Using vacuum or low pressure

Industry

CPC
H05K2203/085

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/085Using vacuum or low pressure

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems for coating a substrate
- Patent number 12,004,303
- Issue date Jun 4, 2024
- Nordson Corporation
- Michel Van De Vijver
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Process for laminating graphene-coated printed circuit boards
- Patent number 12,004,308
- Issue date Jun 4, 2024
- Mellanox Technologies, Ltd.
- Boaz Atias
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Composite materials including filled hollow glass filaments
- Patent number 11,765,825
- Issue date Sep 19, 2023
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Oxygen and humidity control in storage device
- Patent number 11,723,152
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shen-Min Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and control device for laminating display panel as well as v...
- Patent number 11,604,372
- Issue date Mar 14, 2023
- HKC CORPORATION LIMITED
- Xin Chen
- G02 - OPTICS
Information Patent Grant
Reel-to-reel lamination methods and devices in FPC fabrication
- Patent number 11,516,921
- Issue date Nov 29, 2022
- MANAFLEX, LLC
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reel-to-reel laser ablation methods and devices in FPC fabrication
- Patent number 11,490,523
- Issue date Nov 1, 2022
- Robert Clinton Lane
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum wiper and stencil printer with vacuum wiper
- Patent number 11,440,313
- Issue date Sep 13, 2022
- Illinois Tool Works Inc.
- Ranjie Zhou
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of forming protective film on at least one electronic module
- Patent number 11,419,221
- Issue date Aug 16, 2022
- ELEADTK CO., LTD.
- Ching-Nan Chang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Roll-to-roll surface treatment device, and film deposition method a...
- Patent number 11,261,520
- Issue date Mar 1, 2022
- Sumitomo Metal Mining Co., Ltd.
- Hideharu Okami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Display device and method of fabricating the same
- Patent number 11,259,419
- Issue date Feb 22, 2022
- SAMSUNG DISPLAY CO., LTD.
- Seongsik Ahn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,980,119
- Issue date Apr 13, 2021
- Samsung Display Co., Ltd.
- Junwoo You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat curable resin composition, and circuit board with electronic c...
- Patent number 10,870,725
- Issue date Dec 22, 2020
- San-ei Kagaku Co., Ltd.
- Yasuhiro Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of circuit board
- Patent number 10,820,423
- Issue date Oct 27, 2020
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of processing solder bump by vacuum annealing
- Patent number 10,784,221
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a multi-layer circuit board using conductive past...
- Patent number 10,765,003
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lift tool assembly for stencil printer
- Patent number 10,723,117
- Issue date Jul 28, 2020
- Illinois Tool Works Inc.
- Daniel Mariano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic product and manufacturing method thereof
- Patent number 10,716,219
- Issue date Jul 14, 2020
- Lite-On Electronics (Guangzhou) Limited
- Yi-Feng Pu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive substrate and method for fabricating conductive substrate
- Patent number 10,649,592
- Issue date May 12, 2020
- Sumitomo Metal Mining Co., Ltd.
- Junichi Nagata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Apparatus for assembling devices
- Patent number 10,593,644
- Issue date Mar 17, 2020
- Industrial Technology Research Institute
- Chin-Hung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method of fabricating the same
- Patent number 10,555,426
- Issue date Feb 4, 2020
- Samsung Display Co., Ltd.
- Seongsik Ahn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing conductor for touch panel, conductive film...
- Patent number 10,514,787
- Issue date Dec 24, 2019
- FUJIFILM Corporation
- Haruhiko Miyamoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display panel and method of manufacturing the same
- Patent number 10,359,871
- Issue date Jul 23, 2019
- LG Display Co., Ltd.
- Sunbae Kong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-layer circuit board using interposer layer and conductive paste
- Patent number 10,349,520
- Issue date Jul 9, 2019
- CATLAM, LLC
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of printing solder paste
- Patent number 10,322,462
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Sakie Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum-processing device and control method therefor, and vacuum so...
- Patent number 10,307,849
- Issue date Jun 4, 2019
- Senju Metal Industry Co., Ltd.
- Tomotake Kagaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Object stage and hot pressing apparatus
- Patent number 10,286,595
- Issue date May 14, 2019
- BOE Technology Group Co., Ltd.
- Lei Chen
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of providing compartment EMI shields on printed circuit boar...
- Patent number 10,264,666
- Issue date Apr 16, 2019
- Avago Technologies International Sales Pte. Limited
- Deog Soon Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering apparatus and vacuum-soldering method
- Patent number 10,252,364
- Issue date Apr 9, 2019
- Senju Metal Industry Co., Ltd.
- Tsutomu Hiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminating apparatus
- Patent number 10,239,299
- Issue date Mar 26, 2019
- Nikko Materials Co., Ltd.
- Kazutoshi Iwata
- B30 - PRESSES

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...
- Publication number 20240314942
- Publication date Sep 19, 2024
- Chia-Ming LI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
- Publication number 20240064895
- Publication date Feb 22, 2024
- DENKA COMPANY LIMITED
- Kenji MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE
- Publication number 20230380073
- Publication date Nov 23, 2023
- Teradyne, Inc.
- Eric Boiselle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20230337365
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS
- Publication number 20220377912
- Publication date Nov 24, 2022
- MELLANOX TECHNOLOGIES, LTD.
- Boaz ATIAS
- C01 - INORGANIC CHEMISTRY
Information Patent Application
REFLOW SOLDERING MACHINE FOR CONTINUOUSLY SOLDERING OF SOLDERING GOODS
- Publication number 20220295643
- Publication date Sep 15, 2022
- ERSA GMBH
- Thomas Huhler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM WIPER AND STENCIL PRINTER WITH VACUUM WIPER
- Publication number 20220088917
- Publication date Mar 24, 2022
- Illinois Tool Works Inc.
- Ranjie ZHOU
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE
- Publication number 20210235583
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shen-Min YANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR COATING A SUBSTRATE
- Publication number 20210195754
- Publication date Jun 24, 2021
- Nordson Corporation
- Michel VAN DE VIJVER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW COST, LOW LOSS MATERIAL FOR MICROWAVE OR ANTENNA PRINTED CIRCUI...
- Publication number 20210151869
- Publication date May 20, 2021
- Hughes Network Systems, LLC
- Bingqian LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200163216
- Publication date May 21, 2020
- SAMSUNG DISPLAY CO., LTD.
- Junwoo YOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONTROL DEVICE FOR LAMINATING DISPLAY PANEL AS WELL AS V...
- Publication number 20200159049
- Publication date May 21, 2020
- HKC Corporation Limited
- Xin Chen
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE
- Publication number 20190343004
- Publication date Nov 7, 2019
- ELEADTK CO., LTD.
- Ching-Nan Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for making a Multi-Layer Circuit Board using conductive Past...
- Publication number 20190320530
- Publication date Oct 17, 2019
- CATLAM, LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROLL-TO-ROLL SURFACE TREATMENT DEVICE, AND FILM DEPOSITION METHOD A...
- Publication number 20190226080
- Publication date Jul 25, 2019
- Sumitomo Metal Mining Co., Ltd.
- Hideharu Okami
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COMPOSITE MATERIALS INCLUDING FILLED HOLLOW GLASS FILAMENTS
- Publication number 20190141832
- Publication date May 9, 2019
- International Business Machines Corporation
- Matthew S. Doyle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COATED ELECTRICAL ASSEMBLY
- Publication number 20190037705
- Publication date Jan 31, 2019
- Semblant Limited
- Shailendra Vikram SINGH
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20190014669
- Publication date Jan 10, 2019
- SAMSUNG DISPLAY CO., LTD.
- Seongsik AHN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Circuit Board using Interposer layer and Conductive Paste
- Publication number 20190008044
- Publication date Jan 3, 2019
- SIERRA CIRCUITS, INC.
- Konstantine Karavakis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORGANIC SILICONE RESIN ALUMINUM BASE COPPER CLAD LAMINATE AND PREPA...
- Publication number 20180370189
- Publication date Dec 27, 2018
- SHENGYI TECHNOLOGY CO., LTD.
- Guofang TANG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FABRICATION METHOD OF CIRCUIT BOARD
- Publication number 20180376601
- Publication date Dec 27, 2018
- Gold Circuit Electronics Ltd.
- Chih-Hai Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR FABRICATING L...
- Publication number 20180181232
- Publication date Jun 28, 2018
- Sumitomo Metal Mining Co., Ltd.
- Junichi NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LAMINATING APPARATUS
- Publication number 20180162111
- Publication date Jun 14, 2018
- Nikko Materials Co., Ltd.
- Kazutoshi IWATA
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...
- Publication number 20180138113
- Publication date May 17, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTOR FOR TOUCH PANEL, CONDUCTIVE FILM...
- Publication number 20180067573
- Publication date Mar 8, 2018
- FUJIFILM CORPORATION
- Haruhiko MIYAMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME
- Publication number 20170362455
- Publication date Dec 21, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hidefumi Fujita
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR FORMING A 3D PATTERN STRUCTURE ON A 3D SUBSTRATE AND DEV...
- Publication number 20170192356
- Publication date Jul 6, 2017
- Ming-An HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING AN ELECTRICALLY CONDUCTING STRUCTURE ON A SYNTHE...
- Publication number 20160324010
- Publication date Nov 3, 2016
- Fraunhofer Gesellschaft zur Forderung der angewandten Forschung e.V.
- Matthias Fahland
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Soldering Apparatus and Vacuum-Soldering Method
- Publication number 20160256946
- Publication date Sep 8, 2016
- SENJU METAL INDUSTRY CO., LTD.
- Tsutomu Hiyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER THIN FILM, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...
- Publication number 20160205788
- Publication date Jul 14, 2016
- Samsung Electronics Co., Ltd.
- Jin Hyun CHO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Using vacuum or low pressure

