Using different connection materials

Industry

CPC
H05K2201/10992

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10992Using different connection materials

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assemblies
- Patent number 11,805,602
- Issue date Oct 31, 2023
- Intel Corporation
- Loke Yip Foo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting electronic components to mounting substrates
- Patent number 11,470,726
- Issue date Oct 11, 2022
- Murata Manufacturing Co., Ltd.
- Yves Aubry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 11,227,776
- Issue date Jan 18, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with electrical components end mounted to printed circuit...
- Patent number 11,153,970
- Issue date Oct 19, 2021
- ATL TECHNOLOGY, LLC
- David Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, diaphragm, and electronic device
- Patent number 10,796,837
- Issue date Oct 6, 2020
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding component with pre-connected pillar in component carrier
- Patent number 10,765,005
- Issue date Sep 1, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Hannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package module
- Patent number 10,638,614
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Hyuk-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 10,412,834
- Issue date Sep 10, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Materials for use with interconnects of electrical devices and rela...
- Patent number 10,123,430
- Issue date Nov 6, 2018
- Alpha Assembly Solutions Inc.
- Michael T. Marczi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual solder layer for fluidic self assembly and electrical componen...
- Patent number 10,039,194
- Issue date Jul 31, 2018
- OSRAM SYLVANIA Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure and method for manufacturing same
- Patent number 9,795,036
- Issue date Oct 17, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Arata Kishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package assembly
- Patent number 9,788,425
- Issue date Oct 10, 2017
- VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Nai-Shung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered solder material for bonding different species of electrodes...
- Patent number 9,669,493
- Issue date Jun 6, 2017
- Senju Metal Industry Co., Ltd.
- Koji Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 9,578,744
- Issue date Feb 21, 2017
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component housing container and electronic device
- Patent number 9,516,770
- Issue date Dec 6, 2016
- KYOCERA Corporation
- Tsuyoshi Kanchiku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 9,414,513
- Issue date Aug 9, 2016
- Murata Manufacturing Co., Ltd.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 9,327,364
- Issue date May 3, 2016
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective application by electroless plating of a tin-whisker impen...
- Patent number 9,295,165
- Issue date Mar 22, 2016
- LDF Coatings, LLC.
- Robert J Landman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package system with mounting features for clearance
- Patent number 9,084,377
- Issue date Jul 14, 2015
- Stats Chippac Ltd.
- Seng Guan Chow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder piece, chip solder and method of fabricating solder piece
- Patent number 8,991,679
- Issue date Mar 31, 2015
- Senju Metal Industry Co., Ltd.
- Masahiko Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device, interposer and method of manufacturing electroni...
- Patent number 8,964,402
- Issue date Feb 24, 2015
- Fujitsu Limited
- Teru Nakanishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering material and electronic component assembly
- Patent number 8,598,464
- Issue date Dec 3, 2013
- Panasonic Corporation
- Shigeaki Sakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting structure, electronic component mount...
- Patent number 8,581,403
- Issue date Nov 12, 2013
- NEC Corporation
- Akira Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder layer, substrate for device joining utilizing the same and m...
- Patent number 8,516,692
- Issue date Aug 27, 2013
- Dowa Electronics Materials Co., Ltd.
- Yoshikazu Oshika
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device mounted structure and its manufacturing method
- Patent number 8,450,859
- Issue date May 28, 2013
- Panasonic Corporation
- Naomichi Ohashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board minimizing undesirable signal reflections in...
- Patent number 8,115,110
- Issue date Feb 14, 2012
- Amphenol Corporation
- Leon M. Khilchenko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Paste for soldering and soldering method using the same
- Patent number 8,083,121
- Issue date Dec 27, 2011
- Panasonic Corporation
- Tadashi Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder mounting structure, method for manufacturing such solder mou...
- Patent number 7,968,801
- Issue date Jun 28, 2011
- Sharp Kabushiki Kaisha
- Kazuo Kinoshita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 7,956,468
- Issue date Jun 7, 2011
- Fujitsu Limited
- Motoyuki Nishizawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ASSEMBLIES
- Publication number 20220078914
- Publication date Mar 10, 2022
- Intel Corporation
- Loke Yip FOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING ELECTRONIC COMPONENTS TO MOUNTING SUBSTRATES
- Publication number 20210084772
- Publication date Mar 18, 2021
- Murata Manufacturing Co., Ltd.
- Yves Aubry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE MODULE
- Publication number 20190246505
- Publication date Aug 8, 2019
- Samsung Electronics Co., Ltd.
- Hyuk-jin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170374743
- Publication date Dec 28, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Arata KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL
- Publication number 20160183369
- Publication date Jun 23, 2016
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20150282316
- Publication date Oct 1, 2015
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- ZHANG-LONG PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...
- Publication number 20150223346
- Publication date Aug 6, 2015
- Osram Sylvania Inc.
- Jeffery Serre
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MODULE
- Publication number 20150103495
- Publication date Apr 16, 2015
- MURATA MANUFACTURING CO., LTD.
- Hideo Nakagoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE
- Publication number 20130082087
- Publication date Apr 4, 2013
- SENJU METAL INDUSTRY CO., LTD.
- Masahiko Abe
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Flip-chip Mounting Structure and Flip-chip Mounting Method
- Publication number 20120273942
- Publication date Nov 1, 2012
- Japan Aviation Electronics Industry ,Limited
- Daisuke Uchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...
- Publication number 20120224331
- Publication date Sep 6, 2012
- Weston Roth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Selective Application by Electroless Plating of a Tin-Whisker Impen...
- Publication number 20120195016
- Publication date Aug 2, 2012
- Robert J. Landman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL CONNECTION AND METHOD FOR MAKING THE SAME
- Publication number 20120194101
- Publication date Aug 2, 2012
- Karl M. Kropp
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONI...
- Publication number 20120176759
- Publication date Jul 12, 2012
- FUJITSU LIMITED
- Teru Nakanishi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE
- Publication number 20120067619
- Publication date Mar 22, 2012
- Masamichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY
- Publication number 20110120769
- Publication date May 26, 2011
- Shigeaki Sakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...
- Publication number 20110100690
- Publication date May 5, 2011
- Fujitsu Limited
- Hideaki Yoshimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD
- Publication number 20110095423
- Publication date Apr 28, 2011
- Naomichi Ohashi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...
- Publication number 20100326726
- Publication date Dec 30, 2010
- FUJITSU LIMITED
- Hisao Tanaka
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT MOUNT...
- Publication number 20100295177
- Publication date Nov 25, 2010
- Akira Ouchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device with an Improved Solder Joint
- Publication number 20100291734
- Publication date Nov 18, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi AMAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100276803
- Publication date Nov 4, 2010
- PANASONIC CORPORATION
- Takayuki Higuchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100148368
- Publication date Jun 17, 2010
- Fujitsu Limited
- Motoyuki NISHIZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...
- Publication number 20100139958
- Publication date Jun 10, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF RE...
- Publication number 20100052163
- Publication date Mar 4, 2010
- NEC Corporation
- Akira Ouchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD...
- Publication number 20100032194
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Hisashi KATO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor Device with an Improved Solder Joint
- Publication number 20100032840
- Publication date Feb 11, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Masazumi AMAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method therefor
- Publication number 20100013092
- Publication date Jan 21, 2010
- NEC Electronic Corporation
- Tsuyoshi Eda
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LE...
- Publication number 20090310318
- Publication date Dec 17, 2009
- Cisco Technology, Inc.
- Mudasir Ahmad
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Using different connection materials

