Using means for chemical reduction

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CPC
H05K2203/1157

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/1157Using means for chemical reduction

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,776,932
- Issue date Oct 3, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process and device for low-temperature pressure sintering
- Patent number 11,626,383
- Issue date Apr 11, 2023
- Danfoss Silicon Power GmbH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Printing of nanowire films
- Patent number 11,240,917
- Issue date Feb 1, 2022
- TECHNOLOGY INNOVATION MOMENTUM FUND (ISRAEL) LIMITED PARTNERSHIP
- Gil Markovich
- B32 - LAYERED PRODUCTS
Information Patent Grant
Catalytic ink comprising metallic material made from diamminesilver...
- Patent number 11,089,692
- Issue date Aug 10, 2021
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Articles having silver ion α-oxy carboxylate oxime complexes
- Patent number 11,037,692
- Issue date Jun 15, 2021
- Eastman Kodak Company
- Deepak Shukla
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Laminate and circuit board
- Patent number 10,849,231
- Issue date Nov 24, 2020
- Toppan Forms Co., Ltd.
- Akihito Mori
- B32 - LAYERED PRODUCTS
Information Patent Grant
React-on-demand (ROD) fabrication method for high performance print...
- Patent number 10,772,218
- Issue date Sep 8, 2020
- The University of Western Ontario
- Tengyuan Zhang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Solder paste for reduction gas, and method for producing soldered p...
- Patent number 10,610,981
- Issue date Apr 7, 2020
- ORIGIN COMPANY, LIMITED
- Yukiko Hayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper power and method for producing same
- Patent number 10,518,323
- Issue date Dec 31, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoichi Kamikoriyama
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for firing copper paste
- Patent number 10,433,427
- Issue date Oct 1, 2019
- MATERIAL CONCEPT, INC.
- Junichi Koike
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Methods of forming conductive and resistive circuit structures in a...
- Patent number 10,390,433
- Issue date Aug 20, 2019
- Texas Instruments Incorporated
- Benjamin S. Cook
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 10,375,835
- Issue date Aug 6, 2019
- Atotech Deutchland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Articles having reducible silver ion complexes or silver metal
- Patent number 10,356,899
- Issue date Jul 16, 2019
- Eastman Kodak Company
- Deepak Shukla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roughened copper foil, copper clad laminate, and printed circuit board
- Patent number 10,280,501
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Satoshi Mogi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal nanowire thin-films
- Patent number 10,237,974
- Issue date Mar 19, 2019
- RAMOT AT TEL-AVIV UNIVERSITY LTD. ISRAELI COMPANY OF
- Gil Markovich
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrical components and methods and systems of manufacturing elec...
- Patent number 10,154,595
- Issue date Dec 11, 2018
- TE Connectivity Corporation
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Catalyst for a catalytic ink and uses thereof
- Patent number 10,154,596
- Issue date Dec 11, 2018
- Taiwan Green Point Enterprises Co., Ltd.
- Pen-Yi Liao
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for precipitation of conducting polymer/metal composites, a...
- Patent number 10,043,598
- Issue date Aug 7, 2018
- National Institute for Materials Science
- Jin Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fused metal nanostructured networks, fusing solutions with reducing...
- Patent number 10,020,807
- Issue date Jul 10, 2018
- C3Nano Inc.
- Ajay Virkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Process for depositing metal on a substrate
- Patent number 10,000,652
- Issue date Jun 19, 2018
- Zhiyi Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive film forming method and sintering promoter
- Patent number 9,905,339
- Issue date Feb 27, 2018
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroconductive-film-forming composition and method for producing...
- Patent number 9,868,864
- Issue date Jan 16, 2018
- FUJIFILM Corporation
- Hiroaki Tsuyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Galvanic process for making printed conductive metal markings for c...
- Patent number 9,820,387
- Issue date Nov 14, 2017
- Xerox Corporation
- Naveen Chopra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for forming a conductive film, a conductive film, a met...
- Patent number 9,809,489
- Issue date Nov 7, 2017
- JSR Corporation
- Sugirou Shimoda
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Methods of treating copper surfaces for enhancing adhesion to organ...
- Patent number 9,795,040
- Issue date Oct 17, 2017
- Namics Corporation
- Jen-Chieh Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microreactor-assisted printing of conductive traces with in-situ re...
- Patent number 9,763,325
- Issue date Sep 12, 2017
- Oregon State University
- Chih-Hung Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of treating metal surfaces and devices formed thereby
- Patent number 9,763,336
- Issue date Sep 12, 2017
- Atotech Deutschland GmbH
- Jen-Chieh Wei
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming thin film conductors on a substrate
- Patent number 9,743,516
- Issue date Aug 22, 2017
- NCC Nano, LLC
- Andrew E. Edd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and manufacturing method of electronic apparatus
- Patent number 9,743,531
- Issue date Aug 22, 2017
- Denso Corporation
- Toshihiro Miyake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition set, conductive substrate and method of producing the s...
- Patent number 9,676,969
- Issue date Jun 13, 2017
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING
- Publication number 20210104488
- Publication date Apr 8, 2021
- DANFOSS SILICON POWER GMBH
- Ronald Eisele
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FLOCCULATES OF METALLIC, GEOMETRICALLY DISCRETE NANOPARTICLES COMPO...
- Publication number 20200095442
- Publication date Mar 26, 2020
- NANO DIMENSIONS TECHNOLOGIES LTD.
- Lior Yedidya
- B82 - NANO-TECHNOLOGY
Information Patent Application
3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...
- Publication number 20190327840
- Publication date Oct 24, 2019
- Corning Incorporated
- Dana Craig Bookbinder
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES
- Publication number 20190228873
- Publication date Jul 25, 2019
- Eastman Kodak Company
- Deepak Shukla
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CATALYST FOR A CATALYTIC INK AND USES THEREOF
- Publication number 20190075659
- Publication date Mar 7, 2019
- TAIWAN GREEN POINT ENTERPRISES CO. LTD.
- Pen-Yi LIAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
FUSED METAL NANOSTRUCTURED NETWORKS, FUSING SOLUTIONS WITH REDUCING...
- Publication number 20180287608
- Publication date Oct 4, 2018
- C3NANO INC.
- Ajay Virkar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organ...
- Publication number 20170027065
- Publication date Jan 26, 2017
- eSionic Corp.
- Jen-Chieh Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printing Method for Fabrication of Printed Electronics
- Publication number 20160353578
- Publication date Dec 1, 2016
- Jun Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALVANIC PROCESS FOR MAKING PRINTED CONDUCTIVE METAL MARKINGS FOR C...
- Publication number 20160353579
- Publication date Dec 1, 2016
- Xerox Corporation
- Naveen Chopra
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CATALYST FOR A CATALYTIC INK AND USES THEREOF
- Publication number 20160289469
- Publication date Oct 6, 2016
- TAIWAN GREEN POINT ENTERPRISES CO., LTD.
- Pen-Yi LIAO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS
- Publication number 20140367619
- Publication date Dec 18, 2014
- JOHN D. SUMMERS
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE
- Publication number 20140357081
- Publication date Dec 4, 2014
- William Wismann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING CONDUCTIVE LINE, AND DEVICE COMPRISING THE SAME
- Publication number 20140345910
- Publication date Nov 27, 2014
- InnoLux Corporation
- Ya-Leng WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FUSED METAL NANOSTRUCTURED NETWORKS, FUSING SOLUTIONS WITH REDUCING...
- Publication number 20140238833
- Publication date Aug 28, 2014
- C3NANO INC.
- Ajay Virkar
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...
- Publication number 20140242362
- Publication date Aug 28, 2014
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BASE MATERIAL FOR FORMING ELECTROCONDUCTIVE PATTERN, CIRCUIT BOARD,...
- Publication number 20140231124
- Publication date Aug 21, 2014
- FUJIFILM CORPORATION
- Takeichi TATSUTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINE METAL PARTICLES AND FINE METAL OXIDE PARTICLES IN DRY POWDER F...
- Publication number 20140178581
- Publication date Jun 26, 2014
- HARIMA CHEMICALS, INC.
- Daisuke Itoh
- B82 - NANO-TECHNOLOGY
Information Patent Application
PROCESS FOR PRECIPITATION OF CONDUCTING POLYMER/METAL COMPOSITES, A...
- Publication number 20140162061
- Publication date Jun 12, 2014
- National Institute for Materials Science
- Jin Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE
- Publication number 20140154427
- Publication date Jun 5, 2014
- NCC NANO, LLC
- ANDREW E. EDD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...
- Publication number 20140097002
- Publication date Apr 10, 2014
- Tyco Electronics AMP GmbH
- Soenke Sachs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...
- Publication number 20140083753
- Publication date Mar 27, 2014
- FUJIFILM CORPORATION
- Hiroshi MATAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140027161
- Publication date Jan 30, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kiwon Lee
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE FIBER AND/OR FABRICS, CONDUCTIV...
- Publication number 20140027038
- Publication date Jan 30, 2014
- Korea Institute of Machinery and Materials
- Hye Moon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A COPPER WIRING PATTERN
- Publication number 20130295276
- Publication date Nov 7, 2013
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...
- Publication number 20130216847
- Publication date Aug 22, 2013
- ROBERT BOSCH GmbH
- Daniel Wolde-Giorgis
- B32 - LAYERED PRODUCTS
Information Patent Application
Kit for preparing a conductive pattern
- Publication number 20130075672
- Publication date Mar 28, 2013
- Simona Magdalena Rucareanu
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE
- Publication number 20130043603
- Publication date Feb 21, 2013
- William Wismann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE
- Publication number 20130043062
- Publication date Feb 21, 2013
- EARTHONE CIRCUIT TECHNOLOGIES CORPORATION
- William Wismann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Formation of Solid Layers on Substrates
- Publication number 20130040154
- Publication date Feb 14, 2013
- CONDUCTIVE INKJET TECHNOLOGY LIMITED
- Philip Gareth Bentley
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, A...
- Publication number 20120305298
- Publication date Dec 6, 2012
- Industrial Technology Research Institute
- Ruoh-Huey Uang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Using means for chemical reduction

