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CPC
H01L21/3046

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/3046using blasting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 12,148,665
- Issue date Nov 19, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring methods
- Patent number 11,837,680
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 11,756,830
- Issue date Sep 12, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing sample for thin film property measurement...
- Patent number 11,543,376
- Issue date Jan 3, 2023
- Seoul National University R&DB Foundation
- Ki-Bum Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for surface treatment of workpiece made from hard-brittle ma...
- Patent number 11,389,929
- Issue date Jul 19, 2022
- Fuji Manufacturing Co., Ltd.
- Keiji Mase
- B24 - GRINDING POLISHING
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 11,387,145
- Issue date Jul 12, 2022
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structuring methods
- Patent number 11,362,235
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monocrystalline semiconductor wafer and method for producing a semi...
- Patent number 11,075,070
- Issue date Jul 27, 2021
- Siltronic AG
- Klaus Roettger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 11,043,422
- Issue date Jun 22, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processed semiconductor device
- Patent number 10,910,274
- Issue date Feb 2, 2021
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jet ablation die singulation systems and related methods
- Patent number 10,607,889
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside processed semiconductor device
- Patent number 9,953,877
- Issue date Apr 24, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- Herb He Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,847,219
- Issue date Dec 19, 2017
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon substrates with compressive stress and methods for producti...
- Patent number 9,633,843
- Issue date Apr 25, 2017
- Global Wafers Co., Ltd
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die singulation method
- Patent number 9,484,210
- Issue date Nov 1, 2016
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spalling using dissolvable release layer
- Patent number 9,472,411
- Issue date Oct 18, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer processing method
- Patent number 9,236,264
- Issue date Jan 12, 2016
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,299,586
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing SOI substrate having backside sandblasted
- Patent number 8,288,251
- Issue date Oct 16, 2012
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded substrate with sandblast treatment
- Patent number 8,088,670
- Issue date Jan 3, 2012
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dicing semiconductor wafer into chips
- Patent number 7,121,925
- Issue date Oct 17, 2006
- Toyoda Gosei Co., Ltd.
- Masaki Hashimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nozzle for injecting sublimable solid particles entrained in gas fo...
- Patent number 7,008,306
- Issue date Mar 7, 2006
- K.C. Tech Co., Ltd.
- Cheol-Nam Yoon
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing substrates
- Patent number 6,620,735
- Issue date Sep 16, 2003
- Robert Bosch GmbH
- Stefan Pinter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling flatness of wafer and manufacturing method o...
- Patent number 6,599,435
- Issue date Jul 29, 2003
- TDK Corporation
- Toshio Kubota
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,508,693
- Issue date Jan 21, 2003
- Koninklijke Philips Electronics N.V.
- Petrus Cornelis Paulus Bouten
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a groove in a surface of a mother substrate
- Patent number 6,276,992
- Issue date Aug 21, 2001
- Murata Manufacturing Co., Ltd.
- Masuyoshi Houda
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of planarizing interlayer dielectric
- Patent number 5,747,385
- Issue date May 5, 1998
- NEC Corporation
- Kouji Torii
- B24 - GRINDING POLISHING
Information Patent Grant
Method for making circular diode chips through glass passivation
- Patent number 5,401,690
- Issue date Mar 28, 1995
- Goodark Electronic Corp.
- Chien-Chang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treatment of semiconductor wafer
- Patent number 5,348,893
- Issue date Sep 20, 1994
- Shin-Etsu Handotai Co., Ltd.
- Hirotoshi Yamagishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with high withstand voltage
- Patent number 5,132,769
- Issue date Jul 21, 1992
- Kabushiki Kaisha Meidensha
- Mitsuru Kekura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20230411214
- Publication date Dec 21, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230105626
- Publication date Apr 6, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Koji ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURING METHODS
- Publication number 20220278248
- Publication date Sep 1, 2022
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SAMPLE FOR THIN FILM PROPERTY MEASUREMENT...
- Publication number 20210278355
- Publication date Sep 9, 2021
- Seoul National University R&DB Foundation
- Ki-Bum KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210272847
- Publication date Sep 2, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20210074586
- Publication date Mar 11, 2021
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200203226
- Publication date Jun 25, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS
- Publication number 20200091000
- Publication date Mar 19, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SURFACE TREATMENT OF WORKPIECE MADE FROM HARD-BRITTLE MA...
- Publication number 20190283212
- Publication date Sep 19, 2019
- FUJI MANUFACTURING CO., LTD
- Keiji MASE
- B24 - GRINDING POLISHING
Information Patent Application
BACKSIDE PROCESSED SEMICONDUCTOR DEVICE
- Publication number 20180204776
- Publication date Jul 19, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- HERB HE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON SUBSTRATES WITH COMPRESSIVE STRESS AND METHODS FOR PRODUCTI...
- Publication number 20160307754
- Publication date Oct 20, 2016
- Global Wafers Co., Ltd
- Yao-Chung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPALLING USING DISSOLVABLE RELEASE LAYER
- Publication number 20160284554
- Publication date Sep 29, 2016
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20150228494
- Publication date Aug 13, 2015
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20150132925
- Publication date May 14, 2015
- Disco Corporation
- Sakae Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SINGULATION METHOD
- Publication number 20140134828
- Publication date May 15, 2014
- Semiconductor Components Industries, LLC
- William F. Burghout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110095404
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Preparing SOI Substrate Having Backside Sandblasted
- Publication number 20100279488
- Publication date Nov 4, 2010
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SANDBLAST ETCHING FOR THROUGH SEMICONDUCTOR VIAS
- Publication number 20100159699
- Publication date Jun 24, 2010
- Yoshimi Takahashi
- B24 - GRINDING POLISHING
Information Patent Application
Method for Microstructuring Solid Surfaces
- Publication number 20090212020
- Publication date Aug 27, 2009
- FRA UNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWAN
- Kuno Mayer
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing bonded substrate
- Publication number 20080261381
- Publication date Oct 23, 2008
- Shin-Etsu Chemical Co., Ltd.
- Shoji Akiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REMOVING IMPURITIES ON A GRINDING SURFACE OF A SEMICONDUC...
- Publication number 20080076232
- Publication date Mar 27, 2008
- Kazuyuki HOZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nozzle for injecting sublimable solid particles entrained in gas fo...
- Publication number 20050277370
- Publication date Dec 15, 2005
- Cheol-Nam Yoon
- B24 - GRINDING POLISHING
Information Patent Application
Method for dicing semiconductor wafer into chips
- Publication number 20030121511
- Publication date Jul 3, 2003
- Masaki Hashimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for processing substrates
- Publication number 20020061653
- Publication date May 23, 2002
- Stefan Pinter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for controlling flatness of wafer and manufacturing method o...
- Publication number 20020045352
- Publication date Apr 18, 2002
- Toshio Kubota
- H01 - BASIC ELECTRIC ELEMENTS

