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PECVD COATING SYSTEM AND COATING METHOD
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JIANGSU FAVORED NANOTECHNOLOGY CO., LTD.
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FILM DEPOSITION APPARATUS
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TOKYO ELECTRON LIMITED
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REACTION CHAMBER
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Publication date Jan 26, 2023
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Beijing NAURA Microelectronics Equipment Co., Ltd.
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Gang XU
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APPARATUS FOR PROCESSING SUBSTRATE
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Publication number 20210025060
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Publication date Jan 28, 2021
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TOKYO ELECTRON LIMITED
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METHOD AND APPARATUS FOR GAS ABATEMENT
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Applied Materials, Inc.
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Rongping WANG
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PLASMA PROCESSING APPARATUS
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Publication date Jun 20, 2019
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Hitachi High-Technologies Corporation
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Taku IWASE
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PLASMA REACTOR WITH ELECTRODE FILAMENTS
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Applied Materials, Inc.
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Kenneth S. Collins
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TANDEM SOURCE ACTIVATION FOR CVD OF FILMS
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LAM RESEARCH CORPORATION
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Adrien LaVoie
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...