Using laser light

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CPC
H05K2203/107

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/107Using laser light

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronics module with raceway and submodules
- Patent number 12,342,477
- Issue date Jun 24, 2025
- Honeywell Federal Manufacturing & Technologies, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods to fill through-holes of a substrate with metal paste
- Patent number 12,342,470
- Issue date Jun 24, 2025
- Reophotonics, Ltd.
- Michael Zenou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal fusion with conductive inks and pastes
- Patent number 12,336,115
- Issue date Jun 17, 2025
- Universidade de Coimbra
- Mahmoud Tavakoli
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 12,336,095
- Issue date Jun 17, 2025
- Ibiden Co., Ltd.
- Toshiki Furutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for selective metallisation of inorganic dielectrics or semi...
- Patent number 12,336,114
- Issue date Jun 17, 2025
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis Ratautas
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for preparing internal laser induced carbonization layer of...
- Patent number 12,305,012
- Issue date May 20, 2025
- Jiangsu University
- Yunxia Ye
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Subtractive method for manufacturing circuit board with fine interc...
- Patent number 12,309,938
- Issue date May 20, 2025
- Hsu-Tung Chen
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Material deposition method and material deposition apparatus
- Patent number 12,296,360
- Issue date May 13, 2025
- Intel Corporation
- Fanyi Zhu
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Module including a grooved shield film
- Patent number 12,295,130
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Tetsuya Oda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid connection and fluid heating device
- Patent number 12,292,147
- Issue date May 6, 2025
- Hutchinson
- Ksenia Astafyeva
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Catheter-deployable soft robotic sensor arrays and processing of fl...
- Patent number 12,285,260
- Issue date Apr 29, 2025
- Cornell University
- Simon Dunham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing printed circuit boards
- Patent number 12,289,837
- Issue date Apr 29, 2025
- Gebr. Schmid GmbH
- Christian Buchner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for localized repair of graphene-coated lamination stacks a...
- Patent number 12,289,839
- Issue date Apr 29, 2025
- Mellanox Technologies, Ltd.
- Elad Mentovich
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,267,958
- Issue date Apr 1, 2025
- Murata Manufacturing Co., Ltd.
- Hiromitsu Ito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting substrate, electronic component mount...
- Patent number 12,256,491
- Issue date Mar 18, 2025
- Sony Group Corporation
- Koji Aoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and cutting method thereof
- Patent number 12,250,776
- Issue date Mar 11, 2025
- Unimicron Technology Corp.
- Jeng-Ting Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for printing metal lines and patterns at high resolution
- Patent number 12,209,304
- Issue date Jan 28, 2025
- Reophotonics Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wiring circuit board and method of producing the same
- Patent number 12,185,463
- Issue date Dec 31, 2024
- Nitto Denko Corporation
- Kanayo Sawashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and method for manufacturing electronic device
- Patent number 12,171,068
- Issue date Dec 17, 2024
- PANASONIC AUTOMOTIVE SYSTEMS CO., LTD.
- Koji Dobashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Technologies for power tunnels on circuit boards
- Patent number 12,156,331
- Issue date Nov 26, 2024
- Intel Corporation
- Khai Ern See
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded components having sub-flush residuals
- Patent number 12,156,345
- Issue date Nov 26, 2024
- Apple Inc.
- Depeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing printed wiring board and resin sheet with...
- Patent number 12,120,827
- Issue date Oct 15, 2024
- Ajinomoto Co., Inc.
- Kazuhiko Tsurui
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal wearable battery and system
- Patent number 12,114,426
- Issue date Oct 8, 2024
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for printing a conductive pillar with high precision
- Patent number 12,089,343
- Issue date Sep 10, 2024
- Reophotonics, Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Component carrier with well-defined outline sidewall cut by short l...
- Patent number 12,048,101
- Issue date Jul 23, 2024
- AT&S(China) Co. Ltd.
- Seok Kim Tay
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package with stress reduction design and method for f...
- Patent number 12,035,475
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Kuei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly structure for vehicle camera module using solder-jet
- Patent number 12,025,848
- Issue date Jul 2, 2024
- Hyundai Mobis Co., Ltd.
- SangHwan Oh
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Resilient micro lattice electrical interconnection assembly
- Patent number 12,028,978
- Issue date Jul 2, 2024
- Northrop Grumman Systems Corporation
- Matthew J. Pirih
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Battery system with flexible printed circuit
- Patent number 12,015,175
- Issue date Jun 18, 2024
- Samsung SDI Co., Ltd.
- Michael Erhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...
- Publication number 20250240871
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Deborah COGONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20250240898
- Publication date Jul 24, 2025
- InnoLux Corporation
- Chun-Hung CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227841
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...
- Publication number 20250227842
- Publication date Jul 10, 2025
- TOPPAN Holdings Inc.
- Masashi SAWADAISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER
- Publication number 20250194018
- Publication date Jun 12, 2025
- AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT
- Daniel SCHLICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20250168988
- Publication date May 22, 2025
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR AND METHOD OF MANUFACTURING A WORKPIECE LAYER AND A COVE...
- Publication number 20250168992
- Publication date May 22, 2025
- Manaflex, LLC
- Robert C. Lane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR REMOVING SURFACE INSULATING LAYER OF PRINTED...
- Publication number 20250151202
- Publication date May 8, 2025
- INSTITUTE OF FORENSIC SCIENCE, MINISTRY OF PUBLIC SECURITY
- Ning ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM
- Publication number 20250132076
- Publication date Apr 24, 2025
- ROHDE &SCHWARZ GMBH & CO. KG
- Stefan SOHR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250120010
- Publication date Apr 10, 2025
- Shinko Electric Industries Co., Ltd.
- Tatsuki Sumi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250081354
- Publication date Mar 6, 2025
- InnoLux Corporation
- Cheng-Chi WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20250048562
- Publication date Feb 6, 2025
- IBIDEN CO., LTD.
- Masashi KUWABARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE
- Publication number 20250031319
- Publication date Jan 23, 2025
- Panasonic Holdings Corporation
- HIROKI KITAGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method for Manufacturing the Same Using a Des...
- Publication number 20250024611
- Publication date Jan 16, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Nina WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250016921
- Publication date Jan 9, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sang Ho JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Wearable Battery and System
- Publication number 20250016924
- Publication date Jan 9, 2025
- Inventus Power, Inc.
- Elijah Brett Goldin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...
- Publication number 20240431027
- Publication date Dec 26, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHOD OF MAKING MODULAR INTERCONNECTIONS FOR ELECTRO...
- Publication number 20240431036
- Publication date Dec 26, 2024
- University of South Florida
- Mohamed Mounir ABDIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD
- Publication number 20240408701
- Publication date Dec 12, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME
- Publication number 20240408699
- Publication date Dec 12, 2024
- LG ENERGY SOLUTION, LTD.
- Jae Young JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER
- Publication number 20240414852
- Publication date Dec 12, 2024
- Seoul National University R&DB Foundation
- Seung Hwan KO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES
- Publication number 20240414855
- Publication date Dec 12, 2024
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- Ryan J. Eickbush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...
- Publication number 20240407107
- Publication date Dec 5, 2024
- Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Karolis RATAUTAS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR PRODUCING AN INTERCONNECT DEVICE FOR ELECTRONIC AND/OR...
- Publication number 20240397630
- Publication date Nov 28, 2024
- Friedrich PROES
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF
- Publication number 20240357748
- Publication date Oct 24, 2024
- Unimicron Technology Corp.
- Jeng-Ting LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...
- Publication number 20240349427
- Publication date Oct 17, 2024
- TOPPAN Holdings Inc.
- Takehisa TAKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...
- Publication number 20240341043
- Publication date Oct 10, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY

