Using gravitational force Processing against the gravity direction Using centrifugal force

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CPC
H05K2203/159

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

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H05K2203/159Using gravitational force Processing against the gravity direction Using centrifugal force

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Circuit board connector assembly
- Patent number 11,929,566
- Issue date Mar 12, 2024
- ROSENBERGER HOCHFREQUENZTECHNIK GMBH & CO. KG
- Martin Zebhauser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact-distance transformer, electrical testing device, and method...
- Patent number 10,379,140
- Issue date Aug 13, 2019
- Feinmetall GmbH
- Cetin Ekin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamping device for soldering operations
- Patent number 10,335,903
- Issue date Jul 2, 2019
- HONGFUJIN PRECISION ELECTRONICS (ZHENGZHOU) CO., LTD.
- Xi-Hang Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array system
- Patent number 9,867,295
- Issue date Jan 9, 2018
- Dell Products L.P.
- Bhavesh Patel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering device, soldering method, and substrate and electronic co...
- Patent number 9,686,871
- Issue date Jun 20, 2017
- TANIGUROGUMI CORPORATION
- Katsumori Taniguro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board for mounting electronic components
- Patent number 9,414,488
- Issue date Aug 9, 2016
- Canon Kabushiki Kaisha
- Yuichi Hagiwara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board, circuit component and electronic apparatus
- Patent number 7,848,113
- Issue date Dec 7, 2010
- Kabushiki Kaisha Toshiba
- Toshiki Oooka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cap for an electrical connector
- Patent number 7,255,601
- Issue date Aug 14, 2007
- FCI Americas Technology, Inc.
- Donald K. Harper, Jr.
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,168,154
- Issue date Jan 30, 2007
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,188
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 7,137,189
- Issue date Nov 21, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,989,969
- Issue date Jan 24, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,985,335
- Issue date Jan 10, 2006
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Orienting and stacking parts
- Patent number 6,968,763
- Issue date Nov 29, 2005
- International Business Machines Corporation
- Fletcher L. Chapin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated lead suspension and method of construction
- Patent number 6,879,465
- Issue date Apr 12, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of constructing an integrated lead suspension
- Patent number 6,871,392
- Issue date Mar 29, 2005
- Hitachi Global Storage Technologies Netherlands B.V.
- Tatsumi Tsuchiya
- G11 - INFORMATION STORAGE
Information Patent Grant
Electric connection box
- Patent number 6,866,526
- Issue date Mar 15, 2005
- Yazaki Corporation
- Norio Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive composition
- Patent number 6,835,331
- Issue date Dec 28, 2004
- Shin-Etsu Chemical Co., Ltd.
- Hironao Fujiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,803,657
- Issue date Oct 12, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball attaching process
- Patent number 6,732,912
- Issue date May 11, 2004
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for gravitation-assisted control of spread of viscous materi...
- Patent number 6,602,730
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with strain relief
- Patent number 6,544,046
- Issue date Apr 8, 2003
- FCI Americas Technology, Inc.
- Marlyn E. Hahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for screen printing
- Patent number 6,539,855
- Issue date Apr 1, 2003
- Micron Technology, Inc.
- Michael B. Ball
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally assisted control of spread of viscous material appl...
- Patent number 6,492,713
- Issue date Dec 10, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,489,681
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of planarizing die solder balls by employing a die's...
- Patent number 6,465,338
- Issue date Oct 15, 2002
- LSI Logic Corporation
- Sarathy Rajagopalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coating apparatus and coating method
- Patent number 6,423,144
- Issue date Jul 23, 2002
- Matsushita Electric Industrial Co., Ltd.
- Masaru Watanabe
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for forming bump and semiconductor device
- Patent number 6,383,891
- Issue date May 7, 2002
- Niigata Seimitsu Co., Ltd.
- Akira Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric circuit apparatus
- Patent number 6,377,468
- Issue date Apr 23, 2002
- Anden Co., Ltd.
- Hideyuki Ohtani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for screen printing
- Patent number 6,289,803
- Issue date Sep 18, 2001
- Micron Technology, Inc.
- Michael B. Ball
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR
- Publication number 20250185179
- Publication date Jun 5, 2025
- BlackBerry Limited
- Jason Wayne JANTZI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD CONNECTOR ASSEMBLY
- Publication number 20220216631
- Publication date Jul 7, 2022
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Martin ZEBHAUSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS
- Publication number 20140374152
- Publication date Dec 25, 2014
- Yuichi Hagiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...
- Publication number 20140099433
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Seung NAM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CIRCUIT BOARD, ELECTRIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT...
- Publication number 20130286607
- Publication date Oct 31, 2013
- Koito Manufacturing Co., Ltd.
- Shinji Teraoka
- F21 - LIGHTING
Information Patent Application
BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...
- Publication number 20130088839
- Publication date Apr 11, 2013
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR DISMOUNTING ELECTRONIC DEVICE
- Publication number 20100223775
- Publication date Sep 9, 2010
- FUJITSU LIMITED
- Osamu HIGASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT
- Publication number 20090289101
- Publication date Nov 26, 2009
- Yong Du
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Soldering Apparatus and Soldering Method
- Publication number 20090266811
- Publication date Oct 29, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method, Soldering Apparatus and Method for Manufacturing...
- Publication number 20090218386
- Publication date Sep 3, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method, Semiconductor Module Manufacturing Method, and So...
- Publication number 20090184152
- Publication date Jul 23, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Method, Method for Manufacturing Semiconductor Module, an...
- Publication number 20090134205
- Publication date May 28, 2009
- Masahiko Kimbara
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Soldering Method and Semiconductor Module Manufacturing Method
- Publication number 20090134204
- Publication date May 28, 2009
- Masahiko Kimbara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface Mount Electrical Component
- Publication number 20090027865
- Publication date Jan 29, 2009
- Junya Tsuji
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PRINTED CIRCUIT BOARD, CIRCUIT COMPONENT AND ELECTRONIC APPARATUS
- Publication number 20080239682
- Publication date Oct 2, 2008
- Kabushiki Kaisha Toshiba
- Toshiki Oooka
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic device and electronic component mounting method
- Publication number 20080223609
- Publication date Sep 18, 2008
- Fujitsu Limited
- Keiichi Yamamoto
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CAP FOR AN ELECTRICAL CONNECTOR
- Publication number 20080070443
- Publication date Mar 20, 2008
- FCI Americas Technology, Inc.
- Donald K. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAP FOR AN ELECTRICAL CONNECTOR
- Publication number 20070224857
- Publication date Sep 27, 2007
- Donald K. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cap for an electrical connector
- Publication number 20060134944
- Publication date Jun 22, 2006
- Donald K. Harper
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050078415
- Publication date Apr 14, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050063096
- Publication date Mar 24, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047020
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Printed board and method of displaying an identification mark on th...
- Publication number 20050045370
- Publication date Mar 3, 2005
- Tatsuo Katayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047022
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20050047009
- Publication date Mar 3, 2005
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Anti-abrasive flat flexible cable
- Publication number 20040173374
- Publication date Sep 9, 2004
- Hsi-Yu Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric connection box
- Publication number 20040127077
- Publication date Jul 1, 2004
- YAZAKI CORPORATION
- Norio Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated lead suspension and method of construction
- Publication number 20030188887
- Publication date Oct 9, 2003
- Tatsumi Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SOLDER BALL ATTACHING PROCESS
- Publication number 20030164395
- Publication date Sep 4, 2003
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Orienting and stacking parts
- Publication number 20030126834
- Publication date Jul 10, 2003
- International Business Machines Corporation
- Fletcher L. Chapin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Using gravitational force Processing against the gravity direction Using centrifugal force