using blasting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Jet ablation die singulation systems and related methods

Substrate structuring methods

Jet ablation die singulation systems and related methods

Method for manufacturing sample for thin film property measurement...

Method for surface treatment of workpiece made from hard-brittle ma...

Jet ablation die singulation systems and related methods

Substrate structuring methods

Monocrystalline semiconductor wafer and method for producing a semi...

Jet ablation die singulation systems and related methods

Backside processed semiconductor device

Jet ablation die singulation systems and related methods

Backside processed semiconductor device

Semiconductor die singulation method

Silicon substrates with compressive stress and methods for producti...

Semiconductor die singulation method

Spalling using dissolvable release layer

Wafer processing method

Semiconductor device and method of manufacturing the same

Method for preparing SOI substrate having backside sandblasted

Method for manufacturing bonded substrate with sandblast treatment

Method for dicing semiconductor wafer into chips

Nozzle for injecting sublimable solid particles entrained in gas fo...

Method for processing substrates

Method for controlling flatness of wafer and manufacturing method o...

Method of manufacturing a semiconductor device

Method of forming a groove in a surface of a mother substrate

Method of planarizing interlayer dielectric

Method for making circular diode chips through glass passivation

Method for treatment of semiconductor wafer

Semiconductor device with high withstand voltage

Patents Applicationslast 30 patents

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE STRUCTURING METHODS

METHOD FOR MANUFACTURING SAMPLE FOR THIN FILM PROPERTY MEASUREMENT...

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS

METHOD FOR SURFACE TREATMENT OF WORKPIECE MADE FROM HARD-BRITTLE MA...

BACKSIDE PROCESSED SEMICONDUCTOR DEVICE

SILICON SUBSTRATES WITH COMPRESSIVE STRESS AND METHODS FOR PRODUCTI...

SPALLING USING DISSOLVABLE RELEASE LAYER

SEMICONDUCTOR DIE SINGULATION METHOD

WAFER PROCESSING METHOD

SEMICONDUCTOR DIE SINGULATION METHOD

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for Preparing SOI Substrate Having Backside Sandblasted

SANDBLAST ETCHING FOR THROUGH SEMICONDUCTOR VIAS

Method for Microstructuring Solid Surfaces

Method for manufacturing bonded substrate

METHOD OF REMOVING IMPURITIES ON A GRINDING SURFACE OF A SEMICONDUC...

Nozzle for injecting sublimable solid particles entrained in gas fo...

Method for dicing semiconductor wafer into chips

Method for processing substrates

Method for controlling flatness of wafer and manufacturing method o...