Using laser light

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronics module with raceway and submodules

Methods to fill through-holes of a substrate with metal paste

Liquid metal fusion with conductive inks and pastes

Wiring substrate and method for manufacturing wiring substrate

Method for selective metallisation of inorganic dielectrics or semi...

Method for preparing internal laser induced carbonization layer of...

Subtractive method for manufacturing circuit board with fine interc...

Material deposition method and material deposition apparatus

Module including a grooved shield film

Fluid connection and fluid heating device

Catheter-deployable soft robotic sensor arrays and processing of fl...

Method of producing printed circuit boards

Process for localized repair of graphene-coated lamination stacks a...

Electronic component and manufacturing method thereof

Electronic component mounting substrate, electronic component mount...

Substrate structure and cutting method thereof

Methods for printing metal lines and patterns at high resolution

Wiring circuit board and method of producing the same

Electronic device and method for manufacturing electronic device

Technologies for power tunnels on circuit boards

Overmolded components having sub-flush residuals

Method for manufacturing printed wiring board and resin sheet with...

Conformal wearable battery and system

Methods for printing a conductive pillar with high precision

Component carrier with well-defined outline sidewall cut by short l...

Semiconductor package with stress reduction design and method for f...

Assembly structure for vehicle camera module using solder-jet

Resilient micro lattice electrical interconnection assembly

Battery system with flexible printed circuit

Printed circuit board structure including a closed cavity

Patents Applicationslast 30 patents

DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...

MANUFACTURING METHOD OF ELECTRONIC DEVICE

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

GLASS SUBSTRATE, MULTILAYER WIRING SUBSTRATE, AND METHOD FOR PRODUC...

COMPONENT CARRIER AND METHOD FOR MANUFACTURING A COMPONENT CARRIER

SUBSTRATE STRUCTURE

SYSTEM FOR AND METHOD OF MANUFACTURING A WORKPIECE LAYER AND A COVE...

METHOD AND SYSTEM FOR REMOVING SURFACE INSULATING LAYER OF PRINTED...

PRINTED CIRCUIT BOARD

SIGNAL PROCESSING CIRCUIT AND MEASUREMENT SYSTEM

WIRING BOARD

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

WIRING SUBSTRATE

LAMINATED STRUCTURE, AND METHOD FOR MANUFACTURING LAMINATED STRUCTURE

Component Carrier and Method for Manufacturing the Same Using a Des...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Conformal Wearable Battery and System

GLASS SUBSTRATE, THROUGH-ELECTRODE, MULTILAYER WIRING SUBSTRATE, AN...

APPARATUS AND METHOD OF MAKING MODULAR INTERCONNECTIONS FOR ELECTRO...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD

LASER WELDING APPARATUS AND WELDING METHOD USING THE SAME

METHOD FOR MANUFACTURING MULTILAYER THIN-FILM FPCB AND HEATER

ELECTRONICS MODULE WITH RACEWAY AND SUBMODULES

METHOD FOR SELECTIVE METALLISATION OF INORGANIC DIELECTRICS OR SEMI...

PROCESS FOR PRODUCING AN INTERCONNECT DEVICE FOR ELECTRONIC AND/OR...

SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF

MULTILAYER WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE MULTILA...

HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING TH...