using electromagnetic radiation

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H01L21/268

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/268using electromagnetic radiation

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus, method of manufacturing semiconduct...
- Patent number 12,255,069
- Issue date Mar 18, 2025
- Kokusai Electric Corporation
- Yukitomo Hirochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide substrate manufacturing method, silicon carbide sub...
- Patent number 12,255,073
- Issue date Mar 18, 2025
- Kwansei Gakuin Educational Foundation
- Tadaaki Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Support device for supporting a substrate, method of processing a s...
- Patent number 12,255,088
- Issue date Mar 18, 2025
- Applied Materials Italia S.R.L.
- Daniele Andreola
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,249,510
- Issue date Mar 11, 2025
- Fuji Electric Co., Ltd.
- Kazuki Kamimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ohmic contact formation in a SiC-based electronic device
- Patent number 12,249,624
- Issue date Mar 11, 2025
- STMicroelectronics S.r.l.
- Simone Rascuná
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device for forming a modified region in an object...
- Patent number 12,246,397
- Issue date Mar 11, 2025
- Hamamatsu Photonics K.K.
- Takafumi Ogiwara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for stripping gallium nitride substrate
- Patent number 12,243,746
- Issue date Mar 4, 2025
- SUZHOU METABRAIN INTELLIGENT TECHNOLOGY CO., LTD.
- Fen Guo
- C30 - CRYSTAL GROWTH
Information Patent Grant
Module and method of manufacturing the same
- Patent number 12,237,271
- Issue date Feb 25, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die cleaning systems and related methods
- Patent number 12,230,543
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing 3D semiconductor devices and structures with t...
- Patent number 12,225,737
- Issue date Feb 11, 2025
- Monolithic 3D Inc.
- Deepak C. Sekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing a workpiece and system for processing a workpiece
- Patent number 12,224,207
- Issue date Feb 11, 2025
- Disco Corporation
- Hitoshi Hoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting element
- Patent number 12,218,271
- Issue date Feb 4, 2025
- Nichia Corporation
- Shun Kitahama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D semiconductor devices and structures with metal layers
- Patent number 12,199,093
- Issue date Jan 14, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser dicing for singulation
- Patent number 12,198,982
- Issue date Jan 14, 2025
- Texas Instruments Incorporated
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing device, laser processing system and laser processi...
- Patent number 12,191,168
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hirotoshi Mori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,191,148
- Issue date Jan 7, 2025
- Fuji Electric Co., Ltd.
- Yasunori Agata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method of workpiece
- Patent number 12,191,138
- Issue date Jan 7, 2025
- Disco Corporation
- Toshio Tsuchiya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pulse train annealing method and apparatus
- Patent number 12,186,832
- Issue date Jan 7, 2025
- Applied Materials, Inc.
- Stephen Moffatt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,191,149
- Issue date Jan 7, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus and operating method thereof
- Patent number 12,185,450
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Dohyung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated aligned stealth laser for wafer edge trimming process
- Patent number 12,183,571
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing wafer
- Patent number 12,170,224
- Issue date Dec 17, 2024
- Disco Corporation
- Shunsuke Teranishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating dies from a semiconductor substrate
- Patent number 12,170,226
- Issue date Dec 17, 2024
- Infineon Technologies AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser processing method
- Patent number 12,170,225
- Issue date Dec 17, 2024
- Disco Corporation
- Yuji Hadano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser irradiation apparatus
- Patent number 12,148,644
- Issue date Nov 19, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Yuki Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and method of manufacturing semiconducto...
- Patent number 12,138,710
- Issue date Nov 12, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Yuki Suzuki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser annealing apparatus, laser annealing method, and method for m...
- Patent number 12,136,548
- Issue date Nov 5, 2024
- JSW AKTINA SYSTEM CO., LTD.
- Kenichi Ohmori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat treatment method and heat treatment apparatus
- Patent number 12,125,723
- Issue date Oct 22, 2024
- SCREEN Holdings Co., Ltd.
- Oma Nakajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire structures having non-discrete source and drain regions
- Patent number 12,125,916
- Issue date Oct 22, 2024
- Google LLC
- Stephen M. Cea
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
- Publication number 20250095995
- Publication date Mar 20, 2025
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
- Publication number 20250098325
- Publication date Mar 20, 2025
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20250095993
- Publication date Mar 20, 2025
- Kabushiki Kaisha Toshiba
- Seiya SAKAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES
- Publication number 20250096072
- Publication date Mar 20, 2025
- MICROSOFT TECHNOLOGY LICENSING, LLC
- Bharath RAMAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP MANUFACTURING METHOD
- Publication number 20250087489
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CHIP MANUFACTURING METHOD
- Publication number 20250087490
- Publication date Mar 13, 2025
- Disco Corporation
- Taro ARAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
- Publication number 20250079150
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Tung Wu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Stiffeners for Package Level Warpage Modulation
- Publication number 20250062168
- Publication date Feb 20, 2025
- Intel Corporation
- Justin WHETTEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT
- Publication number 20250062159
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...
- Publication number 20250054763
- Publication date Feb 13, 2025
- Sumitomo Heavy Industries, Ltd.
- Masaki MASAOKA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20250038016
- Publication date Jan 30, 2025
- AP SYSTEMS INC.
- Dae Ryong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...
- Publication number 20250006512
- Publication date Jan 2, 2025
- Kokusai Electric Corporation
- Kazuya NABETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...
- Publication number 20250006498
- Publication date Jan 2, 2025
- JSW Aktina System Co., Ltd.
- Ryosuke SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...
- Publication number 20240413023
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Ralf RIESKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...
- Publication number 20240412974
- Publication date Dec 12, 2024
- RNR LAB INC.
- Jeong Do RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR WAFER TREATMENT
- Publication number 20240412972
- Publication date Dec 12, 2024
- Hua Hsu Silicon Materials Co., Ltd.
- Chiao-Yang Cheng
- C30 - CRYSTAL GROWTH
Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405067
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming MEMS Super-Junction Meta...
- Publication number 20240405068
- Publication date Dec 5, 2024
- IceMos Technology Limited
- Samuel J. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395936
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fang-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION
- Publication number 20240387186
- Publication date Nov 21, 2024
- TOKYO ELECTRON LIMITED
- Sergey Voronin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Semiconductor Structure
- Publication number 20240379354
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY
- Publication number 20240379578
- Publication date Nov 14, 2024
- Yangtze Memory Technologies Co., Ltd.
- Dongyu Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...
- Publication number 20240371938
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Jia-Heng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DICING TO CONTROL SPLASH
- Publication number 20240363413
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bo LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...
- Publication number 20240363613
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuo-Ming WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED L...
- Publication number 20240363412
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Karthik Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...
- Publication number 20240347355
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Hao YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE
- Publication number 20240339361
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Franz-Josef Pichler
- H01 - BASIC ELECTRIC ELEMENTS

