using electromagnetic radiation

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H01L21/268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/268using electromagnetic radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element
- Patent number 12,218,271
- Issue date Feb 4, 2025
- Nichia Corporation
- Shun Kitahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,148
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulse train annealing method and apparatus
- Patent number 12,186,832
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Stephen Moffatt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,191,149
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and operating method thereof
- Patent number 12,185,450
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 12,170,225
- Issue date Dec 17, 2024
- Disco Corporation
- Yuji Hadano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser irradiation apparatus
- Patent number 12,148,644
- Issue date Nov 19, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Yuki Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and method of manufacturing semiconducto...
- Patent number 12,138,710
- Issue date Nov 12, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Yuki Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser annealing apparatus, laser annealing method, and method for m...
- Patent number 12,136,548
- Issue date Nov 5, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Kenichi Ohmori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanowire structures having non-discrete source and drain regions
- Patent number 12,125,916
- Issue date Oct 22, 2024
- Google LLC
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Heat treatment method and heat treatment apparatus
- Patent number 12,125,723
- Issue date Oct 22, 2024
- SCREEN Holdings Co., Ltd.
- Oma Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming epitaxial source/drain features in semiconductor...
- Patent number 12,119,378
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jia-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing system and method for dicing semiconductor structure i...
- Patent number 12,106,985
- Issue date Oct 1, 2024
- Yangtze Memory Technologies Co., Ltd.
- Liquan Cai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for producing at least one modification in a s...
- Patent number 12,107,017
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ralf Rieske
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Annealing device and annealing method
- Patent number 12,106,983
- Issue date Oct 1, 2024
- Sumitomo Heavy Industries, Ltd.
- Teppei Tanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming a crack in an edge region of a donor substrate
- Patent number 12,097,641
- Issue date Sep 24, 2024
- Siltectra GmbH
- Marko David Swoboda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving transistor performance
- Patent number 12,087,859
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Steven Kummerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective wafer grooving structure for wafer thinning and methods...
- Patent number 12,087,756
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT
- Publication number 20250062159
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...
- Publication number 20250054763
- Publication date Feb 13, 2025
- Sumitomo Heavy Industries, Ltd.
- Masaki MASAOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250038016
- Publication date Jan 30, 2025
- AP SYSTEMS INC.
- Dae Ryong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...
- Publication number 20250006512
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuya NABETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...
- Publication number 20250006498
- Publication date Jan 2, 2025
- JSW Aktina System Co., Ltd.
- Ryosuke SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...
- Publication number 20240412974
- Publication date Dec 12, 2024
- RNR LAB INC.
- Jeong Do RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER TREATMENT
- Publication number 20240412972
- Publication date Dec 12, 2024
- Hua Hsu Silicon Materials Co., Ltd.
- Chiao-Yang Cheng
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405067
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405068
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395936
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION
- Publication number 20240387186
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Semiconductor Structure
- Publication number 20240379354
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...
- Publication number 20240371938
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jia-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING TO CONTROL SPLASH
- Publication number 20240363413
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED L...
- Publication number 20240363412
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Karthik Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...
- Publication number 20240347355
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...
- Publication number 20240332144
- Publication date Oct 3, 2024
- NEXPERIA B.V.
- Hiu Hay Nichole Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition Equipment with Adjustable Temperature Source
- Publication number 20240332018
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Yung Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE
- Publication number 20240332021
- Publication date Oct 3, 2024
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST-LASER DICING WAFER-LEVEL TESTING
- Publication number 20240332078
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael T. WYANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...
- Publication number 20240312804
- Publication date Sep 19, 2024
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...
- Publication number 20240312925
- Publication date Sep 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Ping Mo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20240304617
- Publication date Sep 12, 2024
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

using electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die cleaning systems and related methods

Method for producing 3D semiconductor devices and structures with t...

Method of processing a workpiece and system for processing a workpiece

Light emitting element

3D semiconductor devices and structures with metal layers

Laser dicing for singulation

Laser processing device, laser processing system and laser processi...

Processing method of workpiece

Semiconductor device and manufacturing method thereof

Pulse train annealing method and apparatus

Substrate processing method and substrate processing system

Semiconductor manufacturing apparatus and operating method thereof

Integrated aligned stealth laser for wafer edge trimming process

Method of processing wafer

Method for separating dies from a semiconductor substrate

Laser processing method

Semiconductor package and manufacturing method thereof

Laser irradiation apparatus

Laser processing apparatus and method of manufacturing semiconducto...

Laser annealing apparatus, laser annealing method, and method for m...

Nanowire structures having non-discrete source and drain regions

Heat treatment method and heat treatment apparatus

Methods of forming epitaxial source/drain features in semiconductor...

Package structure

Laser dicing system and method for dicing semiconductor structure i...

Method and apparatus for producing at least one modification in a s...

Annealing device and annealing method

Method for forming a crack in an edge region of a donor substrate

Method for improving transistor performance

Protective wafer grooving structure for wafer thinning and methods...

Patents Applicationslast 30 patents

Method and Stiffeners for Package Level Warpage Modulation

FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT

LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...

LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...

METHOD FOR WAFER TREATMENT

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION

System and Method for Semiconductor Structure

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY

METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...

PACKAGE STRUCTURE

LASER DICING TO CONTROL SPLASH

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED L...

METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL A...

Deposition Equipment with Adjustable Temperature Source

METHOD FOR STRIPPING GALLIUM NITRIDE SUBSTRATE

POST-LASER DICING WAFER-LEVEL TESTING

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SU...

SEMICONDUCTOR DEVICE, FABRICATING METHOD, MEMORY DEVICE AND DEVICE...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS