Vapour-condensation soldering

Industry

CPC
B23K1/015

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/015Vapour-condensation soldering

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder reflow apparatus
- Patent number 12,334,468
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 12,330,228
- Issue date Jun 17, 2025
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of formic acid soldering
- Patent number 12,280,453
- Issue date Apr 22, 2025
- 3S Silicon Tech, Inc.
- Kuo-Liang Yeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,237,297
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Junga Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder reflow apparatus and method of manufacturing an electronic d...
- Patent number 12,154,882
- Issue date Nov 26, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for soldering
- Patent number 12,090,577
- Issue date Sep 17, 2024
- SIEGFRIED HOFMANN GMBH
- Daniel Feseker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 11,850,672
- Issue date Dec 26, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of diffusion bonding utilizing vapor deposition
- Patent number 11,612,947
- Issue date Mar 28, 2023
- Rolls-Royce Corporation
- Joseph P. Henderkott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for formation of patterned solder mask
- Patent number 11,477,894
- Issue date Oct 18, 2022
- Picosun Oy
- Marko Pudas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using processing oven
- Patent number 11,465,225
- Issue date Oct 11, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of using a processing oven
- Patent number 11,456,274
- Issue date Sep 27, 2022
- YIELD ENGINEERING SYSTEMS, INC.
- M Ziaul Karim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor-phase type heating method and vapor-phase type heating apparatus
- Patent number 10,875,114
- Issue date Dec 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koichi Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor-phase type heating method and vapor-phase type heating apparatus
- Patent number 10,717,143
- Issue date Jul 21, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koichi Nagai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,733,134
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder assembly temperature monitoring process
- Patent number 9,714,870
- Issue date Jul 25, 2017
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Steam reflow apparatus and steam reflow method
- Patent number 9,682,438
- Issue date Jun 20, 2017
- SS TECHNO, INC.
- Kenshu Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow furnace
- Patent number 9,243,845
- Issue date Jan 26, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Sugihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for soldering in the vapor phase
- Patent number 7,748,600
- Issue date Jul 6, 2010
- IBl Löttechnik GmbH
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for vapour phase soldering
- Patent number 7,380,699
- Issue date Jun 3, 2008
- Vapour Phase Technology ApS
- Lars Dokkedahl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered product
- Patent number 6,562,147
- Issue date May 13, 2003
- Denso Corporation
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Condensation oven for heat treating a workpiece
- Patent number 6,530,778
- Issue date Mar 11, 2003
- Jean-Paul Garidel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor phase reflow system with superheated vapor
- Patent number 6,484,926
- Issue date Nov 26, 2002
- Rehm Anlagenbau GmbH + Co. KG
- Hans Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling heat transfer to a work piece during condens...
- Patent number 6,443,356
- Issue date Sep 3, 2002
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of heat treating a workpiece by a heat transfer liquid
- Patent number 6,248,282
- Issue date Jun 19, 2001
- Jean-Paul Garidel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixed-gap solder reflow method
- Patent number 6,247,639
- Issue date Jun 19, 2001
- Medallion Technology, LLC
- James A. Harden
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for cooling soldered objects
- Patent number 6,230,962
- Issue date May 15, 2001
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldered product
- Patent number 6,218,030
- Issue date Apr 17, 2001
- Nippondenso Co., Ltd.
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and device for the wave or vapor-phase soldering of electro...
- Patent number 6,116,497
- Issue date Sep 12, 2000
- Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
- Wolfgang Scheel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for improved temperature control in rapid ther...
- Patent number 5,841,110
- Issue date Nov 24, 1998
- Steag-Ast GmbH
- Zsolt Nenyei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Soldering method
- Patent number 5,669,548
- Issue date Sep 23, 1997
- Nippondenso Co., Ltd.
- Toshihiro Miyake
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250167166
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20250046750
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240293884
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Youngja Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS
- Publication number 20240113067
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20240066618
- Publication date Feb 29, 2024
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047410
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Youngja KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...