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Process and device for low-temperature pressure sintering

Process and device for low-temperature pressure sintering

Printing of nanowire films

Catalytic ink comprising metallic material made from diamminesilver...

Articles having silver ion α-oxy carboxylate oxime complexes

Laminate and circuit board

React-on-demand (ROD) fabrication method for high performance print...

Solder paste for reduction gas, and method for producing soldered p...

Copper power and method for producing same

Method for firing copper paste

Methods of forming conductive and resistive circuit structures in a...

Methods of treating metal surfaces and devices formed thereby

Articles having reducible silver ion complexes or silver metal

Roughened copper foil, copper clad laminate, and printed circuit board

Metal nanowire thin-films

Electrical components and methods and systems of manufacturing elec...

Catalyst for a catalytic ink and uses thereof

Process for precipitation of conducting polymer/metal composites, a...

Fused metal nanostructured networks, fusing solutions with reducing...

Process for depositing metal on a substrate

Conductive film forming method and sintering promoter

Electroconductive-film-forming composition and method for producing...

Galvanic process for making printed conductive metal markings for c...

Composition for forming a conductive film, a conductive film, a met...

Methods of treating copper surfaces for enhancing adhesion to organ...

Microreactor-assisted printing of conductive traces with in-situ re...

Methods of treating metal surfaces and devices formed thereby

Method for forming thin film conductors on a substrate

Electronic apparatus and manufacturing method of electronic apparatus

Composition set, conductive substrate and method of producing the s...

Patents Applicationslast 30 patents

PROCESS AND DEVICE FOR LOW-TEMPERATURE PRESSURE SINTERING

FLOCCULATES OF METALLIC, GEOMETRICALLY DISCRETE NANOPARTICLES COMPO...

3D INTERPOSER WITH THROUGH GLASS VIAS - METHOD OF INCREASING ADHESI...

ARTICLES HAVING SILVER ION a-OXY CARBOXYLATE OXIME COMPLEXES

CATALYST FOR A CATALYTIC INK AND USES THEREOF

FUSED METAL NANOSTRUCTURED NETWORKS, FUSING SOLUTIONS WITH REDUCING...

Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organ...

Printing Method for Fabrication of Printed Electronics

GALVANIC PROCESS FOR MAKING PRINTED CONDUCTIVE METAL MARKINGS FOR C...

CATALYST FOR A CATALYTIC INK AND USES THEREOF

PHOTONIC SINTERING OF POLYMER THICK FILM COPPER CONDUCTOR COMPOSITIONS

METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE

METHOD OF FORMING CONDUCTIVE LINE, AND DEVICE COMPRISING THE SAME

FUSED METAL NANOSTRUCTURED NETWORKS, FUSING SOLUTIONS WITH REDUCING...

COMPOSITION SET, CONDUCTIVE SUBSTRATE AND METHOD OF PRODUCING THE S...

BASE MATERIAL FOR FORMING ELECTROCONDUCTIVE PATTERN, CIRCUIT BOARD,...

FINE METAL PARTICLES AND FINE METAL OXIDE PARTICLES IN DRY POWDER F...

PROCESS FOR PRECIPITATION OF CONDUCTING POLYMER/METAL COMPOSITES, A...

METHOD FOR FORMING THIN FILM CONDUCTORS ON A SUBSTRATE

ELECTRICAL COMPONENTS AND METHODS AND SYSTEMS OF MANUFACTURING ELEC...

METHOD OF FORMING COPPER WIRING, METHOD OF MANUFACTURING WIRING BOA...

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING CONDUCTIVE FIBER AND/OR FABRICS, CONDUCTIV...

METHOD FOR FORMING A COPPER WIRING PATTERN

STARTING MATERIAL FOR A SINTERED BOND AND PROCESS FOR PRODUCING THE...

Kit for preparing a conductive pattern

METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE

METHOD OF FORMING A CONDUCTIVE IMAGE ON A NON-CONDUCTIVE SURFACE

Formation of Solid Layers on Substrates

BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, A...