Using a temporary spacer element or stand-off during processing

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CPC
H05K2203/0182

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0182Using a temporary spacer element or stand-off during processing

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Pressure sintering device and method for manufacturing an electroni...
- Patent number 12,046,576
- Issue date Jul 23, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component, positioning device and method for fastening the componen...
- Patent number 11,688,989
- Issue date Jun 27, 2023
- Phoenix Contact GmbH & Co.
- Jurgen Sahm
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Voiding control using solid solder preforms embedded in solder paste
- Patent number 10,537,030
- Issue date Jan 14, 2020
- Indium Corporation
- Zhenxi Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for facilitating the separation of mated printed circuit...
- Patent number 10,186,823
- Issue date Jan 22, 2019
- Cisco Technology, Inc.
- Robert Gregory Twiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting electronic component
- Patent number 9,867,320
- Issue date Jan 9, 2018
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hideaki Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Orientating and installing jig
- Patent number 9,659,804
- Issue date May 23, 2017
- Wistron Corp.
- Xiao-Hua Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounting system
- Patent number 8,424,199
- Issue date Apr 23, 2013
- On-Shore Technology, Inc.
- Anthony F. Benante
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
OC2 oriented connections 2
- Patent number 8,125,790
- Issue date Feb 28, 2012
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical module
- Patent number 7,824,111
- Issue date Nov 2, 2010
- Fujitsu Limited
- Toru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spacer, printed circuit board, and electronic equipment
- Patent number 7,573,718
- Issue date Aug 11, 2009
- Fujitsu Limited
- Yoshinori Uzuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple flexible wiring board, method for producing same, method f...
- Patent number 7,563,986
- Issue date Jul 21, 2009
- Sharp Kabushiki Kaisha
- Hironobu Shitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of detaching electronic component from printed circuit board
- Patent number 7,500,308
- Issue date Mar 10, 2009
- Fujitsu Limited
- Mitsuo Suehiro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oriented connections for leadless and leaded packages
- Patent number 7,433,201
- Issue date Oct 7, 2008
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board with interconnection terminal, a printed circ...
- Patent number 7,381,066
- Issue date Jun 3, 2008
- Ricoh Company, Ltd.
- Masahiro Higashiguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 7,273,988
- Issue date Sep 25, 2007
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting electronic component on substrate without genera...
- Patent number 7,159,309
- Issue date Jan 9, 2007
- Fujitsu Limited
- Tsuyoshi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two stage molded memory cards
- Patent number 7,109,427
- Issue date Sep 19, 2006
- Chor-Ming Ng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etched hole-fill stand-off
- Patent number 6,995,321
- Issue date Feb 7, 2006
- Honeywell Advanced Circuits
- Bruce W. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole filling using an etched hole-fill stand-off
- Patent number 6,921,505
- Issue date Jul 26, 2005
- TTM Advanced Circuits, Inc.
- Bruce W. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing wired circuit board
- Patent number 6,889,426
- Issue date May 10, 2005
- Nitto Denko Corporation
- Hirofumi Fujii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, and electronic device with an electronic part mounted...
- Patent number 6,878,884
- Issue date Apr 12, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB support plate for PCB via fill
- Patent number 6,855,385
- Issue date Feb 15, 2005
- TTM Advanced Circuits, Inc.
- Charles W. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using a supporting structure to control collapse of a die towards a...
- Patent number 6,849,944
- Issue date Feb 1, 2005
- Texas Instruments Incorporated
- Masood Murtuza
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Scavenging system
- Patent number 6,840,425
- Issue date Jan 11, 2005
- TTM Advanced Circuits, Inc.
- Jesse L. Pedigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heated filling device
- Patent number 6,832,714
- Issue date Dec 21, 2004
- TTM Advanced Circuits, Inc.
- Jesse Pedigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Extended length light emitting diode
- Patent number 6,831,306
- Issue date Dec 14, 2004
- Daktronics, Inc.
- Randy S. Uehran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB support plate method for PCB via fill
- Patent number 6,800,232
- Issue date Oct 5, 2004
- TTM Advanced Circuits, Inc.
- Charles W. Lewis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heated filling method
- Patent number 6,797,224
- Issue date Sep 28, 2004
- TTM Advanced Technologies, Inc.
- Jesse Pedigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT, POSITIONING DEVICE AND METHOD FOR FASTENING THE COMPONEN...
- Publication number 20190363500
- Publication date Nov 28, 2019
- Phoenix Contact GmbH & Co. KG
- Jurgen SAHM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC COMPONENT
- Publication number 20140283381
- Publication date Sep 25, 2014
- Fujitsu Limited
- Yoko MURATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE
- Publication number 20120267152
- Publication date Oct 25, 2012
- FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Toshitaka HARA
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Printed Wiring Board and Electronic Apparatus
- Publication number 20110240325
- Publication date Oct 6, 2011
- Daigo Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing Liquid Crystalline Polyester Prepreg and Liqui...
- Publication number 20110014434
- Publication date Jan 20, 2011
- Sumitomo Chemical Company, Limited
- Tomoko TANAKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
OC2 ORIENTED CONNECTIONS 2
- Publication number 20090207575
- Publication date Aug 20, 2009
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACCOMPANYING WINDING SPACER AND METHOD FOR MANUFACTURING STRIP TYPE...
- Publication number 20080251184
- Publication date Oct 16, 2008
- Li-Hua Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Substrate
- Publication number 20080118706
- Publication date May 22, 2008
- Jurgen Schulz-Harder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector
- Publication number 20080113531
- Publication date May 15, 2008
- Lotes Co., Ltd.
- Ted Ju
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
OPTICAL MODULE
- Publication number 20080101746
- Publication date May 1, 2008
- FUJITSU LIMITED
- Toru Okada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board, a printed circuit assembly and electronic ap...
- Publication number 20070111557
- Publication date May 17, 2007
- Masahiro Higashiguchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multiple flexible wiring board, method for producing same, method f...
- Publication number 20070111559
- Publication date May 17, 2007
- Sharp Kabushiki Kaisha
- Hironobu Shitamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Board level solder joint support for BGA packages under heatsink co...
- Publication number 20060043586
- Publication date Mar 2, 2006
- TEXAS INSTRUMENTS INCORPORATED
- Tz-Cheng Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050230147
- Publication date Oct 20, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Spacer, printed circuit board, and electronic equipment
- Publication number 20050167153
- Publication date Aug 4, 2005
- FUJITSU LIMITED
- Yoshinori Uzuka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20050146019
- Publication date Jul 7, 2005
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of mounting electronic component on substrate without genera...
- Publication number 20050139389
- Publication date Jun 30, 2005
- FUJITSU LIMITED
- Tsuyoshi Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed circuit board unit with detachment mechanism for electronic...
- Publication number 20050077079
- Publication date Apr 14, 2005
- FUJITSU LIMITED
- Mitsuo Suehiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
USING A SUPPORTING STRUCTURE TO CONTROL COLLAPSE OF A DIE TOWARDS A...
- Publication number 20040238956
- Publication date Dec 2, 2004
- Masood Murtuza
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Oriented connections for leadless and leaded packages
- Publication number 20040178250
- Publication date Sep 16, 2004
- Gabe Cherian
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board, and electronic device with an electronic part mounted...
- Publication number 20030196831
- Publication date Oct 23, 2003
- NEC Corporation
- Yuki Momokawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board unit with detachment mechanism for electronic...
- Publication number 20030173109
- Publication date Sep 18, 2003
- FUJITSU LIMITED
- Mitsuo Suehiro
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of mounting electronic component on substrate without genera...
- Publication number 20030051905
- Publication date Mar 20, 2003
- FUJITSU LIMITED
- Tsuyoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing wired circuit board
- Publication number 20030024110
- Publication date Feb 6, 2003
- Hirofumi Fujii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PCB support plate method for PCB via fill
- Publication number 20030011098
- Publication date Jan 16, 2003
- Charles W. Lewis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Ball grid array IC package and manufacturing method thereof
- Publication number 20020185746
- Publication date Dec 12, 2002
- Sang Wook Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PCB support plate for PCB via fill
- Publication number 20020179676
- Publication date Dec 5, 2002
- Charles W. Lewis
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Heated filling method
- Publication number 20020135104
- Publication date Sep 26, 2002
- Jesse Pedigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Scavenging method
- Publication number 20020113330
- Publication date Aug 22, 2002
- Jesse L. Pedigo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole filling using an etched hole-fill stand-off
- Publication number 20020089086
- Publication date Jul 11, 2002
- Bruce W. Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Using a temporary spacer element or stand-off during processing

