using thick film techniques

Industry

CPC
H05K3/12

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/12using thick film techniques

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional molding machine
- Patent number 12,245,378
- Issue date Mar 4, 2025
- FUJI CORPORATION
- Akihiro Kawajiri
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Flexible pressure sensors and user interfaces
- Patent number 12,232,548
- Issue date Feb 25, 2025
- LOOMIA Technologies, Inc.
- Madison Thea Maxey
- A41 - WEARING APPAREL
Information Patent Grant
Deposition with solid feedstock
- Patent number 12,238,870
- Issue date Feb 25, 2025
- Liquid Wire Inc.
- Jorge E. Carbo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additive manufacturing process of 3D electronic substrate
- Patent number 12,226,822
- Issue date Feb 18, 2025
- Schlumberger Technology Corporation
- Steven O. Dunford
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Direct printing and writing using undercooled metallic core-shell p...
- Patent number 12,226,831
- Issue date Feb 18, 2025
- Iowa State University Research Foundation, Inc.
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Electronics assembly
- Patent number 12,232,267
- Issue date Feb 18, 2025
- TACTOTEK OY
- Vinski Bräysy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Doctoring unit for a printing apparatus
- Patent number 12,226,998
- Issue date Feb 18, 2025
- EKRA AUTOMATISIERUNGSSYSTEME GMBH
- Torsten Vegelahn
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Conductive paste and electronic device
- Patent number 12,224,081
- Issue date Feb 11, 2025
- BEIJING DREAM INK TECHNOLOGIES CO., LTD.
- Zhongwei Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring
- Patent number 12,223,147
- Issue date Feb 11, 2025
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for printing metal lines and patterns at high resolution
- Patent number 12,209,304
- Issue date Jan 28, 2025
- Reophotonics Ltd.
- Michael Zenou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conductive ink interconnected devices
- Patent number 12,213,250
- Issue date Jan 28, 2025
- NCR Voyix Corporation
- John Paul Bacalso Aliganga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of detecting and adjusting contact of a micro-structural fl...
- Patent number 12,202,279
- Issue date Jan 21, 2025
- XTPL S.A.
- Tomasz Gos
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing display panel using inkjet device
- Patent number 12,207,418
- Issue date Jan 21, 2025
- UNIJET CO., LTD.
- Gil Hwan Yeo
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Component-containing substrate
- Patent number 12,200,871
- Issue date Jan 14, 2025
- Shinko Electric Industries Co., Ltd.
- Takao Koshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D printed microelectrode arrays
- Patent number 12,188,892
- Issue date Jan 7, 2025
- Carnegie Mellon University
- Rahul Panat
- G01 - MEASURING TESTING
Information Patent Grant
Printed wiring
- Patent number 12,182,369
- Issue date Dec 31, 2024
- Japan Aviation Electronics Industry, Limited
- Akitoshi Sakaue
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Nozzle
- Patent number 12,179,229
- Issue date Dec 31, 2024
- Illinois Tool Works Inc.
- Guohua Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal pattern forming method
- Patent number 12,185,472
- Issue date Dec 31, 2024
- FUJIFILM Corporation
- Eijiro Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring formation method and transfer mold manufacturing method
- Patent number 12,181,796
- Issue date Dec 31, 2024
- CONNECTEC JAPAN CORPORATION
- Hiroshi Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate positioning for deposition machine
- Patent number 12,172,430
- Issue date Dec 24, 2024
- Kateeva, Inc.
- Karl Mathia
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Lift printing using thin donor foils
- Patent number 12,162,294
- Issue date Dec 10, 2024
- Marc Altman
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Screen loading system
- Patent number 12,162,264
- Issue date Dec 10, 2024
- ASMPT SMT SINGAPORE PTE. LTD.
- Christopher Sheppard
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Systems and methods of 3D-printing a circuit board on a heat sink a...
- Patent number 12,156,344
- Issue date Nov 26, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 12,155,367
- Issue date Nov 26, 2024
- Murata Manufacturing Co., Ltd.
- Koki Sai
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Shared aperture folded dipole antenna
- Patent number 12,155,135
- Issue date Nov 26, 2024
- King Fahd University of Petroleum & Minerals
- Rifaqat Hussain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing printed circuit board
- Patent number 12,144,122
- Issue date Nov 12, 2024
- Sumitomo Electric Industries Ltd.
- Shoichiro Sakai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Systems and methods for additive manufacturing passive resistor-cap...
- Patent number 12,133,336
- Issue date Oct 29, 2024
- Nano Dimension Technologies, LTD.
- Daniel Sokol
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed lead
