using means for preventing stiction of the seismic mass to the substrate

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G01P2015/0874

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GPHYSICS G01Measuring instruments G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT

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G01P2015/0874using means for preventing stiction of the seismic mass to the substrate

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Patents Grantslast 30 patents

Information Patent Grant
3-axis angular accelerometer
- Patent number 12,153,065
- Issue date Nov 26, 2024
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor, physical quantity sensor device, and iner...
- Patent number 12,153,064
- Issue date Nov 26, 2024
- Seiko Epson Corporation
- Satoru Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Mems inertial sensor with high resistance to stiction
- Patent number 12,117,464
- Issue date Oct 15, 2024
- STMicroelectronics S.r.l.
- Gabriele Gattere
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Active stiction recovery
- Patent number 11,655,139
- Issue date May 23, 2023
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMs inertial sensor with high resistance to stiction
- Patent number 11,543,428
- Issue date Jan 3, 2023
- STMicroelectronics S.r.l.
- Gabriele Gattere
- G01 - MEASURING TESTING
Information Patent Grant
3-axis angular accelerometer
- Patent number 11,313,876
- Issue date Apr 26, 2022
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with stiction recover and methods
- Patent number 10,961,119
- Issue date Mar 30, 2021
- MCube, Inc.
- Shih-Wei Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
3-axis angular accelerometer
- Patent number 10,585,111
- Issue date Mar 10, 2020
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device and method
- Patent number 10,545,168
- Issue date Jan 28, 2020
- NXP USA, INC.
- Jerome Romain Enjalbert
- G01 - MEASURING TESTING
Information Patent Grant
Elastic bump stops for MEMS devices
- Patent number 10,527,420
- Issue date Jan 7, 2020
- Invensense, Inc.
- Jin Qiu
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity detection element, physical quantity detection de...
- Patent number 10,527,644
- Issue date Jan 7, 2020
- Seiko Epson Corporation
- Shota Kigure
- G01 - MEASURING TESTING
Information Patent Grant
Stiction detection and recovery in a micro-electro-mechanical syste...
- Patent number 10,488,430
- Issue date Nov 26, 2019
- NXP USA, INC.
- Jerome Romain Enjalbert
- G01 - MEASURING TESTING
Information Patent Grant
Physical quantity sensor, sensor device, electronic apparatus, and...
- Patent number 10,352,701
- Issue date Jul 16, 2019
- Seiko Epson Corporation
- Satoru Tanaka
- G01 - MEASURING TESTING
Information Patent Grant
Functional element, electronic apparatus, and moving object
- Patent number 10,317,425
- Issue date Jun 11, 2019
- Seiko Epson Corporation
- Satoru Tanaka
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semi-flexible proof-mass
- Patent number 10,190,938
- Issue date Jan 29, 2019
- Murata Manufacturing Co., Ltd.
- Anssi Blomqvist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity detection element, physical quantity detection de...
- Patent number 9,939,457
- Issue date Apr 10, 2018
- Seiko Epson Corporation
- Shota Kigure
- G01 - MEASURING TESTING
Information Patent Grant
Reducing MEMS stiction by deposition of nanoclusters
- Patent number 9,776,853
- Issue date Oct 3, 2017
- NXP USA, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods to determine stiction failures in MEMS devices
- Patent number 9,733,268
- Issue date Aug 15, 2017
- Hanking Electronics Ltd.
- Giorgio Massamiliano Membretti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing the effect of glass charging in MEMS devices
- Patent number 9,568,491
- Issue date Feb 14, 2017
- Honeywell International Inc.
- Mark W. Weber
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by introduction of a carbon barrier
- Patent number 9,463,973
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reducing MEMS stiction by deposition of nanoclusters
- Patent number 9,290,380
- Issue date Mar 22, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and method of manufacturing MEMS device
- Patent number 8,643,927
- Issue date Feb 4, 2014
- Hitachi, Ltd.
- Chisaki Takubo
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Physical Quantity Sensor, Physical Quantity Sensor Device, And Iner...
- Publication number 20240272195
- Publication date Aug 15, 2024
- SEIKO EPSON CORPORATION
- Satoru TANAKA
- G01 - MEASURING TESTING
Information Patent Application
MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION
- Publication number 20230184806
- Publication date Jun 15, 2023
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- G01 - MEASURING TESTING
Information Patent Application
3-AXIS ANGULAR ACCELEROMETER
- Publication number 20220155336
- Publication date May 19, 2022
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACTIVE STICTION RECOVERY
- Publication number 20210188619
- Publication date Jun 24, 2021
- InvenSense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION
- Publication number 20200400712
- Publication date Dec 24, 2020
- STMicroelectronics S.r.l.
- Gabriele GATTERE
- G01 - MEASURING TESTING
Information Patent Application
3-AXIS ANGULAR ACCELEROMETER
- Publication number 20200241036
- Publication date Jul 30, 2020
- Analog Devices, Inc.
- Xin Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELASTIC BUMP STOPS FOR MEMS DEVICES
- Publication number 20180347984
- Publication date Dec 6, 2018
- InvenSense, Inc.
- Jin Qin
- G01 - MEASURING TESTING
Information Patent Application
PHYSICAL QUANTITY DETECTION ELEMENT, PHYSICAL QUANTITY DETECTION DE...
- Publication number 20180180641
- Publication date Jun 28, 2018
- SEIKO EPSON CORPORATION
- Shota KIGURE
- G01 - MEASURING TESTING
Information Patent Application
SENSOR
- Publication number 20170160307
- Publication date Jun 8, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIKO TAKAGI
- G01 - MEASURING TESTING
Information Patent Application
REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS
- Publication number 20140167189
- Publication date Jun 19, 2014
- Robert F. Steimle
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER
- Publication number 20140167188
- Publication date Jun 19, 2014
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EXTERNAL FORCE DETECTION SENSOR AND EXTERNAL FORCE DETECTION EQUIPMENT
- Publication number 20130255402
- Publication date Oct 3, 2013
- NIHON DEMPA KOGYO CO., LTD.
- MITSUAKI KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
EXTERNAL FORCE DETECTION EQUIPMENT
- Publication number 20130154442
- Publication date Jun 20, 2013
- NIHON DEMPA KOGYO CO., LTD.
- MITSUAKI KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
PROOF MASS POSITIONING FEATURES HAVING TANGENTIAL CONTACT SURFACES
- Publication number 20130111992
- Publication date May 9, 2013
- ROBERT BOSCH GmbH
- Gary O'Brien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACCELERATION SENSOR
- Publication number 20120160029
- Publication date Jun 28, 2012
- MITSUBISHI ELECTRIC CORPORATION
- Yasuo YAMAGUCHI
- G01 - MEASURING TESTING
Information Patent Application
MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE
- Publication number 20120038963
- Publication date Feb 16, 2012
- Hitachi, Ltd.
- Chisaki TAKUBO
- B81 - MICRO-STRUCTURAL TECHNOLOGY