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Leadframe package with pre-applied filler material

Chip assemblies

Connecting electronic components to mounting substrates

Leadframe package with pre-applied filler material

Apparatus with electrical components end mounted to printed circuit...

Electronic component, diaphragm, and electronic device

Embedding component with pre-connected pillar in component carrier

Semiconductor package module

Mounting structure and method for manufacturing same

Materials for use with interconnects of electrical devices and rela...

Dual solder layer for fluidic self assembly and electrical componen...

Mounting structure and method for manufacturing same

Electronic package assembly

Layered solder material for bonding different species of electrodes...

Leadframe package with pre-applied filler material

Electronic component housing container and electronic device

Electronic component module

Solder piece, chip solder and method of fabricating solder piece

Selective application by electroless plating of a tin-whisker impen...

Integrated circuit package system with mounting features for clearance

Solder piece, chip solder and method of fabricating solder piece

Electronic device, interposer and method of manufacturing electroni...

Soldering material and electronic component assembly

Electronic component mounting structure, electronic component mount...

Solder layer, substrate for device joining utilizing the same and m...

Semiconductor device mounted structure and its manufacturing method

Printed circuit board minimizing undesirable signal reflections in...

Paste for soldering and soldering method using the same

Solder mounting structure, method for manufacturing such solder mou...

Semiconductor device

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

CHIP ASSEMBLIES

CONNECTING ELECTRONIC COMPONENTS TO MOUNTING SUBSTRATES

SEMICONDUCTOR PACKAGE MODULE

MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME

LEADFRAME PACKAGE WITH PRE-APPLIED FILLER MATERIAL

PRINTED CIRCUIT BOARD

DUAL SOLDER LAYER FOR FLUIDIC SELF ASSEMBLY AND ELECTRICAL COMPONEN...

ELECTRONIC COMPONENT MODULE

SOLDER PIECE, CHIP SOLDER AND METHOD OF FABRICATING SOLDER PIECE

Flip-chip Mounting Structure and Flip-chip Mounting Method

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD...

Selective Application by Electroless Plating of a Tin-Whisker Impen...

ELECTRICAL CONNECTION AND METHOD FOR MAKING THE SAME

ELECTRONIC DEVICE, INTERPOSER AND METHOD OF MANUFACTURING ELECTRONI...

CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

SOLDERING MATERIAL AND ELECTRONIC COMPONENT ASSEMBLY

ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF...

SEMICONDUCTOR DEVICE MOUNTED STRUCTURE AND ITS MANUFACTURING METHOD

SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDE...

ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT MOUNT...

Semiconductor Device with an Improved Solder Joint

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

STRUCTURE AND METHOD TO GAIN SUBSTANTIAL RELIABILITY IMPROVEMENTS I...

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF RE...

PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD...

Semiconductor Device with an Improved Solder Joint

Semiconductor device and manufacturing method therefor

ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LE...