using electromagnetic radiation

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H01L21/268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/268using electromagnetic radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Laser-based processing for semiconductor wafers
- Patent number 12,315,729
- Issue date May 27, 2025
- Wolfspeed, Inc.
- Devon Michael Diehl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 12,315,716
- Issue date May 27, 2025
- Disco Corporation
- Shunichiro Hirosawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,308,371
- Issue date May 20, 2025
- NATIONAL TAIWAN UNIVERSITY
- Fang-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing apparatus and processing method
- Patent number 12,300,495
- Issue date May 13, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carbide components and methods for producing silicon carbid...
- Patent number 12,302,619
- Issue date May 13, 2025
- Infineon Technologies AG
- Roland Rupp
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser processing method
- Patent number 12,290,881
- Issue date May 6, 2025
- Disco Corporation
- Hiroshi Morikazu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Diamond wafer dividing method and chip manufacturing method
- Patent number 12,293,915
- Issue date May 6, 2025
- Disco Corporation
- Yoshiaki Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material processing method and material processing system for perfo...
- Patent number 12,280,445
- Issue date Apr 22, 2025
- Carl Zeiss Microscopy GmbH
- Stephan Hiller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 12,283,614
- Issue date Apr 22, 2025
- Kabushiki Kaisha Toshiba
- Shinji Onduka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating device and heating method
- Patent number 12,278,122
- Issue date Apr 15, 2025
- Tokyo Electron Limited
- Takashi Sugimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 12,275,091
- Issue date Apr 15, 2025
- Hamamatsu Photonics K.K.
- Katsuhiro Korematsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective laser annealing method
- Patent number 12,278,275
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Albert Birner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect reduction of semiconductor layers and semiconductor devices...
- Patent number 12,272,566
- Issue date Apr 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Ali Salih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser edge shaping for semiconductor wafers
- Patent number 12,269,123
- Issue date Apr 8, 2025
- Wolfspeed, Inc.
- Joseph Taylor Budd
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control device for laser annealing apparatus and laser annealing me...
- Patent number 12,263,537
- Issue date Apr 1, 2025
- Sumitomo Heavy Industries, Ltd.
- Yasuhiro Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spot heating by moving a beam with horizontal rotary motion
- Patent number 12,261,062
- Issue date Mar 25, 2025
- Applied Materials, Inc.
- Shu-Kwan Danny Lau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 12,261,048
- Issue date Mar 25, 2025
- Denso Corporation
- Takashi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,255,069
- Issue date Mar 18, 2025
- Kokusai Electric Corporation
- Yukitomo Hirochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate manufacturing method, silicon carbide sub...
- Patent number 12,255,073
- Issue date Mar 18, 2025
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support device for supporting a substrate, method of processing a s...
- Patent number 12,255,088
- Issue date Mar 18, 2025
- Applied Materials Italia S.R.L.
- Daniele Andreola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,249,510
- Issue date Mar 11, 2025
- Fuji Electric Co., Ltd.
- Kazuki Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact formation in a SiC-based electronic device
- Patent number 12,249,624
- Issue date Mar 11, 2025
- STMicroelectronics S.r.l.
- Simone Rascuná
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device for forming a modified region in an object...
- Patent number 12,246,397
- Issue date Mar 11, 2025
- Hamamatsu Photonics K.K.
- Takafumi Ogiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for stripping gallium nitride substrate
- Patent number 12,243,746
- Issue date Mar 4, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Module and method of manufacturing the same
- Patent number 12,237,271
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element
- Patent number 12,218,271
- Issue date Feb 4, 2025
- Nichia Corporation
- Shun Kitahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OHMIC CONTACT FORMATION IN A SIC-BASED ELECTRONIC DEVICE
- Publication number 20250176235
- Publication date May 29, 2025
- STMicroelectronics International N.V.
- Simone RASCUNÁ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD
- Publication number 20250157823
- Publication date May 15, 2025
- Canon Kabushiki Kaisha
- TETSURO YASUKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING FOR SINGULATION
- Publication number 20250157858
- Publication date May 15, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20250149386
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING WAFER
- Publication number 20250140613
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR WAFER DICING
- Publication number 20250140612
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Ming-Hui CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD OF WAFER
- Publication number 20250140561
- Publication date May 1, 2025
- Disco Corporation
- Tsubasa HIROSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...
- Publication number 20250133749
- Publication date Apr 24, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION
- Publication number 20250132205
- Publication date Apr 24, 2025
- Western Digital Technologies, Inc.
- Fan Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132160
- Publication date Apr 24, 2025
- Fuji Electric Co., Ltd.
- Yasunori AGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SEMICONDUCTOR S...
- Publication number 20250118554
- Publication date Apr 10, 2025
- KYOCERA CORPORATION
- Yuta AOKI
- C30 - CRYSTAL GROWTH
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20250118561
- Publication date Apr 10, 2025
- Disco Corporation
- Younsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING WORKPIECE
- Publication number 20250112048
- Publication date Apr 3, 2025
- Disco Corporation
- Atsushi MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD AND LASER PROCESSING DEVICE
- Publication number 20250105011
- Publication date Mar 27, 2025
- Hamamatsu Photonics K.K.
- Takeshi SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND VERTICAL POWER SE...
- Publication number 20250105022
- Publication date Mar 27, 2025
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- C30 - CRYSTAL GROWTH
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250095995
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250095993
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Seiya SAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES
- Publication number 20250096072
- Publication date Mar 20, 2025
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Bharath RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20250087489
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD
- Publication number 20250087490
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT
- Publication number 20250062159
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...
- Publication number 20250054763
- Publication date Feb 13, 2025
- Sumitomo Heavy Industries, Ltd.
- Masaki MASAOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250038016
- Publication date Jan 30, 2025
- AP SYSTEMS INC.
- Dae Ryong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...
- Publication number 20250006512
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuya NABETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...
- Publication number 20250006498
- Publication date Jan 2, 2025
- JSW Aktina System Co., Ltd.
- Ryosuke SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...
- Publication number 20240412974
- Publication date Dec 12, 2024
- RNR LAB INC.
- Jeong Do RYU
- H01 - BASIC ELECTRIC ELEMENTS

using electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Laser-based processing for semiconductor wafers

Wafer processing method

Semiconductor device and manufacturing method thereof

Processing apparatus and processing method

Silicon carbide components and methods for producing silicon carbid...

Laser processing method

Diamond wafer dividing method and chip manufacturing method

Material processing method and material processing system for perfo...

Semiconductor device

Heating device and heating method

Laser processing apparatus and laser processing method

Selective laser annealing method

Defect reduction of semiconductor layers and semiconductor devices...

Laser edge shaping for semiconductor wafers

Control device for laser annealing apparatus and laser annealing me...

Spot heating by moving a beam with horizontal rotary motion

Method for manufacturing semiconductor device

Substrate processing apparatus, method of manufacturing semiconduct...

Silicon carbide substrate manufacturing method, silicon carbide sub...

Support device for supporting a substrate, method of processing a s...

Semiconductor device and method of manufacturing semiconductor device

Ohmic contact formation in a SiC-based electronic device

Laser processing device for forming a modified region in an object...

Method for stripping gallium nitride substrate

Module and method of manufacturing the same

Die cleaning systems and related methods

Method for producing 3D semiconductor devices and structures with t...

Method of processing a workpiece and system for processing a workpiece

Light emitting element

3D semiconductor devices and structures with metal layers

Patents Applicationslast 30 patents

OHMIC CONTACT FORMATION IN A SIC-BASED ELECTRONIC DEVICE

DICING METHOD AND RECORDING ELEMENT MANUFACTURING METHOD

LASER DICING FOR SINGULATION

DIE CLEANING SYSTEMS AND RELATED METHODS

METHOD OF PROCESSING WAFER

METHOD FOR WAFER DICING

PROCESSING METHOD OF WAFER

METHOD FOR PRODUCING 3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH T...

SEMICONDUCTOR WAFER THINNED BY CRACK PROPAGATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD AND MANUFACTURING APPARATUS OF SEMICONDUCTOR S...

WORKPIECE PROCESSING METHOD

METHOD FOR PROCESSING WORKPIECE

LASER PROCESSING METHOD AND LASER PROCESSING DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND VERTICAL POWER SE...

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES

CHIP MANUFACTURING METHOD

DEVICE CHIP MANUFACTURING METHOD

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

Method and Stiffeners for Package Level Warpage Modulation

FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT

LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...

LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...