using a wire connector

Industry

CPC
H01L24/85

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/85using a wire connector

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods of determining a sequence for creating a plurality of wire...
- Patent number 12,183,711
- Issue date Dec 31, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Floating die package
- Patent number 12,176,298
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,159,819
- Issue date Dec 3, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-process wire bond testing using wire bonding apparatus
- Patent number 12,148,730
- Issue date Nov 19, 2024
- Atieva, Inc.
- Ben Carlson-Sypek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for tool mark free stitch bonding
- Patent number 12,142,595
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including stacked semiconductor chips
- Patent number 12,142,592
- Issue date Nov 12, 2024
- SK hynix Inc.
- Jong Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extendable inner lead for leaded package
- Patent number 12,125,780
- Issue date Oct 22, 2024
- NXP B.V.
- Mei Yeut Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a first substrate, a second substrate and...
- Patent number 12,125,817
- Issue date Oct 22, 2024
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with reduced stress
- Patent number 12,119,280
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 12,113,046
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid system including photonic and electronic integrated circuits...
- Patent number 12,100,701
- Issue date Sep 24, 2024
- PSIQUANTUM, CORP.
- Ramakanth Alapati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,094,808
- Issue date Sep 17, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 12,087,652
- Issue date Sep 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods related to wire bond cleaning and wire bonding...
- Patent number 12,087,728
- Issue date Sep 10, 2024
- Skyworks Solutions, Inc.
- Aldrin Quinones Garing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method of the semiconductor de...
- Patent number 12,074,129
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Takukazu Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Strain-induced shift mitigation in semiconductor packages
- Patent number 12,068,261
- Issue date Aug 20, 2024
- Texas Instruments Incorporated
- Gregory Thomas Ostrowicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having routable encapsulated conductive subst...
- Patent number 12,062,588
- Issue date Aug 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPEN CAVITY SENSOR
- Publication number 20250006573
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Maricel Fabia ESCAÑO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS
- Publication number 20250006510
- Publication date Jan 2, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...
- Publication number 20250006688
- Publication date Jan 2, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Seiya TAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250006720
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Daeyoung JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR
- Publication number 20240429137
- Publication date Dec 26, 2024
- NXP B.V.
- Hsin-En Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE WIRE COATING DURING WIRE BONDING
- Publication number 20240429196
- Publication date Dec 26, 2024
- Western Digital Technologies, Inc.
- Darryl Wong Jun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429115
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...
- Publication number 20240404902
- Publication date Dec 5, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae BANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR
- Publication number 20240404929
- Publication date Dec 5, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Kapil Sahasrabudhe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20240395765
- Publication date Nov 28, 2024
- Yangtze Memory Technologies Co., Ltd.
- XuHui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE
- Publication number 20240387443
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Daisuke INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS
- Publication number 20240379506
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Lau Chun Lek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240371720
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- OhYoung Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY
- Publication number 20240363466
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Salvacion Solas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE INTERCONNECTS
- Publication number 20240347425
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- HUAY YANN TAY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...
- Publication number 20240339336
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...
- Publication number 20240339444
- Publication date Oct 10, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Xuan Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...
- Publication number 20240321802
- Publication date Sep 26, 2024
- International Business Machines Corporation
- JUNYAN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...
- Publication number 20240321822
- Publication date Sep 26, 2024
- Micron Technology, Inc.
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-PHASE MOTOR DRIVER WITH BUILT-IN DISCRETE MOSFETS
- Publication number 20240321824
- Publication date Sep 26, 2024
- Renesas Electronics America Inc.
- Tetsuo SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240312976
- Publication date Sep 19, 2024
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE
- Publication number 20240304569
- Publication date Sep 12, 2024
- Analong Devices International Unlimited Company
- Ramji Sitaraman Lakshmanan et al.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...
- Publication number 20240304509
- Publication date Sep 12, 2024
- Yangtze Memory Technologies Co., Ltd.
- Hui Li
- H01 - BASIC ELECTRIC ELEMENTS

using a wire connector

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of determining a sequence for creating a plurality of wire...

Floating die package

Method for forming an electrical connection between an electronic c...

Semiconductor device

Semiconductor device

Semiconductor package with nickel-silver pre-plated leadframe

In-process wire bond testing using wire bonding apparatus

Lead frame for a package for a semiconductor device, semiconductor...

Power amplifier modules including semiconductor resistor and tantal...

Apparatus and methods for tool mark free stitch bonding

Semiconductor package including stacked semiconductor chips

Extendable inner lead for leaded package

Semiconductor device assemblies and systems with one or more dies a...

Semiconductor module with a first substrate, a second substrate and...

Semiconductor device package with reduced stress

Method for preparing semiconductor device with wire bond

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Offset interposers for large-bottom packages and large-die package-...

Hybrid system including photonic and electronic integrated circuits...

Leadframe package with pre-applied filler material

Semiconductor device

QFN device having a mechanism that enables an inspectable solder jo...

Semiconductor package device and method of manufacturing the same

Systems and methods related to wire bond cleaning and wire bonding...

Palladium-coated copper bonding wire and method for manufacturing same

Semiconductor device and fabrication method of the semiconductor de...

Strain-induced shift mitigation in semiconductor packages

Semiconductor package having routable encapsulated conductive subst...

Methods of forming wire interconnect structures and related wire bo...

Patents Applicationslast 30 patents

OPEN CAVITY SENSOR

SEMICONDUCTOR DEVICE PACKAGE WITH WETTABLE FLANKS

OUTPUT MATCHING NETWORK TO REDUCE SELF AND MUTUAL INDUCTANCES OF OU...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DUAL LEADFRAME SEMICONDUCTOR DEVICE AND METHOD THEREFOR

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

SELECTIVE WIRE COATING DURING WIRE BONDING

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBST...

ELECTRONIC DEVICE WITH WAFER LEVEL CAPACITOR

WIRE BONDING APPARATUS, WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING SEMICONDUCTOR MODULE

ELECTRONIC DEVICE WITH IMPROVED LEADFRAME TRIMMING PROCESS

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH OPEN SENSOR CAVITY

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

INTEGRATED CIRCUIT PACKAGE WITH MULTIPLE INTERCONNECTS

SUBSTRATE HAVING UNDERFILL DAM AND SEMICONDUCTOR PACKAGE INCLUDING...

LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SU...

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

PACKAGES WITH ELECTRICAL FUSES

PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...

SEMICONDUCTOR ASSEMBLIES WITH REDISTRIBUTION STRUCTURES FOR DIE STA...

THREE-PHASE MOTOR DRIVER WITH BUILT-IN DISCRETE MOSFETS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE STRUCTURE, FABRICATING METHOD THEREOF, AND ME...