using means for preventing stiction of the seismic mass to the substrate

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

3-axis angular accelerometer

Physical quantity sensor, physical quantity sensor device, and iner...

Mems inertial sensor with high resistance to stiction

Active stiction recovery

MEMs inertial sensor with high resistance to stiction

3-axis angular accelerometer

MEMS device with stiction recover and methods

3-axis angular accelerometer

Microelectromechanical systems device and method

Elastic bump stops for MEMS devices

Physical quantity detection element, physical quantity detection de...

Stiction detection and recovery in a micro-electro-mechanical syste...

Physical quantity sensor, sensor device, electronic apparatus, and...

Functional element, electronic apparatus, and moving object

Semi-flexible proof-mass

Physical quantity detection element, physical quantity detection de...

Reducing MEMS stiction by deposition of nanoclusters

Systems and methods to determine stiction failures in MEMS devices

Reducing the effect of glass charging in MEMS devices

Reducing MEMS stiction by introduction of a carbon barrier

Reducing MEMS stiction by deposition of nanoclusters

MEMS device and method of manufacturing MEMS device

Patents Applicationslast 30 patents

Physical Quantity Sensor, Physical Quantity Sensor Device, And Iner...

MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION

3-AXIS ANGULAR ACCELEROMETER

ACTIVE STICTION RECOVERY

MEMS INERTIAL SENSOR WITH HIGH RESISTANCE TO STICTION

3-AXIS ANGULAR ACCELEROMETER

ELASTIC BUMP STOPS FOR MEMS DEVICES

PHYSICAL QUANTITY DETECTION ELEMENT, PHYSICAL QUANTITY DETECTION DE...

SENSOR

REDUCING MEMS STICTION BY DEPOSITION OF NANOCLUSTERS

REDUCING MEMS STICTION BY INTRODUCTION OF A CARBON BARRIER

EXTERNAL FORCE DETECTION SENSOR AND EXTERNAL FORCE DETECTION EQUIPMENT

EXTERNAL FORCE DETECTION EQUIPMENT

PROOF MASS POSITIONING FEATURES HAVING TANGENTIAL CONTACT SURFACES

ACCELERATION SENSOR

MEMS DEVICE AND METHOD OF MANUFACTURING MEMS DEVICE