Using chemical substances

Industry

CPC
H05K2203/161

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/161Using chemical substances

Industries

Patents Grantslast 30 patents

Information Patent Grant
Capacitor with visual indicator
- Patent number 11,340,287
- Issue date May 24, 2022
- Intel Corporation
- Ramaswamy Parthasarathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Colored thin covering film and manufacturing method
- Patent number 11,116,074
- Issue date Sep 7, 2021
- ASIA ELECTRONIC MATERIAL CO., LTD.
- Wei-Chih Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Black resin composition, polyimide with black resin cured film and...
- Patent number 10,822,465
- Issue date Nov 3, 2020
- Kaneka Corporation
- Tetsuya Kogiso
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Circuit components and methods for manufacturing the same and bondi...
- Patent number 10,412,823
- Issue date Sep 10, 2019
- BOE Technology Group Co., Ltd.
- Tingliang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate inspection device and substrate manufacturing method
- Patent number 10,379,064
- Issue date Aug 13, 2019
- Nippon Mektron, Ltd.
- Kenichi Mishima
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible printed circuit, chip on film, and bonding method and disp...
- Patent number 10,299,384
- Issue date May 21, 2019
- BOE Technology Group Co., Ltd.
- Qiang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Black photosensitive resin composition and use of same
- Patent number 10,030,133
- Issue date Jul 24, 2018
- Kaneka Corporation
- Masayoshi Kido
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Resin composition for pigment-containing insulating film, and use t...
- Patent number 9,957,390
- Issue date May 1, 2018
- Kaneka Corporation
- Yoshihide Sekito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 9,839,137
- Issue date Dec 5, 2017
- Nitto Denko Corporation
- Norihiko Okamoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Photosensitive resin composition, cured product thereof, and printe...
- Patent number 9,282,644
- Issue date Mar 8, 2016
- TAIYO HOLDINGS CO., LTD.
- Chiho Ueta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated through hole void detection in printed circuit boards by det...
- Patent number 9,250,192
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lubricant sheet for drilling and method of drilling
- Patent number 9,211,592
- Issue date Dec 15, 2015
- Mitsubishi Gas Chemical Company, Inc.
- Nobuyuki Ikeguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board having enhanced contrast between conductive pat...
- Patent number 9,084,359
- Issue date Jul 14, 2015
- Nitto Denko Corporation
- Norihiko Okamoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Ink-jet printer ink
- Patent number 8,822,562
- Issue date Sep 2, 2014
- M.G.I. USA, Inc.
- Edmond Abergel
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process for producing pigment-containing curable resin solution com...
- Patent number 8,735,467
- Issue date May 27, 2014
- UBE Industries, Ltd.
- Tooru Murakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 8,669,478
- Issue date Mar 11, 2014
- Shinko Electric Industries Co., Ltd.
- Hitoshi Kondo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly
- Patent number 8,562,360
- Issue date Oct 22, 2013
- Chi Mei Communication Systems, Inc.
- Min-An Ching
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly with color-changing layer
- Patent number 8,508,946
- Issue date Aug 13, 2013
- Chi Mei Communication Systems, Inc.
- Min-An Ching
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment inspection
- Patent number 8,399,264
- Issue date Mar 19, 2013
- Intel Corporation
- Zhihua Zou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board
- Patent number 8,378,226
- Issue date Feb 19, 2013
- Nitto Denko Corporation
- Makoto Tsunekawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg with carrier and process for manufacturing same, multi-laye...
- Patent number 8,362,363
- Issue date Jan 29, 2013
- Sumitomo Bakelite Co., Ltd.
- Ryoichi Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder flux
- Patent number 8,348,135
- Issue date Jan 8, 2013
- Henkel Limited
- Frank Timothy Lawrence
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting film, and joined structure and method for producing the...
- Patent number 8,309,638
- Issue date Nov 13, 2012
- Sony Chemical & Information Device Corporation
- Tomoyuki Ishimatsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, prepreg, laminated board, multilayer printed wir...
- Patent number 8,294,268
- Issue date Oct 23, 2012
- Sumitomo Bakelite Company, Ltd.
- Tadasuke Endo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing circuit board
- Patent number 8,272,126
- Issue date Sep 25, 2012
- Panasonic Corporation
- Shingo Yoshioka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-piece board and fabrication method therefor
- Patent number 8,259,467
- Issue date Sep 4, 2012
- Ibiden Co., Ltd.
- Yasushi Hasegawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component, manufacturing method of ceramic elect...
- Patent number 8,179,225
- Issue date May 15, 2012
- TDK Corporation
- Toshihiro Iguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Article comprising conductive conduit channels
- Patent number 8,062,734
- Issue date Nov 22, 2011
- Eastman Kodak Company
- Cheryl J. Kaminsky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Photosensitive resin composition comprising a halogen-free colorant
- Patent number 8,034,531
- Issue date Oct 11, 2011
- BASF SE
- Hidetaka Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Portable memory devices
- Patent number 8,013,332
