Using ultrasound

Industry

CPC
H05K2203/0285

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/0285Using ultrasound

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing textile with conductive yarns and integrate...
- Patent number 12,120,823
- Issue date Oct 15, 2024
- Myant Inc.
- Tony Chahine
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 12,070,814
- Issue date Aug 27, 2024
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,997,901
- Issue date May 28, 2024
- Samsung Display Co., Ltd.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display panel and display device comprising same
- Patent number 11,917,760
- Issue date Feb 27, 2024
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic welding systems, methods of using the same, and related...
- Patent number 11,850,676
- Issue date Dec 26, 2023
- Kulicke and Soffa Industries, Inc.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and method of fabricating display device using th...
- Patent number 11,798,912
- Issue date Oct 24, 2023
- Samsung Display Co., Ltd.
- Taeyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic tank and methods for uniform glass substrate etching
- Patent number 11,610,783
- Issue date Mar 21, 2023
- Corning Incorporated
- John Tyler Keech
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 11,605,697
- Issue date Mar 14, 2023
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 11,538,887
- Issue date Dec 27, 2022
- Samsung Display Co., Ltd.
- Jong Man Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device and method for manufacturing same
- Patent number 11,166,369
- Issue date Nov 2, 2021
- LINXENS HOLDING
- Eric Eymard
- F21 - LIGHTING
Information Patent Grant
Method of manufacturing anisotropic conductive film using vertical...
- Patent number 11,161,988
- Issue date Nov 2, 2021
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing ceramic circuit board
- Patent number 11,129,282
- Issue date Sep 21, 2021
- Kabushiki Kaisha Toshiba
- Hiromasa Kato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Desmearing method and desmearing device
- Patent number 11,102,889
- Issue date Aug 24, 2021
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display apparatus having grooved terminals
- Patent number 10,879,335
- Issue date Dec 29, 2020
- Samsung Display Co., Ltd.
- Byoungyong Kim
- G02 - OPTICS
Information Patent Grant
Decapsulation of electronic devices
- Patent number 10,879,079
- Issue date Dec 29, 2020
- JIACO Instruments Holding B.V.
- Jiaqi Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic bonding jig, bonding structure, and bonding method
- Patent number 10,744,591
- Issue date Aug 18, 2020
- Nippon Mektron, Ltd.
- Hiroshi Miyashiro
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic product and manufacturing method thereof
- Patent number 10,716,219
- Issue date Jul 14, 2020
- Lite-On Electronics (Guangzhou) Limited
- Yi-Feng Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contacting arrangement and method for forming the contacting arrang...
- Patent number 10,667,409
- Issue date May 26, 2020
- Robert Bosch GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for connecting inter-layer conductors and components in 3D...
- Patent number 10,660,214
- Issue date May 19, 2020
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and systems for embedding filaments in 3D structures, struc...
- Patent number 10,518,490
- Issue date Dec 31, 2019
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate, electronic device and display device having the same
- Patent number 10,515,881
- Issue date Dec 24, 2019
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin board structure and method for fabricating the same
- Patent number 10,455,701
- Issue date Oct 22, 2019
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate, component mounted resin substrate, and method of m...
- Patent number 10,455,706
- Issue date Oct 22, 2019
- Murata Manufacturing Co., Ltd.
- Shigeru Tago
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board desmear treatment method
- Patent number 10,420,221
- Issue date Sep 17, 2019
- Ushio Denki Kabushiki Kaisha
- Kenichi Hirose
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Endoscope, electronic unit and method for manufacturing electronic...
- Patent number 10,356,907
- Issue date Jul 16, 2019
- Olympus Corporation
- Takahide Miyawaki
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of lamination of dielectric circuit materials using ultrason...
- Patent number 10,356,914
- Issue date Jul 16, 2019
- Raytheon Company
- Patrick J. Kocurek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...
- Publication number 20240359255
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Theodore J. Copperthite
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD GROUNDING
- Publication number 20240196516
- Publication date Jun 13, 2024
- AES Global Holdings PTE Ltd.
- Yihong Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20230172021
