using internal conductor planes parallel to the surface for thermal conduction

Industry

CPC
H05K1/0207

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/0207using internal conductor planes parallel to the surface for thermal conduction

Industries

Patents Grantslast 30 patents

Information Patent Grant
Electronic module
- Patent number 11,937,409
- Issue date Mar 19, 2024
- Sumitomo Wiring Systems, Ltd.
- Kazuya Komaki
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Bi-directional power converter module
- Patent number 11,935,681
- Issue date Mar 19, 2024
- NAVITAS SEMICONDUCTOR LIMITED
- Hao Sun
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Separating temperature domains in cooled systems
- Patent number 11,917,794
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Andrew G. Kegel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for manufacturing substrate structure having thick e...
- Patent number 11,895,778
- Issue date Feb 6, 2024
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Driver board assemblies and methods of forming a driver board assembly
- Patent number 11,864,323
- Issue date Jan 2, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring substrate
- Patent number 11,864,313
- Issue date Jan 2, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kishimoto
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic device having heat-radiating structure
- Patent number 11,800,632
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Yonghwa Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor assemblies including thermal circuits and methods of...
- Patent number 11,791,315
- Issue date Oct 17, 2023
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method of manufacturing the same
- Patent number 11,778,727
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 11,765,835
- Issue date Sep 19, 2023
- LEONARDO UK LTD
- Anthony Kinghorn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure
- Patent number 11,711,887
- Issue date Jul 25, 2023
- Autonetworks Technologies, Ltd.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
LED lamp
- Patent number 11,703,191
- Issue date Jul 18, 2023
- Feit Electric Company, Inc.
- Raymond G. Janik
- F21 - LIGHTING
Information Patent Grant
High density power module
- Patent number 11,678,468
- Issue date Jun 13, 2023
- DANA TM4 INC.
- Benoit Blanchard St-Jacques
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics cooling assemblies and methods for making the same
- Patent number 11,665,813
- Issue date May 30, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric circuit system and assembling method thereof
- Patent number 11,627,655
- Issue date Apr 11, 2023
- Eltek AS
- Christine Amer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module with cooling structure
- Patent number 11,570,889
- Issue date Jan 31, 2023
- Tesla, Inc.
- Mohamed Nasr
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Printed circuit board and method for measuring the temperature in a...
- Patent number 11,545,793
- Issue date Jan 3, 2023
- Aptiv Technologies Limited
- Olivier Malandain
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Arrangement for heat exchange
- Patent number 11,533,803
- Issue date Dec 20, 2022
- Audi AG
- Thomas Ferstl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus improved in heat dissipation efficiency of hea...
- Patent number 11,523,494
- Issue date Dec 6, 2022
- Canon Kabushiki Kaisha
- Koichi Odagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling profile integration for embedded power systems
- Patent number 11,523,496
- Issue date Dec 6, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Rainer Frauwallner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded substrate, metal circuit board, and circuit board
- Patent number 11,497,125
- Issue date Nov 8, 2022
- DENKA COMPANY LIMITED
- Yuta Tsugawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PCB structure and method and apparatus for forming the PCB structure
- Patent number 11,477,878
- Issue date Oct 18, 2022
- Telefonaktiebolaget LM Ericsson (publ)
- Peng Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded component structure and manufacturing method thereof
- Patent number 11,470,715
- Issue date Oct 11, 2022
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module
- Patent number 11,417,583
- Issue date Aug 16, 2022
- TDK ELECTRONICS AG
- Thomas Feichtinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal active heat sink
- Patent number 11,388,812
- Issue date Jul 12, 2022
- Hamilton Sundstrand Corporation
- Darrell E. Ankney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating substrate structure with built-in conductive circuits
- Patent number 11,388,811
- Issue date Jul 12, 2022
- AMULAIRE THERMAL TECHNOLOGY, INC.
- Shih-Hsi Tai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power relay assembly
- Patent number 11,322,325
- Issue date May 3, 2022
- AMOGREENTECH CO., LTD.
- Min Ho Won
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic load device and heat-dissipating load module
- Patent number 11,324,109
- Issue date May 3, 2022
- CHROMA ATE INC.
- Chien-Hsing Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, electronic component unit, and method...
- Patent number 11,317,541
- Issue date Apr 26, 2022
- Murata Manufacturing Co., Ltd.
- Shinichiro Kuroiwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for enhanced cooling
- Patent number 11,291,106
- Issue date Mar 29, 2022
- Dell Products L.P.
- Isaac Q. Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER
- Publication number 20240098877
- Publication date Mar 21, 2024
- Meta Platforms Technologies, LLC
- Michael Nikkhoo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT...
- Publication number 20240090119
- Publication date Mar 14, 2024
- Dana Canada Corporation
- Matthew S. BIRKETT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230363080
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...
- Publication number 20230337353
- Publication date Oct 19, 2023
- HAMILTON SUNDSTRAND CORPORATION
- John Dickey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20230262871
- Publication date Aug 17, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ETCHING METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE HAVING THICK E...
- Publication number 20230199969
- Publication date Jun 22, 2023
- Amulaire thermal technology, INC.
- SHIH-HSI TAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFA...
- Publication number 20230112890
- Publication date Apr 13, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- HSIAO-TING HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Embedded Component on Stepped Metal Structur...
- Publication number 20230098587
- Publication date Mar 30, 2023
- AT&S (Chongqing) Company Limited
- Steve HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED VOLTAGE REGULATOR
- Publication number 20230093166
- Publication date Mar 23, 2023
- Navitas Semiconductor Limited
- Hao SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SUPPORT PLATE
- Publication number 20230082434
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Hyunjoong YOON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230066017
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE LABEL FOR CIRCUIT
- Publication number 20230065633
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Kaleb A. Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY MODULE AND POWER DEVICE
- Publication number 20230036995
- Publication date Feb 2, 2023
- Huawei Digital Power Technologies Co., Ltd.
- Xiaojing LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF EMBEDDED COMPONENT STRUCTURE
- Publication number 20220408547
- Publication date Dec 22, 2022
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
- Publication number 20220400575
- Publication date Dec 15, 2022
- Samsung Electronics Co., Ltd.
- Junwhon UHM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Control Unit
- Publication number 20220400560
- Publication date Dec 15, 2022
- Hitachi Astemo, Ltd.
- Tomohiro FUKUDA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20220361317
- Publication date Nov 10, 2022
- AUTONETWORKS TECHNOLOGIES, LTD.
- Shungo Hiratani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MONOLITHIC PSTAGES AND METHODS FOR VOLTAGE REGULATORS
- Publication number 20220308607
- Publication date Sep 29, 2022
- Dell Products L.P.
- Merle Wood
- G05 - CONTROLLING REGULATING
Information Patent Application
CIRCUIT BOARD ASSEMBLY
- Publication number 20220272846
- Publication date Aug 25, 2022
- Leonardo UK Ltd
- Anthony KINGHORN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL ACTIVE HEAT SINK
- Publication number 20220201840
- Publication date Jun 23, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Darrell E. Ankney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS INCLUDING FPCB STRUCTURE
- Publication number 20220159112
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Minsoo KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD
- Publication number 20220151068
- Publication date May 12, 2022
- LG Innotek Co., Ltd.
- Min Young HWANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT FOR HEAT EXCHANGE
- Publication number 20220141947
- Publication date May 5, 2022
- Audi AG
- Thomas FERSTL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY POWER MODULE
- Publication number 20220095493
- Publication date Mar 24, 2022
- DANA TM4 INC.
- Benoit BLANCHARD ST-JACQUES
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC MODULE
- Publication number 20220071048
- Publication date Mar 3, 2022
- Sumitomo Wiring Systems, Ltd.
- Kazuya Komaki
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...
- Publication number 20220059508
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Chan H. Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME
- Publication number 20220053630
- Publication date Feb 17, 2022
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD
- Publication number 20220039264
- Publication date Feb 3, 2022
- DENKA COMPANY LIMITED
- Yuta TSUGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220022311
- Publication date Jan 20, 2022
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CIRCUIT SYSTEM AND ASSEMBLING METHOD THEREOF
- Publication number 20220022312
- Publication date Jan 20, 2022
- ELTEK AS
- CHRISTINE AMER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using internal conductor planes parallel to the surface for thermal conduction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic module

