUJIKURA LTD.
- Hiroyuki WAKIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR FABRICATING WIRING BOARD
- Publication number 20120174391
- Publication date Jul 12, 2012
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120153463
- Publication date Jun 21, 2012
- NGK SPARK PLUG CO., LTD.
- Shinnosuke MAEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING FORMED CIRCUIT COMPONENT
- Publication number 20120107522
- Publication date May 3, 2012
- SANKYO KASEI CO., LTD.
- Tetsuo Yumoto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD AND APPARATUS FOR LASER MACHINING RELATIVELY NARROW AND RELA...
- Publication number 20110259631
- Publication date Oct 27, 2011
- M-SOLV LTD.
- Philip Thomas Rumsby
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Fabricating Wiring Board
- Publication number 20110232085
- Publication date Sep 29, 2011
- NGK SPARK PLUG CO., LTD.
- Masaki MURAMATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...
- Publication number 20110203107
- Publication date Aug 25, 2011
- Wolfgang Schrittwieser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE
- Publication number 20100288739
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jae-Kwang Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND PROCESS FOR FABRICATING THE SAME
- Publication number 20100065319
- Publication date Mar 18, 2010
- Unimicron Technology Corp.
- Tsung-Yuan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING MICRO-VIAS ON A SUBSTRATE
- Publication number 20090084755
- Publication date Apr 2, 2009
- Intel Corporation
- Islam Salama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Using a plurality of lasers or laser light with a plurality of wavelengths

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Lift printing using thin donor foils

Method for soldering an electronic component to a circuit board by...

Application specific electronics packaging systems, methods and dev...

Lithographic exposure system and method for exposure and curing a s...

System producing a conductive path on a substrate

System for direct writing on an uneven surface of a workpiece that...

Patterning and removal of circuit board material using ultrafast la...

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Application specific electronics packaging systems, methods and dev...

Printing method using two lasers

Methods of laser trace post processing and depaneling of assembled...

Maskless writing of a workpiece using a plurality of exposures havi...

Two-step, direct-write laser metallization

Fabricating a conductive trace structure and substrate having the s...

Printed wiring board and method for manufacturing printed wiring board

Wiring board and manufacturing method thereof

Laser processing method and production method of multilayer flexibl...

Process for fabricating wiring board

Multilayer wiring substrate and method of manufacturing the same

Method for integrating an electronic component into a printed circu...

Method for depositing and curing nanoparticle-based ink

Method and apparatus for laser machining relatively narrow and rela...

Photonic heating of silver grids

Wiring board and process for fabricating the same

Method of fabricating wiring board

Forming micro-vias using a two stage laser drilling process

Multiple laser wavelength and pulse width process drilling

Laser processing method and laser processing apparatus

Fabrication method of printed circuit board and printed circuit boa...

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

METHOD FOR MANUFACTURING LASER-INDUCED GRAPHENE BASED E-TEXTILE AND...

PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK

Method for Soldering an Electronic Component to a Circuit Board by...

Lift Printing Using Thin Donor Foils

Direct Exposure Device for the Direct Exposure of Solder Resists in...

APPLICATION SPECIFIC ELECTRONICS PACKAGING SYSTEMS, METHODS AND DEV...

SYSTEM FOR DIRECT WRITING ON AN UNEVEN SURFACE OF A WORKPIECE THAT...

PRINTING METHOD USING TWO LASERS

Methods of Laser Trace Post Processing and Depaneling of Assembled...

High Resolution Printing

FABRICATING A CONDUCTIVE TRACE STRUCTURE AND SUBSTRATE HAVING THE S...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

TWO-SIDED LASER PATTERNING ON THIN FILM SUBSTRATES

SURFACE CONDITIONING FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK

MASKLESS WRITING OF A WORKPIECE USING A PLURALITY OF EXPOSURES HAVI...

METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK

METHOD FOR DEPOSITING AND CURING NANOPARTICLE-BASED INK USING SPATI...

PHOTONIC HEATING OF SILVER GRIDS

LASER PROCESSING METHOD AND PRODUCTION METHOD OF MULTILAYER FLEXIBL...

METHOD OF FORMING MICROSTRUCTURES, LASER IRRADIATION DEVICE, AND SU...

PROCESS FOR FABRICATING WIRING BOARD

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR PRODUCING FORMED CIRCUIT COMPONENT

METHOD AND APPARATUS FOR LASER MACHINING RELATIVELY NARROW AND RELA...

Method of Fabricating Wiring Board

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCU...

LASER PROCESSING DEVICE

WIRING BOARD AND PROCESS FOR FABRICATING THE SAME

METHOD FOR FORMING MICRO-VIAS ON A SUBSTRATE