using electromagnetic radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus, method of manufacturing semiconduct...

Silicon carbide substrate manufacturing method, silicon carbide sub...

Support device for supporting a substrate, method of processing a s...

Semiconductor device and method of manufacturing semiconductor device

Ohmic contact formation in a SiC-based electronic device

Laser processing device for forming a modified region in an object...

Method for stripping gallium nitride substrate

Module and method of manufacturing the same

Die cleaning systems and related methods

Method for producing 3D semiconductor devices and structures with t...

Method of processing a workpiece and system for processing a workpiece

Light emitting element

3D semiconductor devices and structures with metal layers

Laser dicing for singulation

Laser processing device, laser processing system and laser processi...

Semiconductor device and manufacturing method thereof

Processing method of workpiece

Pulse train annealing method and apparatus

Substrate processing method and substrate processing system

Semiconductor manufacturing apparatus and operating method thereof

Integrated aligned stealth laser for wafer edge trimming process

Method of processing wafer

Method for separating dies from a semiconductor substrate

Laser processing method

Semiconductor package and manufacturing method thereof

Laser irradiation apparatus

Laser processing apparatus and method of manufacturing semiconducto...

Laser annealing apparatus, laser annealing method, and method for m...

Heat treatment method and heat treatment apparatus

Nanowire structures having non-discrete source and drain regions

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM

3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

THERMAL MANAGEMENT SYSTEM FOR MULTIPLE DIES

CHIP MANUFACTURING METHOD

DEVICE CHIP MANUFACTURING METHOD

INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS

Method and Stiffeners for Package Level Warpage Modulation

FORMING NOTCHES ON WAFER SIDEWALL FOR WAFER CUT

LASER ANNEALING DEVICE, LASER ANNEALING METHOD, AND NON-TRANSITORY...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD...

LASER IRRADIATION APPARATUS, LASER IRRADIATION METHOD, AND METHOD F...

METHOD AND APPARATUS FOR PRODUCING AT LEAST ONE MODIFICATION IN A S...

METHOD OF FORMING EPITAXIAL SEMICONDUCTOR LAYER AND METHOD OF MANUF...

METHOD FOR WAFER TREATMENT

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

Semiconductor Device and Method of Forming MEMS Super-Junction Meta...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

METHOD FOR SELECTIVE ETCHING BY LOCAL PHOTON SURFACE ACTIVATION

System and Method for Semiconductor Structure

SEMICONDUCTOR STRUCTURE, DICING METHOD THEREOF, AND MEMORY

METHODS OF FORMING EPITAXIAL SOURCE/DRAIN FEATURES IN SEMICONDUCTOR...

PACKAGE STRUCTURE

LASER DICING TO CONTROL SPLASH

PROTECTIVE WAFER GROOVING STRUCTURE FOR WAFER THINNING AND METHODS...

HYBRID WAFER DICING APPROACH USING A RECTANGULAR LASER SPOT-BASED L...

METHOD FOR USING A SYSTEM FOR ANNEALING A WAFER AND SYSTEM FOR ANNE...

METHOD FOR SEPARATING DIES FROM A SEMICONDUCTOR SUBSTRATE