Bi-directional power converter module

Separating temperature domains in cooled systems

Etching method for manufacturing substrate structure having thick e...

Driver board assemblies and methods of forming a driver board assembly

Multilayer wiring substrate

Electronic device having heat-radiating structure

Semiconductor assemblies including thermal circuits and methods of...

Semiconductor package assembly and method of manufacturing the same

Circuit board assembly

Substrate structure

LED lamp

High density power module

Power electronics cooling assemblies and methods for making the same

Electric circuit system and assembling method thereof

Voltage regulator module with cooling structure

Printed circuit board and method for measuring the temperature in a...

Arrangement for heat exchange

Electronic apparatus improved in heat dissipation efficiency of hea...

Cooling profile integration for embedded power systems

Bonded substrate, metal circuit board, and circuit board

PCB structure and method and apparatus for forming the PCB structure

Embedded component structure and manufacturing method thereof

LED module

Thermal active heat sink

Heat-dissipating substrate structure with built-in conductive circuits

Power relay assembly

Electronic load device and heat-dissipating load module

Electronic component module, electronic component unit, and method...

System and method for enhanced cooling

Patents Applicationslast 30 patents

STACK-PCB ARCHITECTURE WITH EMBEDDED VAPOR CHAMBER

THICK FILM PRINTED COOLER FOR IMPROVED THERMAL MANAGEMENT OF DIRECT...

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

DEVICES AND METHODS TO IMPROVE THERMAL CONDUCTION FROM SMT AND CHIP...

POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME

ETCHING METHOD FOR MANUFACTURING SUBSTRATE STRUCTURE HAVING THICK E...

CIRCUIT BOARD WITH HEAT DISSIPATION STRUCTURE AND METHOD FOR MANUFA...

Component Carrier With Embedded Component on Stepped Metal Structur...

INTEGRATED VOLTAGE REGULATOR

ELECTRONIC DEVICE INCLUDING SUPPORT PLATE

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

THERMALLY CONDUCTIVE LABEL FOR CIRCUIT

POWER SUPPLY MODULE AND POWER DEVICE

MANUFACTURING METHOD OF EMBEDDED COMPONENT STRUCTURE

ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

Electronic Control Unit

SUBSTRATE STRUCTURE

MONOLITHIC PSTAGES AND METHODS FOR VOLTAGE REGULATORS

CIRCUIT BOARD ASSEMBLY

THERMAL ACTIVE HEAT SINK

ELECTRONIC APPARATUS INCLUDING FPCB STRUCTURE

CIRCUIT BOARD

ARRANGEMENT FOR HEAT EXCHANGE

HIGH DENSITY POWER MODULE

ELECTRONIC MODULE

SEMICONDUCTOR ASSEMBLIES INCLUDING THERMAL CIRCUITS AND METHODS OF...

POWER ELECTRONICS COOLING ASSEMBLIES AND METHODS FOR MAKING THE SAME

BONDED SUBSTRATE, METAL CIRCUIT BOARD, AND CIRCUIT BOARD

EMBEDDED COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF

ELECTRIC CIRCUIT SYSTEM AND ASSEMBLING METHOD THEREOF