using auxiliary conductive elements

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CPC
H05K3/4015

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4015using auxiliary conductive elements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Structure and mechanism for electrically-connecting an external-con...
- Patent number 11,897,024
- Issue date Feb 13, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Max Richter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,765,837
- Issue date Sep 19, 2023
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate device
- Patent number 11,749,590
- Issue date Sep 5, 2023
- Shinko Electric Industries Co., Ltd.
- Tatsuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package and method of manufacturing the same
- Patent number 11,615,967
- Issue date Mar 28, 2023
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Implantable connector including at least one electrical component
- Patent number 11,450,977
- Issue date Sep 20, 2022
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-incorporating substrate
- Patent number 11,367,626
- Issue date Jun 21, 2022
- TDK Corporation
- Mitsuhiro Tomikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic control device
- Patent number 11,312,408
- Issue date Apr 26, 2022
- Hitachi Astemo, Ltd.
- Katsumasa Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disk having an electric connecting element
- Patent number 11,217,907
- Issue date Jan 4, 2022
- Saint-Gobain Glass France
- Harald Cholewa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,191,169
- Issue date Nov 30, 2021
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 11,129,277
- Issue date Sep 21, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,071,212
- Issue date Jul 20, 2021
- Fuji Electric Co., Ltd.
- Bin Wan Mat Wan Azha
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fuse pad, printed circuit board having the fuse pad, and method of...
- Patent number 11,049,684
- Issue date Jun 29, 2021
- Mando Corporation
- Se Gyun Lee
- G01 - MEASURING TESTING
Information Patent Grant
Circuit carrier board and manufacturing method thereof
- Patent number 11,032,917
- Issue date Jun 8, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module package
- Patent number 11,004,698
- Issue date May 11, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor having system-in-package module, method for producing the sa...
- Patent number 10,950,574
- Issue date Mar 16, 2021
- Continental Teves AG & Co. OHG
- Manfred Goll
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making single reflow power pin connections
- Patent number 10,897,821
- Issue date Jan 19, 2021
- Semiconductor Components Industries, LLC
- Yushuang Yao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible substrate, flexible substrate-attached component, and manu...
- Patent number 10,869,395
- Issue date Dec 15, 2020
- Furukawa Electric Co., Ltd.
- Etsuji Katayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate structure and manufacturing method thereof
- Patent number 10,863,618
- Issue date Dec 8, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode embedded member
- Patent number 10,849,221
- Issue date Nov 24, 2020
- NGK Spark Plug Co., Ltd.
- Atsushi Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 10,813,230
- Issue date Oct 20, 2020
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Circuit board structures and methods of fabricating the same
- Patent number 10,798,828
- Issue date Oct 6, 2020
- NAN YA PRINTED CIRCUIT BORED CORPORATION
- Hsien-Chieh Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Battery monitoring unit
- Patent number 10,761,142
- Issue date Sep 1, 2020
- Yazaki Corporation
- Takao Ota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode embedded member
- Patent number 10,750,611
- Issue date Aug 18, 2020
- NGK Spark Plug Co., Ltd.
- Atsushi Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic substrate component/assembly with raised thermal metal pad,...
- Patent number 10,743,411
- Issue date Aug 11, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having bonding regions exposed through protect...
- Patent number 10,699,994
- Issue date Jun 30, 2020
- Fuji Electric Co., Ltd.
- Kenshi Kai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frame embedded components
- Patent number 10,681,817
- Issue date Jun 9, 2020
- Intel Corporation
- Brian J. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device manufacturing method
- Patent number 10,637,168
- Issue date Apr 28, 2020
- Fuji Electric Co., Ltd.
- Shin Soyano
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...
- Publication number 20250113445
- Publication date Apr 3, 2025
- Meta Platforms Technologies, LLC
- Wenyang Pan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER
- Publication number 20240397631
- Publication date Nov 28, 2024
- Gold Circuit Electronics Ltd.
- Chen-Tse Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...
- Publication number 20240276640
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20240008189
- Publication date Jan 4, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...
- Publication number 20230199964
- Publication date Jun 22, 2023
- Nichia Corporation.
- Yosuke NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH A CONTACT POINT
- Publication number 20230105384
- Publication date Apr 6, 2023
- Knorr-Bremse Systeme fuer Nutzfahrzeuge GmbH
- Markus Deeg
- B60 - VEHICLES IN GENERAL
Information Patent Application
TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS
- Publication number 20230074269
- Publication date Mar 9, 2023
- Intel Corporation
- Donald Tiendung Tran
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND MECHANISM FOR ELECTRICALLY-CONNECTING AN EXTERNAL-CON...
- Publication number 20220168802
- Publication date Jun 2, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Max RICHTER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20220095463
- Publication date Mar 24, 2022
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY
- Publication number 20210368622
- Publication date Nov 25, 2021
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...
- Publication number 20210337674
- Publication date Oct 28, 2021
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD
- Publication number 20210282277
- Publication date Sep 9, 2021
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE DEVICE
- Publication number 20210104454
- Publication date Apr 8, 2021
- Shinko Electric Industries Co., Ltd.
- Tatsuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20210014977
- Publication date Jan 14, 2021
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200267845
- Publication date Aug 20, 2020
- Fuji Electric Co., Ltd.
- Bin Wan Mat WAN AZHA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...
- Publication number 20200245456
- Publication date Jul 30, 2020
- ICP Technology Co., Ltd.
- Ho-Chieh Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMPLANTABLE CONNECTOR INCLUDING AT LEAST ONE ELECTRICAL COMPONENT
- Publication number 20200220285
- Publication date Jul 9, 2020
- Verily Life Sciences LLC
- Kedar Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURES AND METHODS OF FABRICATING THE SAME
- Publication number 20200214145
- Publication date Jul 2, 2020
- Nan Ya Printed Circuit Board Corporation
- Hsien-Chieh LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200196440
- Publication date Jun 18, 2020
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISK HAVING AN ELECTRIC CONNECTING ELEMENT
- Publication number 20200185839
- Publication date Jun 11, 2020
- SAINT-GOBAIN GLASS FRANCE
- Harald Cholewa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...
- Publication number 20200072871
- Publication date Mar 5, 2020
- Intel Corporation
- Pooya Tadayon
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE
- Publication number 20200043751
- Publication date Feb 6, 2020
- TDK Corporation
- Mitsuhiro TOMIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Apparatus for Flexible Circuit Cable Attachment
- Publication number 20190394885
- Publication date Dec 26, 2019
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20190380211
- Publication date Dec 12, 2019
- Unimicron Technology Corp.
- Wei-Ti Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190215958
- Publication date Jul 11, 2019
- IBIDEN CO., LTD.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190215959
- Publication date Jul 11, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FRAME EMBEDDED COMPONENTS
- Publication number 20190215964
- Publication date Jul 11, 2019
- Intel Corporation
- Brian J. LONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNTED CONTACT FINGERS
- Publication number 20190215970
- Publication date Jul 11, 2019
- Intel Corporation
- Min-Tih Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190181067
- Publication date Jun 13, 2019
- Samsung Electronics Co., Ltd.
- Soon Bum KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20190172782
- Publication date Jun 6, 2019
- STMicroelectronics S.r.l
- Federico Giovanni Ziglioli
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using auxiliary conductive elements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for flexible circuit cable attachment

