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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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H01L24/85
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Patents Grants
last 30 patents
Information
Patent Grant
Ribbon wire bond
Patent number
11,975,400
Issue date
May 7, 2024
Texas Instruments Incorporated
Amin Ahmad Sijelmassi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
Patent number
11,973,052
Issue date
Apr 30, 2024
Texas Instruments Incorporated
Chien-Chang Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated high voltage capacitor
Patent number
11,967,610
Issue date
Apr 23, 2024
Semtech Corporation
Christopher David Ainsworth
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and related methods
Patent number
11,961,775
Issue date
Apr 16, 2024
Amkor Technology Singapore Holding Pte Ltd.
Gyu Wan Han
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Laminate stacked on die for high voltage isolation capacitor
Patent number
11,942,402
Issue date
Mar 26, 2024
Texas Instruments Incorporated
Thomas Dyer Bonifield
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor arrangement and method for producing the same
Patent number
11,942,449
Issue date
Mar 26, 2024
Infineon Technologies AG
Frank Sauerland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
Patent number
11,942,455
Issue date
Mar 26, 2024
Micron Technology, Inc.
Yeongbeom Ko
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of optimizing clamping of a semiconductor element against a...
Patent number
11,935,864
Issue date
Mar 19, 2024
Kulicke and Soffa Industries, Inc.
Hui Xu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of manufacturing an integrated circuit having stress tuning...
Patent number
11,935,842
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Shin-Puu Jeng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing leadless semiconductor package with wettab...
Patent number
11,929,259
Issue date
Mar 12, 2024
STMicroelectronics, Inc.
Ian Harvey Arellano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit wire bonded to a multi-layer substrate having an...
Patent number
11,929,351
Issue date
Mar 12, 2024
Micron Technology, Inc.
Kelvin Tan Aik Boo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method for increasing the reliability of a power module
Patent number
11,929,346
Issue date
Mar 12, 2024
Mitsubishi Electric Corporation
Julio Cezar Brandelero
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,923,277
Issue date
Mar 5, 2024
Rohm Co., Ltd.
Yoshizo Osumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic chip support device and corresponding manufacturing method
Patent number
11,916,353
Issue date
Feb 27, 2024
STMicroelectronics (Grenoble 2) SAS
Fabien Quercia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,916,000
Issue date
Feb 27, 2024
Rohm Co., Ltd.
Hiroaki Matsubara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for fabricating the same
Patent number
11,908,830
Issue date
Feb 20, 2024
Infineon Technologies AG
Richard Knipper
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overlapping die stacks for nand package architecture
Patent number
11,908,833
Issue date
Feb 20, 2024
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding for semiconductor devices
Patent number
11,901,327
Issue date
Feb 13, 2024
Western Digital Technologies, Inc.
Yang Lei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding method and wire bonding apparatus
Patent number
11,901,329
Issue date
Feb 13, 2024
Kaijo Corporation
Mami Kushima
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package with an electrode-attached frame supported by a heat sink,...
Patent number
11,901,268
Issue date
Feb 13, 2024
NGK Electronics Devices, Inc.
Yoshio Tsukiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Current sensor package with continuous insulation
Patent number
11,895,930
Issue date
Feb 6, 2024
Infineon Technologies AG
Rainer Markus Schaller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of semiconductor device and semiconductor device
Patent number
11,894,291
Issue date
Feb 6, 2024
Mitsubishi Electric Corporation
Shuhei Yokoyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked microfeature devices and associated methods
Patent number
11,887,970
Issue date
Jan 30, 2024
Micron Technology, Inc.
Mung Suan Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
Patent number
11,881,476
Issue date
Jan 23, 2024
Semtech Corporation
Changjun Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for preparing semiconductor device with wire bond
Patent number
11,876,072
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Wei-Zhong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Palladium-coated copper bonding wire, wire bonding structure, semic...
Patent number
11,876,066
Issue date
Jan 16, 2024
TANAKA DENSHI KOGYO K.K.
Hiroyuki Amano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,876,067
Issue date
Jan 16, 2024
NANYA TECHNOLOGY CORPORATION
Wu-Der Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packaging extendable lead and method therefor
Patent number
11,869,837
Issue date
Jan 9, 2024
NXP B.V.
Mei Yeut Lim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
Publication number
20240153917
Publication date
May 9, 2024
Micron Technology, Inc.