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems for coating a substrate

Process for laminating graphene-coated printed circuit boards

Composite materials including filled hollow glass filaments

Oxygen and humidity control in storage device

Method and control device for laminating display panel as well as v...

Reel-to-reel lamination methods and devices in FPC fabrication

Reel-to-reel laser ablation methods and devices in FPC fabrication

Vacuum wiper and stencil printer with vacuum wiper

Method of forming protective film on at least one electronic module

Roll-to-roll surface treatment device, and film deposition method a...

Display device and method of fabricating the same

Display device and method of manufacturing the same

Heat curable resin composition, and circuit board with electronic c...

Fabrication method of circuit board

Method of processing solder bump by vacuum annealing

Method for making a multi-layer circuit board using conductive past...

Lift tool assembly for stencil printer

Electronic product and manufacturing method thereof

Conductive substrate and method for fabricating conductive substrate

Apparatus for assembling devices

Display device and method of fabricating the same

Method for manufacturing conductor for touch panel, conductive film...

Display panel and method of manufacturing the same

Multi-layer circuit board using interposer layer and conductive paste

Method of printing solder paste

Vacuum-processing device and control method therefor, and vacuum so...

Object stage and hot pressing apparatus

Method of providing compartment EMI shields on printed circuit boar...

Soldering apparatus and vacuum-soldering method

Laminating apparatus

Patents Applicationslast 30 patents

CIRCUIT BOARD LAYER BUILD-UP PROCESS WITH ENHANCED POSITIONING PREC...

CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR

FLATTENING A CIRCUIT BOARD ASSEMBLY USING VACUUM PRESSURE

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

PROCESS FOR LAMINATING GRAPHENE-COATED PRINTED CIRCUIT BOARDS

REFLOW SOLDERING MACHINE FOR CONTINUOUSLY SOLDERING OF SOLDERING GOODS

VACUUM WIPER AND STENCIL PRINTER WITH VACUUM WIPER

OXYGEN AND HUMIDITY CONTROL IN STORAGE DEVICE

SYSTEMS AND METHODS FOR COATING A SUBSTRATE

LOW COST, LOW LOSS MATERIAL FOR MICROWAVE OR ANTENNA PRINTED CIRCUI...

DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD AND CONTROL DEVICE FOR LAMINATING DISPLAY PANEL AS WELL AS V...

METHOD OF FORMING PROTECTIVE FILM ON AT LEAST ONE ELECTRONIC MODULE

Method for making a Multi-Layer Circuit Board using conductive Past...

ROLL-TO-ROLL SURFACE TREATMENT DEVICE, AND FILM DEPOSITION METHOD A...

COMPOSITE MATERIALS INCLUDING FILLED HOLLOW GLASS FILAMENTS

COATED ELECTRICAL ASSEMBLY

DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME

Multi-Layer Circuit Board using Interposer layer and Conductive Paste

ORGANIC SILICONE RESIN ALUMINUM BASE COPPER CLAD LAMINATE AND PREPA...

FABRICATION METHOD OF CIRCUIT BOARD

LAMINATED SUBSTRATE, CONDUCTIVE SUBSTRATE, METHOD FOR FABRICATING L...

LAMINATING APPARATUS

SEMICONDUCTOR SYSTEM AND DEVICE PACKAGE INCLUDING INTERCONNECT STRU...

METHOD FOR MANUFACTURING CONDUCTOR FOR TOUCH PANEL, CONDUCTIVE FILM...

CONDUCTIVE PASTE AND METHOD FOR PRODUCING CONDUCTIVE FILM USING SAME

METHOD FOR FORMING A 3D PATTERN STRUCTURE ON A 3D SUBSTRATE AND DEV...

METHOD FOR FORMING AN ELECTRICALLY CONDUCTING STRUCTURE ON A SYNTHE...

Soldering Apparatus and Vacuum-Soldering Method

MULTILAYER THIN FILM, METHOD OF MANUFACTURING THE SAME, AND ELECTRO...