using thermal contact gas

Industry

CPC
C23C16/466

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating

Current Industry

C23C16/466using thermal contact gas

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus and method for dechucking wafer in the...
- Patent number 12,106,942
- Issue date Oct 1, 2024
- Samsung Electronics Co., Ltd.
- Yi Rop Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for substrate support temperature control
- Patent number 11,981,998
- Issue date May 14, 2024
- Applied Materials, Inc.
- Zubin Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,948,826
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Temperature control method and plasma processing apparatus
- Patent number 11,920,242
- Issue date Mar 5, 2024
- Tokyo Electron Limited
- Yuya Minoura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual-function wafer backside pressure control and edge purge
- Patent number 11,923,233
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Joseph AuBuchon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate retaining apparatus, system including the apparatus, and...
- Patent number 11,885,023
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Shiva K. T. Rajavelu Muralidhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modular reactor for microwave plasma-assisted deposition
- Patent number 11,859,279
- Issue date Jan 2, 2024
- DIAM CONCEPT
- Alix Gicquel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System and method for managing substrate outgassing
- Patent number 11,817,297
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- Matthew Spuller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Piping assembly and substrate processing apparatus
- Patent number 11,810,769
- Issue date Nov 7, 2023
- Tokyo Electron Limited
- Kazuki Oshima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
UHV in-situ cryo-cool chamber
- Patent number 11,802,340
- Issue date Oct 31, 2023
- Applied Materials, Inc.
- Bharath Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adjustable thermal break in a substrate support
- Patent number 11,764,041
- Issue date Sep 19, 2023
- Applied Materials, Inc.
- Alvaro Garcia De Gorordo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and non-transitory computer-readable...
- Patent number 11,761,087
- Issue date Sep 19, 2023
- Kokusai Electric Corporation
- Masashi Sugishita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF capacitive coupled etch reactor
- Patent number 11,742,187
- Issue date Aug 29, 2023
- EVATEC AG
- Johannes Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus, recording medium, and fluid circula...
- Patent number 11,694,907
- Issue date Jul 4, 2023
- Kokusai Electric Corporation
- Toshiki Fujino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor wafer with wafer chuck havin...
- Patent number 11,594,401
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Chun Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High power electrostatic chuck design with radio frequency coupling
- Patent number 11,532,497
- Issue date Dec 20, 2022
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate fixing device
- Patent number 11,521,885
- Issue date Dec 6, 2022
- Shinko Electric Industries Co., Ltd.
- Tadayoshi Yoshikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Vacuum plasma workpiece treatment apparatus
- Patent number 11,469,085
- Issue date Oct 11, 2022
- EVATEC AG
- Jurgen Weichart
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Film-forming apparatus
- Patent number 11,466,365
- Issue date Oct 11, 2022
- Tokyo Electron Limited
- Daisuke Toriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of controlling substrate processing apparatus, and substrate...
- Patent number 11,441,224
- Issue date Sep 13, 2022
- Tokyo Electron Limited
- Daisuke Toriya
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for forming impurity free metal alloy films
- Patent number 11,359,282
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
RF capacitive coupled dual frequency etch reactor
- Patent number 11,217,434
- Issue date Jan 4, 2022
- EVATEC AG
- Jurgen Weichart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling station with integrated isolation valves
- Patent number 11,127,606
- Issue date Sep 21, 2021
- Seagate Technology LLC
- Samuel Lewis Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Upper cone for epitaxy chamber
- Patent number 10,978,324
- Issue date Apr 13, 2021
- Applied Materials, Inc.
- Shinichi Oki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Condensation suppressing method and processing system
- Patent number 10,961,627
- Issue date Mar 30, 2021
- Tokyo Electron Limited
- Koji Kamata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer boat cooldown device
- Patent number 10,858,738
- Issue date Dec 8, 2020
- ASM International N.V.
- Chris G. M. de Ridder
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for coupling a voltage to portions of a substrate
- Patent number 10,714,372
- Issue date Jul 14, 2020
- Applied Materials, Inc.
- Thai Cheng Chua
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sample stage/holder for improved thermal and gas flow control at el...
- Patent number 10,704,160
- Issue date Jul 7, 2020
- Arizona Board of Regents on behalf of Arizona State University
- Franz A. Koeck
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Upper cone for epitaxy chamber
- Patent number 10,446,420
- Issue date Oct 15, 2019
- Applied Materials, Inc.
- Shinichi Oki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus including heating and cooling device...
- Patent number 10,415,136
- Issue date Sep 17, 2019
- Kokusai Electric Corporation
- Motoya Takewaki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...
- Publication number 20240379400
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Jung Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF COOLING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR...
- Publication number 20240309509
- Publication date Sep 19, 2024
- Kokusai Electric Corporation
- Hideto YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS
- Publication number 20240287678
- Publication date Aug 29, 2024
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL
- Publication number 20240229240
- Publication date Jul 11, 2024
- Applied Materials, Inc.
- Zubin Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STAGE FOR HEATING AND COOLING OBJECT
- Publication number 20240200192
- Publication date Jun 20, 2024
- ADVANTEC CO., LTD.
- Yuji Masuda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...
- Publication number 20240133035
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- SHIVA K.T. RAJAVELU MURALIDHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADLOCK ASSEMBLY INCLUDING CHILLER UNIT
- Publication number 20240110282
- Publication date Apr 4, 2024
- ASM IP HOLDING, B.V.
- Hideki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230416920
- Publication date Dec 28, 2023
- TOKYO ELECTRON LIMITED
- Tatsuya YAMAGUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE...
- Publication number 20230383411
- Publication date Nov 30, 2023
- Kokusai Electric Corporation
- Masashi SUGISHITA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (M...
- Publication number 20230374659
- Publication date Nov 23, 2023
- Forge Nano, Inc.
- Daniel Higgs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230323538
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Yusuke KIKUCHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20230295804
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVIN...
- Publication number 20230197421
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chun YANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COOLED EDGE RING WITH INTEGRATED SEALS
- Publication number 20230133798
- Publication date May 4, 2023
- LAM RESEARCH CORPORATION
- Adam Christopher MACE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (M...
- Publication number 20230104924
- Publication date Apr 6, 2023
- Forge Nano, Inc.
- Daniel Higgs
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING
- Publication number 20230072594
- Publication date Mar 9, 2023
- Applied Materials, Inc.
- Jaeyong Cho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...
- Publication number 20220344193
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING GRAPHENE
- Publication number 20220332585
- Publication date Oct 20, 2022
- Paragraf Limited
- Sebastian Dixon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS
- Publication number 20220267904
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD, AND METHOD OF M...
- Publication number 20220259727
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Tatsuo HATANO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SixNy AS A NUCLEATION LAYER FOR SiCxOy
- Publication number 20220235463
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Guangbi Yuan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR RECORDING A STATE OF A CVD REACTOR UNDER PRODUCTION COND...
- Publication number 20220186375
- Publication date Jun 16, 2022
- AIXTRON SE
- Pascal TILLMANNS
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MANU...
- Publication number 20220122858
- Publication date Apr 21, 2022
- Kokusai Electric Corporation
- Hitoshi MURATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS
- Publication number 20220049353
- Publication date Feb 17, 2022
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM AND METHOD FOR MANAGING SUBSTRATE OUTGASSING
- Publication number 20210280391
- Publication date Sep 9, 2021
- Applied Materials, Inc.
- Matthew SPULLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVIN...
- Publication number 20210265142
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Chun YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL
- Publication number 20210130960
- Publication date May 6, 2021
- Applied Materials, Inc.
- Zubin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR REACTOR FOR MICROWAVE PLASMA-ASSISTED DEPOSITION
- Publication number 20210087676
- Publication date Mar 25, 2021
- DIAM CONCEPT
- Alix GICQUEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...
- Publication number 20200102653
- Publication date Apr 2, 2020
- ASM IP HOLDING B.V.
- SHIVA K.T. RAJAVELU MURALIDHAR
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
UPPER CONE FOR EPITAXY CHAMBER
- Publication number 20200020556
- Publication date Jan 16, 2020
- Applied Materials, Inc.
- Shinichi OKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