Mung Suan Heng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAPPING DIE STACKS FOR NAND PACKAGE ARCHITECTURE
Publication number
20240153912
Publication date
May 9, 2024
Micron Technology, Inc.
Enyong Tai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE WITH NICKEL-SILVER PRE-PLATED LEADFRAME
Publication number
20240153853
Publication date
May 9, 2024
TEXAS INSTRUMENTS INCORPORATED
Nazila Dadvand
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC CHIP SUPPORT DEVICE AND CORRESPONDING MANUFACTURING METHOD
Publication number
20240146019
Publication date
May 2, 2024
STMicroelectronics (Grenoble 2) SAS
Fabien QUERCIA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING SEMICO...
Publication number
20240145351
Publication date
May 2, 2024
STMicroelectronics S.r.l
Matteo DE SANTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
Publication number
20240136386
Publication date
Apr 25, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
LI-CHUN HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240136302
Publication date
Apr 25, 2024
RENESAS ELECTRONICS CORPORATION
Ryusei TAKAISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH STACKED CONDUCTIVE LAYERS AND RELATED MET...
Publication number
20240128215
Publication date
Apr 18, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Takashi NOMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THREROF
Publication number
20240128233
Publication date
Apr 18, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
CHIA-SHUAI CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SECURITY WIRE OVER STITCH BOND
Publication number
20240128228
Publication date
Apr 18, 2024
TEXAS INSTRUMENTS INCORPORATED
Aniceto Rabilas
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUPPORT MEMBERS AND ASSOC...
Publication number
20240128254
Publication date
Apr 18, 2024
Micron Technology, Inc.
Hong Wan Ng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOUBLE STITCH WIREBONDS
Publication number
20240113065
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Xiaolin KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTENDABLE INNER LEAD FOR LEADED PACKAGE
Publication number
20240105579
Publication date
Mar 28, 2024
NXP B.V.
Mei Yeut Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ALUMINUM BONDING WIRE FOR POWER SEMICONDUCTOR
Publication number
20240105667
Publication date
Mar 28, 2024
TANAKA DENSHI KOGYO K.K.
Shuichi MITOMA
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240105561
Publication date
Mar 28, 2024
Kabushiki Kaisha Toshiba
Fumiyoshi KAWASHIRO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DOCUMENT STRUCTURE FORMATION
Publication number
20240105669
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Jens Pohl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
Publication number
20240105672
Publication date
Mar 28, 2024
SHINKAWA LTD.
Shigeru HAYATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ASSEMBLIES WITH HYBRID FANOUTS AND ASSOCIATED METHODS...
Publication number
20240088100
Publication date
Mar 14, 2024
Lodestar Licensing Group LLC
Bharat Bhushan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING TOOL, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICO...
Publication number
20240079375
Publication date
Mar 7, 2024
Fuji Electric Co., Ltd.
Hiroaki HOKAZONO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH BALANCED WIRES, AND ASSOCIATED...
Publication number
20240071979
Publication date
Feb 29, 2024
Micron Technology, Inc.
Chin Hui Chong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PREPARING SEMICONDUCTOR DEVICE WITH WIRE BOND
Publication number
20240063175
Publication date
Feb 22, 2024
NANYA TECHNOLOGY CORPORATION
WEI-ZHONG LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR APPARATUS AND FABRICATION METHOD FOR THE SAME
Publication number
20240063164
Publication date
Feb 22, 2024
Rohm Co., Ltd.
Takukazu OTSUKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20240055393
Publication date
Feb 15, 2024
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
Publication number
20240055388
Publication date
Feb 15, 2024
SHINKAWA LTD.
Kiyotaka TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
Publication number
20240047437
Publication date
Feb 8, 2024
Changxin Memory Technologies, Inc.
Mingxing ZUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20240047409
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Sang Sub Song
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING WITH TRANSPARENCY AND METHOD OF MANUFACTURI...
Publication number
20240038610
Publication date
Feb 1, 2024
STMicroelectronics (Malta) Ltd.
Roseanne DUCA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
Publication number
20240038720
Publication date
Feb 1, 2024
SK HYNIX INC.
Su Ji UM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240030178
Publication date
Jan 25, 2024
ROHM CO., LTD.
Yosui FUTAMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240023346
Publication date
Jan 18, 2024
Samsung Electronics Co., Ltd.
Younghun CHEONG
H01 - BASIC ELECTRIC ELEMENTS