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board connector assembly

Contact-distance transformer, electrical testing device, and method...

Clamping device for soldering operations

Ball grid array system

Soldering device, soldering method, and substrate and electronic co...

Circuit board for mounting electronic components

Printed circuit board, circuit component and electronic apparatus

Cap for an electrical connector

Method of constructing an integrated lead suspension

Method of constructing an integrated lead suspension

Method of constructing an integrated lead suspension

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Orienting and stacking parts

Integrated lead suspension and method of construction

Method of constructing an integrated lead suspension

Electric connection box

Conductive composition

Gravitationally-assisted control of spread of viscous material appl...

Solder ball attaching process

Method for gravitation-assisted control of spread of viscous materi...

Electrical connector with strain relief

Method and apparatus for screen printing

Gravitationally assisted control of spread of viscous material appl...

Gravitationally-assisted control of spread of viscous material appl...

Method of planarizing die solder balls by employing a die&#x00027;s...

Coating apparatus and coating method

Method for forming bump and semiconductor device

Electric circuit apparatus

Method and apparatus for screen printing

Patents Applicationslast 30 patents

INTRISICALLY SAFE DESIGNED DEVICES AND METHODS THEREFOR

CIRCUIT BOARD CONNECTOR ASSEMBLY

CIRCUIT BOARD FOR MOUNTING ELECTRONIC COMPONENTS

BASKET JIG FOR ELECTROLESS PLATING APPARATUS AND ELECTROLESS PLATIN...

CIRCUIT BOARD, ELECTRIC DEVICE, AND METHOD OF MANUFACTURING CIRCUIT...

BOARD MODULE MANUFACTURING METHOD, BOARD MODULE, AND BOARD MODULE A...

METHOD FOR DISMOUNTING ELECTRONIC DEVICE

METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT

Soldering Apparatus and Soldering Method

Soldering Method, Soldering Apparatus and Method for Manufacturing...

Soldering Method, Semiconductor Module Manufacturing Method, and So...

Soldering Method, Method for Manufacturing Semiconductor Module, an...

Soldering Method and Semiconductor Module Manufacturing Method

Surface Mount Electrical Component

PRINTED CIRCUIT BOARD, CIRCUIT COMPONENT AND ELECTRONIC APPARATUS

Electronic device and electronic component mounting method

CAP FOR AN ELECTRICAL CONNECTOR

CAP FOR AN ELECTRICAL CONNECTOR

Cap for an electrical connector

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Printed board and method of displaying an identification mark on th...

Integrated lead suspension and method of construction

Integrated lead suspension and method of construction

Anti-abrasive flat flexible cable

Electric connection box

Integrated lead suspension and method of construction

SOLDER BALL ATTACHING PROCESS

Orienting and stacking parts

Method of planarizing die solder balls by employing a die's...