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pressure sintering device and method for manufacturing an electroni...

Component, positioning device and method for fastening the componen...

Method of fabricating a glass substrate with a plurality of vias

Filling materials and methods of filling through holes of a substrate

Voiding control using solid solder preforms embedded in solder paste

Apparatus for facilitating the separation of mated printed circuit...

Apparatus for mounting electronic component

Orientating and installing jig

Semiconductor chip mounting system

OC2 oriented connections 2

Optical module

Spacer, printed circuit board, and electronic equipment

Multiple flexible wiring board, method for producing same, method f...

Method of detaching electronic component from printed circuit board

Oriented connections for leadless and leaded packages

Printed circuit board with interconnection terminal, a printed circ...

Wiring board, and electronic device with an electronic part mounted...

Method of mounting electronic component on substrate without genera...

Two stage molded memory cards

Etched hole-fill stand-off

Hole filling using an etched hole-fill stand-off

Method for manufacturing wired circuit board

Wiring board, and electronic device with an electronic part mounted...

PCB support plate for PCB via fill

Using a supporting structure to control collapse of a die towards a...

Scavenging system

Heated filling device

Extended length light emitting diode

PCB support plate method for PCB via fill

Heated filling method

Patents Applicationslast 30 patents

COMPONENT, POSITIONING DEVICE AND METHOD FOR FASTENING THE COMPONEN...

METHOD OF MOUNTING ELECTRONIC COMPONENT

SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE

Printed Wiring Board and Electronic Apparatus

Method for Producing Liquid Crystalline Polyester Prepreg and Liqui...

OC2 ORIENTED CONNECTIONS 2

ACCOMPANYING WINDING SPACER AND METHOD FOR MANUFACTURING STRIP TYPE...

Substrate

Electrical connector

OPTICAL MODULE

Printed circuit board, a printed circuit assembly and electronic ap...

Multiple flexible wiring board, method for producing same, method f...

Board level solder joint support for BGA packages under heatsink co...

Wiring board, and electronic device with an electronic part mounted...

Spacer, printed circuit board, and electronic equipment

Wiring board, and electronic device with an electronic part mounted...

Method of mounting electronic component on substrate without genera...

Printed circuit board unit with detachment mechanism for electronic...

USING A SUPPORTING STRUCTURE TO CONTROL COLLAPSE OF A DIE TOWARDS A...

Oriented connections for leadless and leaded packages

Wiring board, and electronic device with an electronic part mounted...

Printed circuit board unit with detachment mechanism for electronic...

Method of mounting electronic component on substrate without genera...

Method for manufacturing wired circuit board

PCB support plate method for PCB via fill

Ball grid array IC package and manufacturing method thereof

PCB support plate for PCB via fill

Heated filling method

Scavenging method

Hole filling using an etched hole-fill stand-off