Using different types of conductors

Industry

CPC
H05K2201/0391

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/0391Using different types of conductors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board
- Patent number 12,101,880
- Issue date Sep 24, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hee-Joon Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a glass substrate with a plurality of vias
- Patent number 11,646,246
- Issue date May 9, 2023
- Samtec, Inc.
- Tim Mobley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting printed circuit board related systems, methods, and...
- Patent number 11,617,272
- Issue date Mar 28, 2023
- D-Wave Systems Inc.
- Richard D. Neufeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible membrane for applying a pattern to a substrate
- Patent number 11,570,902
- Issue date Jan 31, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,558,959
- Issue date Jan 17, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 11,546,999
- Issue date Jan 3, 2023
- Lumet Technologies Ltd.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with different surface finishes and method for ma...
- Patent number 11,284,511
- Issue date Mar 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Giordano Di Gregorio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Filling materials and methods of filling through holes of a substrate
- Patent number 11,251,109
- Issue date Feb 15, 2022
- Samtec, Inc.
- Tim Mobley
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Electronic device, method and apparatus for producing an electronic...
- Patent number 11,240,916
- Issue date Feb 1, 2022
- CRYOVAC, LLC
- James W. Blease
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting a flexible circuit to other structures
- Patent number 11,219,124
- Issue date Jan 4, 2022
- Microsoft Technology Licensing, LLC
- James David Holbery
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Touch panel and trace structure thereof
- Patent number 11,093,071
- Issue date Aug 17, 2021
- TPK Glass Solutions (Xiamen) Inc.
- Jui-Hsing Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,089,674
- Issue date Aug 10, 2021
- Ibiden Co., Ltd.
- Tomoyuki Ikeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,083,086
- Issue date Aug 3, 2021
- Ibiden Co., Ltd.
- Youhong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 10,973,129
- Issue date Apr 6, 2021
- Lumet Technologies Ltd.
- Benzion Landa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Sn whisker growth mitigation using NiO sublayers
- Patent number 10,967,463
- Issue date Apr 6, 2021
- The University of Toledo
- Vamsi Borra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 10,834,824
- Issue date Nov 10, 2020
- Landa Labs (2012) Ltd.
- Benzion Landa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method for manufacturing electrical conductors, and electrical cond...
- Patent number 10,828,486
- Issue date Nov 10, 2020
- Ecole Polytechnique Federale de Lausanne (EPFL)
- Arthur Hirsch
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Fabric coated with functional silicone rubber
- Patent number 10,772,200
- Issue date Sep 8, 2020
- WAVE COMPANY CO., LTD.
- Na-Yun Cho
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Electrode embedded member
- Patent number 10,750,611
- Issue date Aug 18, 2020
- NGK Spark Plug Co., Ltd.
- Atsushi Tsuchida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated metallization structures
- Patent number 10,699,948
- Issue date Jun 30, 2020
- Analog Devices Global Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board, semiconductor package including the printed...
- Patent number 10,672,694
- Issue date Jun 2, 2020
- Samsung Electronics Co., Ltd.
- Dong-suk Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 10,645,815
- Issue date May 5, 2020
- Landa Labs (2012) Ltd.
- Benzion Landa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,595,416
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure comprising an inductor and resistor
- Patent number 10,586,774
- Issue date Mar 10, 2020
- Rohm Co., Ltd.
- Takuma Shimoichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate
- Patent number 10,559,534
- Issue date Feb 11, 2020
- Industrial Technology Research Institute
- Sheng-Che Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,390,439
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Brian L. Carlson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MODULE
- Publication number 20240284591
- Publication date Aug 22, 2024
- MURATA MANUFACTURING CO., LTD.
- Tsuyoshi TAKAKURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220408559
- Publication date Dec 22, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Hee-Joon CHUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220217843
- Publication date Jul 7, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jin Uk Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device, Method and Apparatus for Producing an Electronic...
- Publication number 20200107450
- Publication date Apr 2, 2020
- James W. Blease
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SUPERCONDUCTING PRINTED CIRCUIT BOARD RELATED SYSTEMS, METHODS, AND...
- Publication number 20200068722
- Publication date Feb 27, 2020
- D-WAVE SYSTEMS INC.
- Richard D. Neufeld
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER
- Publication number 20200010707
- Publication date Jan 9, 2020
- National Research Council of Canada
- Sylvie LAFRENIÈRE
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
FABRIC COATED WITH FUNCTIONAL SILICONE RUBBER
- Publication number 20190208629
- Publication date Jul 4, 2019
- WAVE COMPANY CO., LTD.
- Na-Yun Cho
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Application
SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...
- Publication number 20180288867
- Publication date Oct 4, 2018
- JX NIPPON MINING & METALS CORPORATION
- RYO FUKUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170188456
- Publication date Jun 29, 2017
- Samsung Electronics Co., Ltd.
- Youngjin CHO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...
- Publication number 20170135211
- Publication date May 11, 2017
- Intel Corporation
- William J. Lambert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20160242286
- Publication date Aug 18, 2016
- MURATA MANUFACTURING CO., LTD.
- Ryota ASAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME
- Publication number 20160234930
- Publication date Aug 11, 2016
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Chan Woo PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160037629
- Publication date Feb 4, 2016
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
- Publication number 20150208503
- Publication date Jul 23, 2015
- Fujitsu Limited
- Shotaro Hamao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...
- Publication number 20150156873
- Publication date Jun 4, 2015
- PANASONIC CORPORATION
- Shingo YOSHIOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COIL-INTEGRATED PRINTED CIRCUIT BOARD AND MAGNETIC DEVICE
- Publication number 20150116963
- Publication date Apr 30, 2015
- OMRON AUTOMOTIVE ELECTRONICS CO., LTD.
- Koji Hachiya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE AND FANOUT LINE STRUCTURE OF THE ARRAY SUBSTRATE
- Publication number 20140291846
- Publication date Oct 2, 2014
- SHENZHEN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Li Chai
- G02 - OPTICS
Information Patent Application
PATTERNED CONDUCTIVE POLYMER WITH DIELECTRIC PATCH
- Publication number 20140290988
- Publication date Oct 2, 2014
- Todd Mathew Spath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME
- Publication number 20140268783
- Publication date Sep 18, 2014
- Sharp Kabushiki Kaisha
- Makoto AGATANI
- F21 - LIGHTING
Information Patent Application
TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140198266
- Publication date Jul 17, 2014
- SAMSUNG DISPLAY CO., LTD.
- Hee-Woong Park
- B82 - NANO-TECHNOLOGY
Information Patent Application
WIRING BOARD
- Publication number 20140139310
- Publication date May 22, 2014
- Kabushiki Kaisha Toyota Jidoshokki
- Hiroaki Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS
- Publication number 20140123489
- Publication date May 8, 2014
- International Business Machines Corporation
- MOISES CASES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY
- Publication number 20140055328
- Publication date Feb 27, 2014
- Takashi Osako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF
- Publication number 20140027160
- Publication date Jan 30, 2014
- Seok Yoon HONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus Comprising a Conductive Path and a Method of Forming an A...
- Publication number 20140002370
- Publication date Jan 2, 2014
- Nokia Corporation
- Aaron B. Konvisser
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTILAYER FLEXIBLE SUBSTRATE
- Publication number 20130256001
- Publication date Oct 3, 2013
- Murata Manufacturing Co., Ltd.
- Norio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153266
- Publication date Jun 20, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin Gul Hyun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130153280
- Publication date Jun 20, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Sang Hoon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...
- Publication number 20130112469
- Publication date May 9, 2013
- IBIDEN CO., LTD.
- Yasuhiro WATANABE
- H01 - BASIC ELECTRIC ELEMENTS