Resilient micro lattice electrical interconnection assembly

Structure and mechanism for electrically-connecting an external-con...

Method and apparatus for flexible circuit cable attachment

Wiring substrate device

Power module package and method of manufacturing the same

Implantable connector including at least one electrical component

Electronic component-incorporating substrate

Electronic control device

Disk having an electric connecting element

Method and apparatus for flexible circuit cable attachment

Resilient micro lattice electrical interconnection assembly

Semiconductor device manufacturing method

Fuse pad, printed circuit board having the fuse pad, and method of...

Circuit carrier board and manufacturing method thereof

Power module package

Sensor having system-in-package module, method for producing the sa...

Method of making single reflow power pin connections

Flexible substrate, flexible substrate-attached component, and manu...

Composite substrate structure and manufacturing method thereof

Electrode embedded member

Method and apparatus for flexible circuit cable attachment

Cu column, Cu core column, solder joint, and through-silicon via

Circuit board structures and methods of fabricating the same

Battery monitoring unit

Electrode embedded member

Ceramic substrate component/assembly with raised thermal metal pad,...

Semiconductor device having bonding regions exposed through protect...

Frame embedded components

Semiconductor device and semiconductor device manufacturing method

Patents Applicationslast 30 patents

SYSTEMS, METHODS, AND DEVICES FOR CONFIGURING ONE OR MORE MATERIAL...

METHOD OF SEGMENTED ELECTROPLATING GOLD FINGER

CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...

Method and Apparatus for Flexible Circuit Cable Attachment

CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...

PRINTED CIRCUIT BOARD WITH A CONTACT POINT

TECHNOLOGIES FOR APPLYING GOLD-PLATED CONTACT PADS TO CIRCUIT BOARDS

STRUCTURE AND MECHANISM FOR ELECTRICALLY-CONNECTING AN EXTERNAL-CON...

Method and Apparatus for Flexible Circuit Cable Attachment

RESILIENT MICRO LATTICE ELECTRICAL INTERCONNECTION ASSEMBLY

ANODIC ALUMINUM OXIDE MOLD, MANUFACTURING METHOD THEREOF, HALF-FINI...

MANUFACTURING METHOD OF CIRCUIT CARRIER BOARD

WIRING SUBSTRATE DEVICE

Method and Apparatus for Flexible Circuit Cable Attachment

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Ceramic Substrate Component/Assembly with Raised Thermal Metal Pad,...

IMPLANTABLE CONNECTOR INCLUDING AT LEAST ONE ELECTRICAL COMPONENT

CIRCUIT BOARD STRUCTURES AND METHODS OF FABRICATING THE SAME

COMPOSITE SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

DISK HAVING AN ELECTRIC CONNECTING ELEMENT

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FO...

ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE

Method and Apparatus for Flexible Circuit Cable Attachment

CIRCUIT CARRIER BOARD AND MANUFACTURING METHOD THEREOF

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD

FRAME EMBEDDED COMPONENTS

SURFACE MOUNTED CONTACT FINGERS

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...