Using electric, magnetic and electromagnetic fields Using laser light

Industry

CPC
H05K2203/10

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/10Using electric, magnetic and electromagnetic fields Using laser light

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 12,108,545
- Issue date Oct 1, 2024
- Samsung Display Co., Ltd.
- Jeongjin Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for printing a conductive pillar with high precision
- Patent number 12,089,343
- Issue date Sep 10, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective soldering with photonic soldering technology
- Patent number 12,041,728
- Issue date Jul 16, 2024
- Apple Inc.
- Maryam Rahimi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for soldering an electronic component to a circuit board by...
- Patent number 12,028,987
- Issue date Jul 2, 2024
- PAC Tech-Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Battery system with flexible printed circuit
- Patent number 12,015,175
- Issue date Jun 18, 2024
- Samsung SDI Co., Ltd.
- Michael Erhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming hermetically-sealed packages including feedthro...
- Patent number 11,950,387
- Issue date Apr 2, 2024
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Die-beam alignment for laser-assisted bonding
- Patent number 11,929,334
- Issue date Mar 12, 2024
- STATS ChipPAC Pte. Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 11,930,589
- Issue date Mar 12, 2024
- Ibiden Co., Ltd.
- Yoshihiko Hayashi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit board and component fabrication apparatus
- Patent number 11,919,227
- Issue date Mar 5, 2024
- DST INNOVATIONS, LTD.
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics module with raceway and submodules
- Patent number 11,924,983
- Issue date Mar 5, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stretchable electronics and methods of making the same
- Patent number 11,923,103
- Issue date Mar 5, 2024
- Carnegie Mellon University
- Carmel Majidi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multilayer substrate and a manufacturing method of the multilayer s...
- Patent number 11,923,123
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Kazutaka Muraoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer composition for laser direct structuring
- Patent number 11,912,817
- Issue date Feb 27, 2024
- Ticona LLC
- Young Shin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module
- Patent number 11,903,120
- Issue date Feb 13, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine feature formation techniques for printed circuit boards
- Patent number 11,903,138
- Issue date Feb 13, 2024
- Intel Corporation
- Eric Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module and method for manufacturing electronic...
- Patent number 11,871,523
- Issue date Jan 9, 2024
- Murata Manufacturing Co., Ltd.
- Ryohei Okabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer substrate
- Patent number 11,856,712
- Issue date Dec 26, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rogowski coil integrated in glass substrate
- Patent number 11,856,711
- Issue date Dec 26, 2023
- Infineon Technologies Austria AG
- Alexander Breymesser
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of fabricating a beaded path on the surface of a substrate,...
- Patent number 11,856,709
- Issue date Dec 26, 2023
- AGNIESZKA MAGDZIARZ CADENAS
- Zbigniew Rozynek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resolution laser induced forward transfer
- Patent number 11,840,097
- Issue date Dec 12, 2023
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process for the manufacturing of printed conductive tracks on an ob...
- Patent number 11,825,610
- Issue date Nov 21, 2023
- Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO
- Gari Arutinov
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Method for Soldering an Electronic Component to a Circuit Board by...
- Publication number 20240373563
- Publication date Nov 7, 2024
- Pac Tech - Packaging Technologies GmbH
- Matthias Fettke
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...
- Publication number 20240365523
- Publication date Oct 31, 2024
- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
- Sei UEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...
- Publication number 20240349425
- Publication date Oct 17, 2024
- TDK Corporation
- Yoshihisa TAMAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
WIRING BOARD
- Publication number 20240332772
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...
- Publication number 20240334608
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Kuei HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATES HAVING RINGLESS VIAS
- Publication number 20240314940
- Publication date Sep 19, 2024
- Skyworks Solutions, Inc.
- Ki Wook LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Three-Dimensional (3D) Copper in Printed Circuit Boards
- Publication number 20240306297
- Publication date Sep 12, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE
- Publication number 20240304462
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...
- Publication number 20240301176
- Publication date Sep 12, 2024
- Asahi Kasei Kabushiki Kaisha
- Kenzo ONIZUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240284601
- Publication date Aug 22, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and manufacturing method thereof
- Publication number 20240274543
- Publication date Aug 15, 2024
- InnoLux Corporation
- Yan-Tang DAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A BATTERY SENSOR
- Publication number 20240274895
- Publication date Aug 15, 2024
- Xin HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES
- Publication number 20240244782
- Publication date Jul 18, 2024
- Medtronic, Inc.
- David A. Ruben
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Opening Method and Opening Device
- Publication number 20240237225
- Publication date Jul 11, 2024
- SHENZHEN HAN'S CNC TECHNOLOGY CO., LTD.
- Guodong Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Photosensitive Adhesion Promoter and Method...
- Publication number 20240237230
- Publication date Jul 11, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...
- Publication number 20240237208
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- REMI PERRIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240237231
- Publication date Jul 11, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal Wearable Battery
- Publication number 20240224424
- Publication date Jul 4, 2024
- Inventus Power, Inc.
- Paul John Kudrna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...
- Publication number 20240213429
- Publication date Jun 27, 2024
- Nichia Corporation.
- Akiko NAGAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LASER-INDUCED GRAPHENE BASED E-TEXTILE AND...
- Publication number 20240196527
- Publication date Jun 13, 2024
- Korea Advanced Institute of Science and Technology
- Young-Jin KIM
- D03 - WEAVING
Information Patent Application
PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK
- Publication number 20240196544
- Publication date Jun 13, 2024
- Trillion Harvest Limited
- Pei-Chung PANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS
- Publication number 20240188225
- Publication date Jun 6, 2024
- Intel Corporation
- Vinith BEJUGAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240179850
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Chunghyo JUNG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Die-Beam Alignment for Laser-Assisted Bonding
- Publication number 20240170422
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- Wagno Alves Braganca
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20240138076
- Publication date Apr 25, 2024
- IBIDEN CO., LTD.
- Ikuya TERAUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD
- Publication number 20240121897
- Publication date Apr 11, 2024
- NXP B.V.
- Abdellatif Zanati
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT
- Publication number 20240106083
- Publication date Mar 28, 2024
- Samsung SDI Co., Ltd.
- Michael ERHART
- H01 - BASIC ELECTRIC ELEMENTS