Using different types of conductors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board

Application of electrical conductors of a solar cell

Plated metallization structures

Application of electrical conductors to an electrically insulating...

Method for applying a pattern to a substrate

Method of fabricating a glass substrate with a plurality of vias

Superconducting printed circuit board related systems, methods, and...

Flexible membrane for applying a pattern to a substrate

Printed circuit board

Apparatus for applying of a conductive pattern to a substrate

Component carrier with different surface finishes and method for ma...

Filling materials and methods of filling through holes of a substrate

Electronic device, method and apparatus for producing an electronic...

Connecting a flexible circuit to other structures

Touch panel and trace structure thereof

Wiring substrate and method for manufacturing wiring substrate

Printed wiring board and method for manufacturing printed wiring board

Application of electrical conductors of a solar cell

Sn whisker growth mitigation using NiO sublayers

Apparatus for applying of a conductive pattern to a substrate

Method for manufacturing electrical conductors, and electrical cond...

Fabric coated with functional silicone rubber

Electrode embedded member

Plated metallization structures

Printed circuit board, semiconductor package including the printed...

Application of electrical conductors to an electrically insulating...

Insertion loss reduction and increased bonding in a circuit apparatus

Structure comprising an inductor and resistor

Circuit substrate

Insertion loss reduction and increased bonding in a circuit apparatus

Patents Applicationslast 30 patents

CIRCUIT MODULE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD

Electronic Device, Method and Apparatus for Producing an Electronic...

SUPERCONDUCTING PRINTED CIRCUIT BOARD RELATED SYSTEMS, METHODS, AND...

METHOD OF FINISHING A METALLIC CONDUCTIVE LAYER

FABRIC COATED WITH FUNCTIONAL SILICONE RUBBER

SURFACE TREATED COPPER FOIL, LAMINATE USING THE SAME, COPPER FOIL W...

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

CONDUCTIVE COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME

SYSTEMS AND METHODS FOR CONTROLLED EFFECTIVE SERIES RESISTANCE COMP...

WIRING BOARD AND METHOD OF MANUFACTURING SAME

STRETCHABLE TRANSPARENT ELECTRODE AND METHOD OF FABRICATING SAME

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE HAVING COMPONENT MOUNTED ON...

COIL-INTEGRATED PRINTED CIRCUIT BOARD AND MAGNETIC DEVICE

ARRAY SUBSTRATE AND FANOUT LINE STRUCTURE OF THE ARRAY SUBSTRATE

PATTERNED CONDUCTIVE POLYMER WITH DIELECTRIC PATCH

LIGHT-EMITTING DEVICE AND LIGHTING DEVICE PROVIDED WITH THE SAME

TOUCH SCREEN PANEL AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD

THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS

DISPLAY

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF

Apparatus Comprising a Conductive Path and a Method of Forming an A...

MULTILAYER FLEXIBLE SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD OF MULTILA...