- Issue date Sep 6, 2011
- SanDisk Technologies Inc.
- Warren Middlekauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20220369469
- Publication date Nov 17, 2022
- TANAZAWA HAKKOSHA CO., LTD.
- Keiichiro YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...
- Publication number 20180371191
- Publication date Dec 27, 2018
- Sumitomo Electric Industries, Ltd.
- Kayo HASHIZUME
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT COMPONENTS AND METHODS FOR MANUFACTURING THE SAME AND BONDI...
- Publication number 20180242445
- Publication date Aug 23, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Tingliang Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE INSPECTION DEVICE AND SUBSTRATE MANUFACTURING METHOD
- Publication number 20180202946
- Publication date Jul 19, 2018
- NIPPON MEKTRON, LTD.
- Kenichi MISHIMA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECT...
- Publication number 20160266050
- Publication date Sep 15, 2016
- Nitto Denko Corporation
- Yoshihiro TOYODA
- G01 - MEASURING TESTING
Information Patent Application
WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF
- Publication number 20150040379
- Publication date Feb 12, 2015
- Nitto Denko Corporation
- Norihiko OKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NOVEL RESIN COMPOSITION FOR PIGMENT-CONTAINING INSULATING FILM, AND...
- Publication number 20140370301
- Publication date Dec 18, 2014
- Kaneka Corporation
- Yoshihide Sekito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTE...
- Publication number 20140360758
- Publication date Dec 11, 2014
- TAIYO HOLDINGS CO., LTD.
- Chiho UETA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...
- Publication number 20140342113
- Publication date Nov 20, 2014
- United States of America as represented by the Secretary of the Navy
- Nishkamraj U. Deshpande
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYIMIDE FILM AND POLYIMIDE LAMINATE THEREOF
- Publication number 20140205824
- Publication date Jul 24, 2014
- MORTECH CORPORATION
- Der-Jen SUN
- B32 - LAYERED PRODUCTS
Information Patent Application
Plated Through Hole Void Detection in Printed Circuit Boards by Det...
- Publication number 20140076478
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Bruce John Chamberlin
- G01 - MEASURING TESTING
Information Patent Application
Purple Solder Proof Ink Composition, Purple Printed Circuit Board a...
- Publication number 20130164505
- Publication date Jun 27, 2013
- CHONGQING FOUNDER HI-TECH ELECTRONIC INC.
- Shikong WU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE
- Publication number 20130136850
- Publication date May 30, 2013
- Illinois Tool Works Inc.
- Dennis G. Doyle
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTE...
- Publication number 20130048357
- Publication date Feb 28, 2013
- TAIYO HOLDINGS CO., LTD.
- Chiho Ueta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plated Through Hole Void Detection in Printed Circuit Boards by Det...
- Publication number 20130014977
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Bruce John Chamberlin
- G01 - MEASURING TESTING
Information Patent Application
Plated Through Hole Void Detection in Printed Circuit Boards by Det...
- Publication number 20130016465
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Bruce John Chamberlin
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...
- Publication number 20120292083
- Publication date Nov 22, 2012
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TELEVISION AND ELECTRONIC APPARATUS
- Publication number 20120268658
- Publication date Oct 25, 2012
- Kabushiki Kaisha Toshiba
- Kenji Hasegawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20120171878
- Publication date Jul 5, 2012
- Chi Mei Communications Systems, Inc.
- Min-An CHING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20120162937
- Publication date Jun 28, 2012
- CHI MEI COMMUNICATION SYSTEMS, INC.
- MIN-AN CHING
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNMENT INSPECTION
- Publication number 20120135546
- Publication date May 31, 2012
- Zhihua Zou
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20120055697
- Publication date Mar 8, 2012
- Nitto Denko Corporation
- Norihiko Okamoto
- G11 - INFORMATION STORAGE
Information Patent Application
PORTABLE MEMORY DEVICES
- Publication number 20110315987
- Publication date Dec 29, 2011
- Warren Middlekauff
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110308849
- Publication date Dec 22, 2011
- SHINKO ELECTRIC INDUSTRIES CO. LTD.
- Hitoshi KONDO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20110290536
- Publication date Dec 1, 2011
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE...
- Publication number 20110223430
- Publication date Sep 15, 2011
- SONY CHEMICAL & INFORMATION DEVICE CORPORATION
- Tomoyuki ISHIMATSU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COLOURED INK AND A METHOD FOR FORMULATING A COLORED INK
- Publication number 20110190429
- Publication date Aug 4, 2011
- Camtek Ltd.
- Iraqi Muhammad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and Device for Printing a Substrate
- Publication number 20110120334
- Publication date May 26, 2011
- MAN Roland Druckmaschinen AG
- Josef SCHNEIDER
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR PRODUCING CIRCUIT CARRIERS
- Publication number 20110048640
- Publication date Mar 3, 2011
- Conti Temic microelectronic GmbH
- Helmut Heinz
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND USE THEREOF
- Publication number 20100201802
- Publication date Aug 12, 2010
- SHOWA DENKO K.K.
- Mina Onishi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Using chemical substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Capacitor with visual indicator

Colored thin covering film and manufacturing method

Black resin composition, polyimide with black resin cured film and...

Circuit components and methods for manufacturing the same and bondi...

Substrate inspection device and substrate manufacturing method

Flexible printed circuit, chip on film, and bonding method and disp...

Black photosensitive resin composition and use of same

Resin composition for pigment-containing insulating film, and use t...

Wired circuit board and producing method thereof

Photosensitive resin composition, cured product thereof, and printe...

Plated through hole void detection in printed circuit boards by det...

Lubricant sheet for drilling and method of drilling

Wired circuit board having enhanced contrast between conductive pat...

Ink-jet printer ink

Process for producing pigment-containing curable resin solution com...

Wiring substrate and method of manufacturing the same

Circuit board assembly

Circuit board assembly with color-changing layer

Alignment inspection

Wired circuit board

Prepreg with carrier and process for manufacturing same, multi-laye...

Solder flux

Connecting film, and joined structure and method for producing the...

Resin composition, prepreg, laminated board, multilayer printed wir...

Method of producing circuit board

Multi-piece board and fabrication method therefor

Ceramic electronic component, manufacturing method of ceramic elect...

Article comprising conductive conduit channels

Photosensitive resin composition comprising a halogen-free colorant

Portable memory devices

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING PRINTED WIRING BOARD

BASE FILM FOR PRINTED CIRCUIT BOARD, SUBSTRATE FOR PRINTED CIRCUIT...

CIRCUIT COMPONENTS AND METHODS FOR MANUFACTURING THE SAME AND BONDI...

SUBSTRATE INSPECTION DEVICE AND SUBSTRATE MANUFACTURING METHOD

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD OF INSPECT...

WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF

NOVEL RESIN COMPOSITION FOR PIGMENT-CONTAINING INSULATING FILM, AND...

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTE...

STRUCTURES AND METHODS RELATED TO DETECTION, SENSING, AND/OR MITIGA...

POLYIMIDE FILM AND POLYIMIDE LAMINATE THEREOF

Plated Through Hole Void Detection in Printed Circuit Boards by Det...

Purple Solder Proof Ink Composition, Purple Printed Circuit Board a...

METHOD FOR DEPOSITING MATERIALS ON A SUBSTRATE

PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTE...

Plated Through Hole Void Detection in Printed Circuit Boards by Det...

Plated Through Hole Void Detection in Printed Circuit Boards by Det...

METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT B...

TELEVISION AND ELECTRONIC APPARATUS

CIRCUIT BOARD ASSEMBLY

CIRCUIT BOARD ASSEMBLY

ALIGNMENT INSPECTION

Wired circuit board and producing method thereof

PORTABLE MEMORY DEVICES

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE

CONNECTING FILM, AND JOINED STRUCTURE AND METHOD FOR PRODUCING THE...

COLOURED INK AND A METHOD FOR FORMULATING A COLORED INK

Process and Device for Printing a Substrate

METHOD FOR PRODUCING CIRCUIT CARRIERS

RESIN COMPOSITION AND USE THEREOF