- Patent number 12,121,715
- Issue date Oct 22, 2024
- Saluda Medical Pty Limited
- John Louis Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive laminate and manufacturing method of conductive laminate
- Patent number 12,110,408
- Issue date Oct 8, 2024
- FUJIFILM Corporation
- Kotaro Maeda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
SECURE ELECTRONIC COMPONENT ASSEMBLY
- Publication number 20250081349
- Publication date Mar 6, 2025
- NVIDIA Corporation
- Elad Mentovich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS
- Publication number 20250063672
- Publication date Feb 20, 2025
- Raytheon Company
- Christopher Areias
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D Printed Microelectrode Arrays
- Publication number 20250060329
- Publication date Feb 20, 2025
- Carnegie Mellon University
- Rahul Panat
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE POSITIONING FOR DEPOSITION MACHINE
- Publication number 20250058572
- Publication date Feb 20, 2025
- Kateeva, Inc.
- Karl Mathia
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...
- Publication number 20250056731
- Publication date Feb 13, 2025
- Jan FRANCK
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...
- Publication number 20250056732
- Publication date Feb 13, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040055
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN
- Publication number 20250040054
- Publication date Jan 30, 2025
- James S. Honan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...
- Publication number 20250040060
- Publication date Jan 30, 2025
- enovate3D (Hangzhou) Technology Development Co., Ltd.
- Wangcan Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHARED APERTURE ANTENNA FOR MEDICAL DEVICES
- Publication number 20250038416
- Publication date Jan 30, 2025
- KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS
- Rifaqat HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF CORRECTING OVEN TECHNOLOGY
- Publication number 20250033131
- Publication date Jan 30, 2025
- Jabil Inc.
- Charles Santhakumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROCHANNEL PRINTING
- Publication number 20250013145
- Publication date Jan 9, 2025
- Worcester Polytechnic Institute
- Pratap Rao
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...
- Publication number 20250008664
- Publication date Jan 2, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jens JÄHNICKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS
- Publication number 20240431038
- Publication date Dec 26, 2024
- Jabil Inc.
- Sai Guruva Reddy Avuthu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
- Publication number 20240422916
- Publication date Dec 19, 2024
- FUJI CORPORATION
- Kenji TSUKADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20240414839
- Publication date Dec 12, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240414847
- Publication date Dec 12, 2024
- DENSO CORPORATION
- Takeshi KAZAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
CONDUCTIVE INK COMPOSITION
- Publication number 20240376331
- Publication date Nov 14, 2024
- Enjet Co., Ltd.
- Do Young BYUN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...
- Publication number 20240368420
- Publication date Nov 7, 2024
- WACKER CHEMIE AG
- Sabin-Lucian SURARU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
A METHOD AND SYSTEM FOR DETECTION AND ANALYSIS OF CHEMICAL COMPOUND...
- Publication number 20240337630
- Publication date Oct 10, 2024
- Technion Research & Development Foundation Limited
- Hossam HAICK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER P...
- Publication number 20240327668
- Publication date Oct 3, 2024
- Copprint Technologies Ltd
- Michael GROUCHKO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Debossed Contact Printing as a Patterning Method for Paper-Based El...
- Publication number 20240324107
- Publication date Sep 26, 2024
- Universtiy of Windsor
- Tricia Breen Carmichael
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES
- Publication number 20240316972
- Publication date Sep 26, 2024
- Smith & Nephew PLC
- Allan Kenneth Frazer Grugeon Hunt
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SHARED APERTURE FOLDED DIPOLE ANTENNA
- Publication number 20240313408
- Publication date Sep 19, 2024
- KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS
- Rifaqat HUSSAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD
- Publication number 20240314935
- Publication date Sep 19, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Rob Jacob HENDRIKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE
- Publication number 20240306307
- Publication date Sep 12, 2024
- Shenzhen china Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Zhuhui LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING BOARD
- Publication number 20240292532
- Publication date Aug 29, 2024
- NIPPON MEKTRON, LTD.
- Azumi TOMINAGA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC DEVICE
- Publication number 20240284601
- Publication date Aug 22, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