Using electric, magnetic and electromagnetic fields Using laser light

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing printed wiring board and resin sheet with...

Conformal wearable battery and system

Display device and method of manufacturing the same

Methods for printing a conductive pillar with high precision

Component carrier with well-defined outline sidewall cut by short l...

Selective soldering with photonic soldering technology

Semiconductor package with stress reduction design and method for f...

Method for soldering an electronic component to a circuit board by...

Assembly structure for vehicle camera module using solder-jet

Resilient micro lattice electrical interconnection assembly

Battery system with flexible printed circuit

Printed circuit board structure including a closed cavity

Multilayer resin substrate, and method of manufacturing multilayer...

Three-dimensional (3D) copper in printed circuit boards

Methods for forming hermetically-sealed packages including feedthro...

Die-beam alignment for laser-assisted bonding

Printed wiring board and method for manufacturing the same

Circuit board and component fabrication apparatus

Electronics module with raceway and submodules

Stretchable electronics and methods of making the same

Multilayer substrate and a manufacturing method of the multilayer s...

Polymer composition for laser direct structuring

Radio frequency module

Fine feature formation techniques for printed circuit boards

Electronic component module and method for manufacturing electronic...

Method of manufacturing multilayer substrate

Rogowski coil integrated in glass substrate

Process of fabricating a beaded path on the surface of a substrate,...

High resolution laser induced forward transfer

Process for the manufacturing of printed conductive tracks on an ob...

Patents Applicationslast 30 patents

Method for Soldering an Electronic Component to a Circuit Board by...

METHOD OF MOUNTING ELECTRONIC DEVICES AND PARTIALLY SHIELDED BOARD...

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

ELECTRICALLY CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND...

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...

WIRING BOARD

METHOD FOR FORMING A SEMICONDUCTOR PACKAGE WITH STRESS REDUCTION DE...

PACKAGING SUBSTRATES HAVING RINGLESS VIAS

Three-Dimensional (3D) Copper in Printed Circuit Boards

METHOD FOR MANUFACTURING WIRING BOARD AND LAYERED PLATE

EPOXY RESIN COMPOSITION, ADHESIVE FILM, PRINTED WIRING BOARD, SEMIC...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

Electronic device and manufacturing method thereof

METHOD OF MAKING A BATTERY SENSOR

HERMETICALLY-SEALED PACKAGES INCLUDING FEEDTHROUGH ASSEMBLIES

Opening Method and Opening Device

Component Carrier With Photosensitive Adhesion Promoter and Method...

THERMALLY IMPROVED PCB FOR SEMICONDUCTOR POWER DIE CONNECTED BY VIA...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

Conformal Wearable Battery

CERAMIC SINTERED COMPACT SUBSTRATE, LIGHT-EMITTING DEVICE, AND METH...

METHOD FOR MANUFACTURING LASER-INDUCED GRAPHENE BASED E-TEXTILE AND...

PROCESS METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK

GLASS COATING TO MINIMIZE ROUGHNESS INSIDE THROUGH GLASS VIAS

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR

Die-Beam Alignment for Laser-Assisted Bonding

METHOD FOR MANUFACTURING WIRING SUBSTRATE

VERTICAL LAUNCHER FOR A PRINTED CIRCUIT BOARD

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT