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H01L21/308

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/308using masks

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Alternating hardmasks for tight-pitch line formation
- Patent number 12,322,601
- Issue date Jun 3, 2025
- Adeia Semiconductor Solutions LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating Fin-type field-effect transistor device havin...
- Patent number 12,324,224
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,322,590
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced directed self-assembly in the presence of low Tg oligomers...
- Patent number 12,319,810
- Issue date Jun 3, 2025
- Merck Patent GmbH
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resist underlayer film-forming composition
- Patent number 12,313,972
- Issue date May 27, 2025
- NISSAN CHEMICAL CORPORATION
- Hiroto Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 12,317,524
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Ling Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 12,315,759
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Step-stacked nanowire CMOS structure for low power logic device and...
- Patent number 12,317,588
- Issue date May 27, 2025
- Samsung Electronics Co., Ltd.
- Byounghak Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 12,310,095
- Issue date May 20, 2025
- Samsung Electronics Co., Ltd.
- Jongchan Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for non-resist nanolithography
- Patent number 12,308,368
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Miin-Jang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure etching solution and method for fabricating...
- Patent number 12,308,239
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chung-Chieh Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure, and semiconductor...
- Patent number 12,300,492
- Issue date May 13, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Mengmeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of cutting a fine pattern, methods of forming active patter...
- Patent number 12,293,921
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Sanggyo Chung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming multilayer horizontal NOR-type thin-film memory...
- Patent number 12,295,143
- Issue date May 6, 2025
- SUNRISE MEMORY CORPORATION
- Scott Brad Herner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for preparing the same
- Patent number 12,293,914
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Hsiang Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure manufacturing method
- Patent number 12,293,920
- Issue date May 6, 2025
- FUJIFILM Corporation
- Tomokazu Umezawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic method for reactive development of photoresists
- Patent number 12,287,578
- Issue date Apr 29, 2025
- Tokyo Electron Limited
- Hamed Hajibabaeinajafabadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge fin trim process
- Patent number 12,283,526
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Chun Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of multiple transistors having fin and mesa structures
- Patent number 12,283,595
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Hsin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,279,458
- Issue date Apr 15, 2025
- Samsung Electronics Co., Ltd.
- Joong Gun Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pattern decomposition lithography techniques
- Patent number 12,278,204
- Issue date Apr 15, 2025
- Intel Corporation
- Charles H. Wallace
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor array having a stacked multi-layer metal oxide...
- Patent number 12,278,291
- Issue date Apr 15, 2025
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor structure
- Patent number 12,278,113
- Issue date Apr 15, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhaohui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing memory device with first and second isolati...
- Patent number 12,278,138
- Issue date Apr 15, 2025
- NANYA TECHNOLOGY CORPORATION
- Cheng-Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 12,272,555
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tin oxide and tin carbide materials for semiconductor patterning ap...
- Patent number 12,272,564
- Issue date Apr 8, 2025
- Applied Materials, Inc.
- Yung-chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oblique deposition and etch processes
- Patent number 12,272,559
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Akiteru Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming epitaxial source/drain features and semiconducto...
- Patent number 12,272,732
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 12,272,554
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-Lin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective and isotropic etch of silicon over silicon-germanium allo...
- Patent number 12,272,558
- Issue date Apr 8, 2025
- Tokyo Electron Limited
- Matthew Flaugh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER END PROTECTIVE-FILM FORMING COMPOSITION FOR SEMICONDUCTOR MAN...
- Publication number 20250172869
- Publication date May 29, 2025
- NISSAN CHEMICAL CORPORATION
- Shunsuke MORIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE INCLUDING A PLURALITY OF SPACERS AND METHOD OF M...
- Publication number 20250174459
- Publication date May 29, 2025
- NANYA TECHNOLOGY CORPORATION
- PIN-YUAN SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION
- Publication number 20250174463
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Yin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUT EPI PROCESS AND STRUCTURES
- Publication number 20250176249
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Feng-Ching Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...
- Publication number 20250174555
- Publication date May 29, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...
- Publication number 20250176240
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Tai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...
- Publication number 20250166993
- Publication date May 22, 2025
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Patterning Process
- Publication number 20250166999
- Publication date May 22, 2025
- Shin-Etsu Chemical Co., Ltd.
- Naoki KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...
- Publication number 20250167000
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ping TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNING PROCESSES UTILIZING DIRECTIONAL DEPOSITION
- Publication number 20250167001
- Publication date May 22, 2025
- Applied Materials, Inc.
- Tong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250169169
- Publication date May 22, 2025
- UNITED MICROELECTRONICS CORP.
- Chun-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20250169173
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Joong Gun OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS
- Publication number 20250159944
- Publication date May 15, 2025
- Micron Technology, Inc.
- Christopher J. Larsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250157854
- Publication date May 15, 2025
- Yong Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250151384
- Publication date May 8, 2025
- UNITED MICROELECTRONICS CORP.
- Shuo-Lin Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149424
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...
- Publication number 20250149425
- Publication date May 8, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Francis J. CARNEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHENE SENSORS AND A METHOD OF MANUFACTURE
- Publication number 20250146971
- Publication date May 8, 2025
- Paragraf Limited
- Liam McDonnell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20250142820
- Publication date May 1, 2025
- Micron Technology, Inc.
- Justin B. Dorhout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250142943
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Cheng CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250142875
- Publication date May 1, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...
- Publication number 20250142938
- Publication date May 1, 2025
- Adeia Semiconductor Solutions LLC
- Kangguo Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A REDUCED SIZE FEATURE
- Publication number 20250140557
- Publication date May 1, 2025
- NXP USA, Inc.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...
- Publication number 20250140558
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Yeongsup SOHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...
- Publication number 20250142939
- Publication date May 1, 2025
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films
- Publication number 20250140543
- Publication date May 1, 2025
- Intel Corporation
- Ilya KARPOV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING
- Publication number 20250132163
- Publication date Apr 24, 2025
- Applied Materials, Inc.
- Raghuveer Satya MAKALA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FI...
- Publication number 20250129203
- Publication date Apr 24, 2025
- Shin-Etsu Chemical Co., Ltd.
- Daisuke KORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR IMPROVING HARDNESS OF BAKED PRODUCT
- Publication number 20250130497
- Publication date Apr 24, 2025
- NISSAN CHEMICAL CORPORATION
- Hayato HATTORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NARROW LINE CUT MASKING PROCESS
- Publication number 20250132156
- Publication date Apr 24, 2025
- Geminatio, Inc.
- Brennan Peterson
- H01 - BASIC ELECTRIC ELEMENTS

using masks

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Alternating hardmasks for tight-pitch line formation

Method of fabricating Fin-type field-effect transistor device havin...

Semiconductor device and method

Enhanced directed self-assembly in the presence of low Tg oligomers...

Resist underlayer film-forming composition

Semiconductor device and method

FinFET device and method of forming same

Step-stacked nanowire CMOS structure for low power logic device and...

Semiconductor device and method of fabricating same

Method for non-resist nanolithography

Semiconductor structure etching solution and method for fabricating...

Method for manufacturing semiconductor structure, and semiconductor...

Methods of cutting a fine pattern, methods of forming active patter...

Methods for forming multilayer horizontal NOR-type thin-film memory...

Semiconductor device structure and method for preparing the same

Structure manufacturing method

Cyclic method for reactive development of photoresists

Edge fin trim process

Integration of multiple transistors having fin and mesa structures

Semiconductor device

Pattern decomposition lithography techniques

Thin film transistor array having a stacked multi-layer metal oxide...

Method for manufacturing semiconductor structure

Method of manufacturing memory device with first and second isolati...

Methods of forming semiconductor devices

Tin oxide and tin carbide materials for semiconductor patterning ap...

Oblique deposition and etch processes

Method for forming epitaxial source/drain features and semiconducto...

Method of manufacturing a semiconductor device

Selective and isotropic etch of silicon over silicon-germanium allo...

Patents Applicationslast 30 patents

WAFER END PROTECTIVE-FILM FORMING COMPOSITION FOR SEMICONDUCTOR MAN...

ASSEMBLY STRUCTURE INCLUDING A PLURALITY OF SPACERS AND METHOD OF M...

METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH FIN ISOLATION

CUT EPI PROCESS AND STRUCTURES

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR CHIP M...

SEMICONDUCTOR DEVICE WITH FIN END SPACER DUMMY GATE AND METHOD OF M...

METHODS OF FORMING NANOSTRUCTURES UTILIZING SELF-ASSEMBLED NUCLEIC...

Patterning Process

PATTERNING MATERIAL INCLUDING SILICON-CONTAINING LAYER AND METHOD F...

PATTERNING PROCESSES UTILIZING DIRECTIONAL DEPOSITION

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

METHODS OF FORMING SEMICONDUCTOR DEVICES HAVING LINERS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

SEMICONDUCTOR DEVICE AND METHOD OF FORMING MICRO INTERCONNECT STRUC...

GRAPHENE SENSORS AND A METHOD OF MANUFACTURE

Integrated Assemblies and Methods of Forming Integrated Assemblies

SEMICONDUCTOR DEVICE

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED...

METHOD FOR FORMING A REDUCED SIZE FEATURE

METHOD OF FORMING PATTERNS, SEMICONDUCTOR MEMORY DEVICE, AND METHOD...

DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRU...

Low Temperature Deposition of Hydrogen-Free Diamond-Like Carbon Films

ENGINEERING EPI STACKS FOR EXTREME WAFER THINNING

COMPOSITION FOR FORMING ORGANIC FILM, METHOD FOR FORMING ORGANIC FI...

METHOD FOR IMPROVING HARDNESS OF BAKED PRODUCT

NARROW LINE CUT MASKING PROCESS