using dynamic pressure

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H01L2021/60195

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60195using dynamic pressure

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Patents Grantslast 30 patents

Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,908,828
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,862,542
- Issue date Jan 2, 2024
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wedge tool, bonding device, and bonding inspection method
- Patent number 11,756,919
- Issue date Sep 12, 2023
- Mitsubishi Electric Corporation
- Daisuke Imai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus and wire bonding method
- Patent number 11,610,860
- Issue date Mar 21, 2023
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contaminant control in thermocompression bonding of semiconductors...
- Patent number 11,410,964
- Issue date Aug 9, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,393,700
- Issue date Jul 19, 2022
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei Seyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dual side cooling power module and manufacturing method of the same
- Patent number 11,251,112
- Issue date Feb 15, 2022
- Hyundai Mobis Co., Ltd.
- HanSin Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale ultrasonic sensing device and manufacturing method thereof
- Patent number 11,075,072
- Issue date Jul 27, 2021
- J-Metrics Technology Co., Ltd.
- Yu-Feng Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for stacked module, stacked module, and method for manufa...
- Patent number 9,922,918
- Issue date Mar 20, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 9,779,965
- Issue date Oct 3, 2017
- Kulicke and Soffa Industries, Inc.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
- Publication number 20220320037
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220102249
- Publication date Mar 31, 2022
- HYUNDAI MOBIS CO., LTD.
- HanSin CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CLIP AND RELATED METHODS
- Publication number 20210159157
- Publication date May 27, 2021
- Semiconductor Components Industries, LLC
- Keunhyuk LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...
- Publication number 20210159206
- Publication date May 27, 2021
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS AND WIRE BONDING METHOD
- Publication number 20210091038
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Masatoshi Tanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210013026
- Publication date Jan 14, 2021
- J-METRICS TECHNOLOGY CO., LTD.
- Yu-Feng JIN
- B24 - GRINDING POLISHING
Information Patent Application
WEDGE TOOL, BONDING DEVICE, AND BONDING INSPECTION METHOD
- Publication number 20200395333
- Publication date Dec 17, 2020
- Mitsubishi Electric Corporation
- Daisuke IMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20200388507
- Publication date Dec 10, 2020
- Yamaha Motor Robotics Holdings Co., Ltd.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
- Publication number 20170186627
- Publication date Jun 29, 2017
- KULICKE AND SOFFA INDUSTRIES, INC.
- Robert N. Chylak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR STACKED MODULE, STACKED MODULE, AND METHOD FOR MANUFA...
- Publication number 20170179014
- Publication date Jun 22, 2017
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H01 - BASIC ELECTRIC ELEMENTS

using dynamic pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Contaminant control in thermocompression bonding of semiconductors...

Dual side cooling power module and manufacturing method of the same

Wedge tool, bonding device, and bonding inspection method

Wire bonding apparatus and wire bonding method

Contaminant control in thermocompression bonding of semiconductors...

Bonding apparatus and bonding method

Dual side cooling power module and manufacturing method of the same

Wafer scale ultrasonic sensing device and manufacturing method thereof

Substrate for stacked module, stacked module, and method for manufa...

Systems and methods for bonding semiconductor elements

Patents Applicationslast 30 patents

CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...

DUAL SIDE COOLING POWER MODULE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR CLIP AND RELATED METHODS

CONTAMINANT CONTROL IN THERMOCOMPRESSION BONDING OF SEMICONDUCTORS...

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

WAFER SCALE ULTRASONIC SENSING DEVICE AND MANUFACTURING METHOD THEREOF

WEDGE TOOL, BONDING DEVICE, AND BONDING INSPECTION METHOD

BONDING DEVICE AND BONDING METHOD

SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS

SUBSTRATE FOR STACKED MODULE, STACKED MODULE, AND METHOD FOR MANUFA...