using thick film techniques

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Three-dimensional molding machine

Flexible pressure sensors and user interfaces

Deposition with solid feedstock

Additive manufacturing process of 3D electronic substrate

Direct printing and writing using undercooled metallic core-shell p...

Electronics assembly

Doctoring unit for a printing apparatus

Conductive paste and electronic device

Printed wiring

Methods for printing metal lines and patterns at high resolution

Conductive ink interconnected devices

Methods of detecting and adjusting contact of a micro-structural fl...

Method for manufacturing display panel using inkjet device

Component-containing substrate

3D printed microelectrode arrays

Printed wiring

Nozzle

Metal pattern forming method

Wiring formation method and transfer mold manufacturing method

Substrate positioning for deposition machine

Lift printing using thin donor foils

Screen loading system

Systems and methods of 3D-printing a circuit board on a heat sink a...

Method for manufacturing ceramic substrate and ceramic substrate

Shared aperture folded dipole antenna

System for providing dynamic feedback for selective adhesion PCB pr...

Method of manufacturing printed circuit board

Systems and methods for additive manufacturing passive resistor-cap...

Printed lead

Conductive laminate and manufacturing method of conductive laminate

Patents Applicationslast 30 patents

SECURE ELECTRONIC COMPONENT ASSEMBLY

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

REAL-TIME IN-SITU ADDITIVE CIRCUIT TUNING FOR RF/MICROWAVE ELECTRONICS

3D Printed Microelectrode Arrays

SUBSTRATE POSITIONING FOR DEPOSITION MACHINE

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELEC...

SYSTEMS AND METHODS OF 3D-PRINTING A CIRCUIT BOARD ON A HEAT SINK A...

METHOD TO MAKE THIN FILM ELECTRICALLY-CONDUCTIVE PATTERN

TRANSPARENT ARTICLE WITH ELECTRICALLY-CONDUCTIVE PATTERN

HIGH-PRECISION MULTILAYER PRINTED CIRCUIT BOARD AND 3D PRINTING PRE...

SHARED APERTURE ANTENNA FOR MEDICAL DEVICES

SELF CORRECTING OVEN TECHNOLOGY

MICROCHANNEL PRINTING

METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...

PRINTING OF MULTILAYER CIRCUITS ON GRAPHICS

CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

MOUNT BOARD AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

CONDUCTIVE INK COMPOSITION

ELECTRICALLY CONDUCTIVE ELASTOMERIC PRINTING INK FOR CONTACTLESS PR...

A METHOD AND SYSTEM FOR DETECTION AND ANALYSIS OF CHEMICAL COMPOUND...

FORMULATIONS AND PROCESSES FOR PRODUCING HIGHLY CONDUCTIVE COPPER P...

Debossed Contact Printing as a Patterning Method for Paper-Based El...

DESIGN RULES FOR SENSOR INTEGRATED SUBSTRATES

SHARED APERTURE FOLDED DIPOLE ANTENNA

DONOR PLATE, DEPOSITION DEVICE AND DEPOSITION METHOD

SOLDER-PRINTING STENCIL AND METHOD OF PRINTING SOLDER PASTE

COMPONENT MOUNTING BOARD

MANUFACTURING METHOD OF ELECTRONIC DEVICE