- Publication date Jun 1, 2023
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING TEXTILES WITH INTEGRATED ELECTRICAL PATHS A...
- Publication number 20230044571
- Publication date Feb 9, 2023
- Myant Inc.
- Tony CHAHINE
- D04 - BRAIDING LACE-MAKING KNITTING TRIMMINGS NON-WOVEN FABRICS
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...
- Publication number 20220173069
- Publication date Jun 2, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Olivier CASTANY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAME
- Publication number 20210321517
- Publication date Oct 14, 2021
- Byoung Yong KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...
- Publication number 20210118973
- Publication date Apr 22, 2021
- SAMSUNG DISPLAY CO., LTD.
- Byoungyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decapsulation of Electronic Devices
- Publication number 20200279749
- Publication date Sep 3, 2020
- JIACO Instruments Holding B.V.
- Jiaqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200235189
- Publication date Jul 23, 2020
- SAMSUNG DISPLAY CO., LTD.
- Jong Man BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
- Publication number 20200170118
- Publication date May 28, 2020
- Kabushiki Kaisha Toshiba
- Hiromasa KATO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for Bonding an Electrically Conductive Element to a Bonding...
- Publication number 20190356098
- Publication date Nov 21, 2019
- Florian Eacock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...
- Publication number 20190215969
- Publication date Jul 11, 2019
- ROBERT BOSCH GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-Emitting Device And Method For Manufacturing Same
- Publication number 20190174625
- Publication date Jun 6, 2019
- LINXENS HOLDING
- Eric EYMARD
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF GLASS SUBSTRATE AND GLASS SUBSTRATE
- Publication number 20180339936
- Publication date Nov 29, 2018
- Asahi Glass Company, Limited
- Motoshi Ono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...
- Publication number 20180298206
- Publication date Oct 18, 2018
- Korea Advanced Institute of Science and Technology
- KyoungWook Paik
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductor-Structure Element Having an Internal Layer Substrate Lami...
- Publication number 20180242456
- Publication date Aug 23, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN SUBSTRATE, COMPONENT MOUNTED RESIN SUBSTRATE, AND METHOD OF M...
- Publication number 20180213653
- Publication date Jul 26, 2018
- Murata Manufacturing Co., Ltd.
- Shigeru TAGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180192518
- Publication date Jul 5, 2018
- Murata Manufacturing Co., Ltd.
- Yoshihito OTSUBO
- B32 - LAYERED PRODUCTS
Information Patent Application
DURABLE FLEXIBLE CIRCUIT BOARD FOR TRANSPARENT DISPLAY BOARD AND AS...
- Publication number 20180146549
- Publication date May 24, 2018
- G-SMATT CO., LTD
- Sung Soo KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESMEAR PROCESSING METHOD AND MANUFACTURING METHOD FOR MULTILAYER P...
- Publication number 20180020551
- Publication date Jan 18, 2018
- Makoto FUJIMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERLESS ELECTRICAL PRESS-IN CONTACTING OF ELECTRICALL...
- Publication number 20170256902
- Publication date Sep 7, 2017
- ROBERT BOSCH GmbH
- Andreas Otto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...
- Publication number 20160324009
- Publication date Nov 3, 2016
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR MOUNTING THE PRINTED WIRING ASSEMBLY TO THE...
- Publication number 20160120035
- Publication date Apr 28, 2016
- Honeywell International Inc.
- Gregory C. Brown
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS
- Publication number 20160007485
- Publication date Jan 7, 2016
- ABB TECHNOLOGY AG
- Samuel HARTMANN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPO...
- Publication number 20150373854
- Publication date Dec 24, 2015
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRED CIRCUIT BOARD
- Publication number 20140353007
- Publication date Dec 4, 2014
- Nitto Denko Corporation
- Kouji ICHINOSE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...
- Publication number 20140345124
- Publication date Nov 27, 2014
- ROBERT BOSCH GmbH
- Patrik PATZNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods and Systems For Embedding Filaments in 3D Structures, Struc...
- Publication number 20140268604
- Publication date Sep 18, 2014
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
Methods and Systems For Connecting Inter-Layer Conductors and Compo...
- Publication number 20140268607
- Publication date Sep 18, 2014
- Board of Regents, The University of Texas System
- Ryan B. Wicker
- H01 - BASIC ELECTRIC ELEMENTS

Using ultrasound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of manufacturing textile with conductive yarns and integrate...