using thermal contact gas

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Plasma processing apparatus and method for dechucking wafer in the...

Systems and methods for substrate support temperature control

High power electrostatic chuck design with radio frequency coupling

Temperature control method and plasma processing apparatus

Dual-function wafer backside pressure control and edge purge

Substrate retaining apparatus, system including the apparatus, and...

Modular reactor for microwave plasma-assisted deposition

System and method for managing substrate outgassing

Piping assembly and substrate processing apparatus

UHV in-situ cryo-cool chamber

Adjustable thermal break in a substrate support

Substrate processing apparatus and non-transitory computer-readable...

RF capacitive coupled etch reactor

Substrate processing apparatus, recording medium, and fluid circula...

Method for manufacturing semiconductor wafer with wafer chuck havin...

High power electrostatic chuck design with radio frequency coupling

Substrate fixing device

Vacuum plasma workpiece treatment apparatus

Film-forming apparatus

Method of controlling substrate processing apparatus, and substrate...

Methods for forming impurity free metal alloy films

RF capacitive coupled dual frequency etch reactor

Cooling station with integrated isolation valves

Upper cone for epitaxy chamber

Condensation suppressing method and processing system

Wafer boat cooldown device

System for coupling a voltage to portions of a substrate

Sample stage/holder for improved thermal and gas flow control at el...

Upper cone for epitaxy chamber

Substrate processing apparatus including heating and cooling device...

Patents Applicationslast 30 patents

WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...

METHOD OF COOLING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR...

METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS

SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL

STAGE FOR HEATING AND COOLING OBJECT

SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...

LOADLOCK ASSEMBLY INCLUDING CHILLER UNIT

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE...

Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (M...

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD OF FORMING INTERCONNECT STRUCTURE

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVIN...

COOLED EDGE RING WITH INTEGRATED SEALS

Atomic Layer Deposition (ALD) for Multi-Layer Ceramic Capacitors (M...

HIGH POWER ELECTROSTATIC CHUCK DESIGN WITH RADIO FREQUENCY COUPLING

WAFER CHUCK STRUCTURE WITH HOLES IN UPPER SURFACE TO IMPROVE TEMPER...

METHOD FOR MANUFACTURING GRAPHENE

METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS

SUBSTRATE HEATING DEVICE, SUBSTRATE HEATING METHOD, AND METHOD OF M...

SixNy AS A NUCLEATION LAYER FOR SiCxOy

METHOD FOR RECORDING A STATE OF A CVD REACTOR UNDER PRODUCTION COND...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND APPARATUS FOR MANU...

METHODS FOR FORMING IMPURITY FREE METAL ALLOY FILMS

SYSTEM AND METHOD FOR MANAGING SUBSTRATE OUTGASSING

METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER WITH WAFER CHUCK HAVIN...

SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROL

MODULAR REACTOR FOR MICROWAVE PLASMA-ASSISTED DEPOSITION

SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...

UPPER CONE FOR EPITAXY CHAMBER