using X-ray lasers

Industry

CPC
H01L21/2683

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/2683using X-ray lasers

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Processed wafer and method of manufacturing chip formation wafer
- Patent number 11,881,407
- Issue date Jan 23, 2024
- Denso Corporation
- Masatake Nagaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assessing semiconductor substrate and method of assessing...
- Patent number 10,586,699
- Issue date Mar 10, 2020
- Disco Corporation
- Youngsuk Kim
- G01 - MEASURING TESTING
Information Patent Grant
Production of an integrated circuit including electrical contact on...
- Patent number 10,347,490
- Issue date Jul 9, 2019
- Infineon Technologies Austria AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cutting method for cutting processing-target object and cutting app...
- Patent number 10,121,672
- Issue date Nov 6, 2018
- Disco Corporation
- Koichi Shigematsu
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Surface treatment apparatus and surface treatment method
- Patent number 9,780,390
- Issue date Oct 3, 2017
- Toyota Jidosha Kabushiki Kaisha
- Takashi Ikejiri
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Method of manufacturing stacked semiconductor package
- Patent number 9,673,185
- Issue date Jun 6, 2017
- Samsung Electronics Co., Ltd.
- Young-ho Joung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creation of defects using X-ray radiation and electric fi...
- Patent number 9,530,650
- Issue date Dec 27, 2016
- Romaldas Purlys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of an integrated circuit including electrical contact on...
- Patent number 8,895,422
- Issue date Nov 25, 2014
- Infineon Technologies Austria AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production of an integrated circuit including electrical contact on...
- Patent number 8,450,196
- Issue date May 28, 2013
- Infineon Technologies Austria AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer laser processing method and laser beam processing machine
- Patent number 7,611,968
- Issue date Nov 3, 2009
- Disco Corporation
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing GaN-based p-type compound semiconductors an...
- Patent number 6,479,313
- Issue date Nov 12, 2002
- Kopin Corporation
- Jinlin Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making reoxidized nitrided oxide MOSFETs
- Patent number 5,219,773
- Issue date Jun 15, 1993
- Massachusetts Institute of Technology
- Gregory J. Dunn
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER
- Publication number 20220130675
- Publication date Apr 28, 2022
- DENSO CORPORATION
- Masatake NAGAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING...
- Publication number 20190080905
- Publication date Mar 14, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUTTING METHOD FOR CUTTING PROCESSING-TARGET OBJECT AND CUTTING APP...
- Publication number 20170372908
- Publication date Dec 28, 2017
- Disco Corporation
- Koichi Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD OF CREATION OF DEFECTS USING X-RAY RADIATION AND ELECTRI...
- Publication number 20150262821
- Publication date Sep 17, 2015
- VILNIUS UNVERSITY
- Romaldas Purlys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON...
- Publication number 20130193449
- Publication date Aug 1, 2013
- Infineon Technologies Austria AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer laser processing method and laser beam processing machine
- Publication number 20080124898
- Publication date May 29, 2008
- DISCO CORPORATION
- Satoshi Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING TRANSISTORS HAVING HIGH CARRIER MOBILITY AND...
- Publication number 20080116487
- Publication date May 22, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Byeong-Chan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON...
- Publication number 20080099769
- Publication date May 1, 2008
- Infineon Technologies Austria AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING GAN-BASED P-TYPE COMPOUND SEMICONDUCTORS AN...
- Publication number 20020177251
- Publication date Nov 28, 2002
- Kopin Corporation
- Jinlin Ye
- H01 - BASIC ELECTRIC ELEMENTS

using X-ray lasers

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Processed wafer and method of manufacturing chip formation wafer

Method of assessing semiconductor substrate and method of assessing...

Production of an integrated circuit including electrical contact on...

Cutting method for cutting processing-target object and cutting app...

Surface treatment apparatus and surface treatment method

Method of manufacturing stacked semiconductor package

Method of creation of defects using X-ray radiation and electric fi...

Production of an integrated circuit including electrical contact on...

Production of an integrated circuit including electrical contact on...

Wafer laser processing method and laser beam processing machine

Method of manufacturing GaN-based p-type compound semiconductors an...

Method of making reoxidized nitrided oxide MOSFETs

Patents Applicationslast 30 patents

PROCESSED WAFER AND METHOD OF MANUFACTURING CHIP FORMATION WAFER

METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING...

CUTTING METHOD FOR CUTTING PROCESSING-TARGET OBJECT AND CUTTING APP...

NEW METHOD OF CREATION OF DEFECTS USING X-RAY RADIATION AND ELECTRI...

PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON...

Wafer laser processing method and laser beam processing machine

METHODS OF FABRICATING TRANSISTORS HAVING HIGH CARRIER MOBILITY AND...

PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON...

METHOD OF MANUFACTURING GAN-BASED P-TYPE COMPOUND SEMICONDUCTORS AN...