Ultrasonic welding systems, methods of using the same, and related...

Display apparatus having grooved terminals

Display panel and display device comprising same

Method for assembling components implementing a pre-treatment of th...

Ultrasonic welding systems, methods of using the same, and related...

Bonding apparatus and method of fabricating display device using th...

Substrate with buried component and manufacture method thereof

Ultrasonic tank and methods for uniform glass substrate etching

Display apparatus having grooved terminals

Display device and method of manufacturing the same

Light-emitting device and method for manufacturing same

Method of manufacturing anisotropic conductive film using vertical...

Method for manufacturing ceramic circuit board

Desmearing method and desmearing device

Ultrasonic vibration bonding apparatus

Display apparatus having grooved terminals

Decapsulation of electronic devices

Ultrasonic bonding jig, bonding structure, and bonding method

Electronic product and manufacturing method thereof

Contacting arrangement and method for forming the contacting arrang...

Methods for connecting inter-layer conductors and components in 3D...

Conductor-structure element having an internal layer substrate lami...

Methods and systems for embedding filaments in 3D structures, struc...

Substrate, electronic device and display device having the same

Resin board structure and method for fabricating the same

Resin substrate, component mounted resin substrate, and method of m...

Wiring board desmear treatment method

Endoscope, electronic unit and method for manufacturing electronic...

Method of lamination of dielectric circuit materials using ultrason...

Patents Applicationslast 30 patents

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED...

PRINTED CIRCUIT BOARD GROUNDING

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

METHOD OF MANUFACTURING TEXTILES WITH INTEGRATED ELECTRICAL PATHS A...

METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...

DISPLAY PANEL AND DISPLAY DEVICE COMPRISING SAME

DISPLAY APPARATUS HAVING GROOVED TERMINALS AND METHOD OF MANUFACTUR...

Decapsulation of Electronic Devices

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

Method for Bonding an Electrically Conductive Element to a Bonding...

CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...

Light-Emitting Device And Method For Manufacturing Same

MANUFACTURING METHOD OF GLASS SUBSTRATE AND GLASS SUBSTRATE

ANISOTROPIC CONDUCTIVE FILM INCLUDING POLYMER LAYER RESTRICTING MOV...

Conductor-Structure Element Having an Internal Layer Substrate Lami...

RESIN SUBSTRATE, COMPONENT MOUNTED RESIN SUBSTRATE, AND METHOD OF M...

RESIN BOARD STRUCTURE AND METHOD FOR FABRICATING THE SAME

DURABLE FLEXIBLE CIRCUIT BOARD FOR TRANSPARENT DISPLAY BOARD AND AS...

DESMEAR PROCESSING METHOD AND MANUFACTURING METHOD FOR MULTILAYER P...

METHOD FOR SOLDERLESS ELECTRICAL PRESS-IN CONTACTING OF ELECTRICALL...

METHODS FOR CONNECTING INTER-LAYER CONDUCTORS AND COMPONENTS IN 3D...

SYSTEMS AND METHODS FOR MOUNTING THE PRINTED WIRING ASSEMBLY TO THE...

SEMICONDUCTOR MODULE WITH ULTRASONICALLY WELDED TERMINALS

ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE ELECTRONIC COMPO...

WIRED CIRCUIT BOARD

METHOD FOR SOLDERLESS ELECTRICAL PRESS-FIT CONTACTING OF ELECTRICAL...

Methods and Systems For Embedding Filaments in 3D Structures, Struc...

Methods and Systems For Connecting Inter-Layer Conductors and Compo...