- Publication number 20240047411
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Junga LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS CHAMBER WITH UV IRRADIANCE
- Publication number 20230294190
- Publication date Sep 21, 2023
- Yield Engineering Systems, Inc.
- Tapani Laaksonen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE AND METHOD FOR CONTROLLED HEAT TRANSFER, IN PARTICULAR TO WO...
- Publication number 20230064858
- Publication date Mar 2, 2023
- Helmut Walter LEICHT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF USING PROCESSING OVEN
- Publication number 20230060603
- Publication date Mar 2, 2023
- Yield Engineering Systems, Inc.
- Lei Jing
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR SOLDERING
- Publication number 20220258265
- Publication date Aug 18, 2022
- Siegfried Hofmann GmbH
- Daniel FESEKER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF DIFFUSION BONDING UTILIZING VAPOR DEPOSITION
- Publication number 20210205911
- Publication date Jul 8, 2021
- Rolls-Royce Corporation
- Joseph P. Henderkott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW CONDENSATION SOLDERING MACHINE
- Publication number 20210046567
- Publication date Feb 18, 2021
- REHM THERMAL SYSTEMS GMBH
- Paul WILD
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MASK
- Publication number 20200288580
- Publication date Sep 10, 2020
- Picosun Oy
- Marko PUDAS
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYDROFLUOROEPOXIDE CONTAINING COMPOSITIONS AND METHODS FOR USING SAME
- Publication number 20200255714
- Publication date Aug 13, 2020
- 3M Innovative Properties Company
- Sean Michael Smith
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS
- Publication number 20190314917
- Publication date Oct 17, 2019
- KOICHI NAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS
- Publication number 20180345397
- Publication date Dec 6, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- KOICHI NAGAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STEAM REFLOW APPARATUS AND STEAM REFLOW METHOD
- Publication number 20160167148
- Publication date Jun 16, 2016
- KNE KABUSHIKI KAISHA
- Kenshu Oyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS
- Publication number 20140198424
- Publication date Jul 17, 2014
- International Business Machines Corporation
- Stephen Michael Hugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD
- Publication number 20130200136
- Publication date Aug 8, 2013
- Mitsubishi Electric Corporation
- Noriyuki Besshi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW FURNACE
- Publication number 20120240424
- Publication date Sep 27, 2012
- SENJU METAL INDUSTRY CO., LTD.
- Takashi Sugihara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING
- Publication number 20100308103
- Publication date Dec 9, 2010
- Tyco Electronics Corporation
- GEORGE JYH-SHANN CHOU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for Soldering in the Vapor Phase
- Publication number 20100170940
- Publication date Jul 8, 2010
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vapor-Operated Soldering System and Vapor Generation System for a S...
- Publication number 20090188967
- Publication date Jul 30, 2009
- Rehm Anlagenbau GmbH
- Hans Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MAKING PLATE TYPE HEAT PIPE
- Publication number 20070261243
- Publication date Nov 15, 2007
- Hsiu-Wei Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process and device for soldering in the vapor phase
- Publication number 20070194083
- Publication date Aug 23, 2007
- Helmut W. Leicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vapor-operated soldering system and vapor generation system for a s...
- Publication number 20050242163
- Publication date Nov 3, 2005
- Rehm Anlagenbau GmbH
- Hans Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for vapour phase soldering
- Publication number 20050173497
- Publication date Aug 11, 2005
- Vapour Phase Technology Aps
- Lars Dokkedahl
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Vapor phase reflow system with superheated vapor
- Publication number 20020007565
- Publication date Jan 24, 2002
- Hans Bell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of heat treating a workpiece by a heat transfer liquid
- Publication number 20010030386
- Publication date Oct 18, 2001
- Jean-Paul Garidel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Vapour-condensation soldering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder reflow apparatus

Method of using processing oven

Processing method of formic acid soldering

Solder reflow apparatus and method of manufacturing an electronic d...

Solder reflow apparatus and method of manufacturing an electronic d...

Device for soldering

Method of using processing oven

Method of diffusion bonding utilizing vapor deposition

Method for formation of patterned solder mask

Method of using processing oven

Method of using a processing oven

Vapor-phase type heating method and vapor-phase type heating apparatus

Vapor-phase type heating method and vapor-phase type heating apparatus

Solder assembly temperature monitoring process

Solder assembly temperature monitoring process

Steam reflow apparatus and steam reflow method

Reflow furnace

Process and device for soldering in the vapor phase

Method and apparatus for vapour phase soldering

Soldered product

Condensation oven for heat treating a workpiece

Vapor phase reflow system with superheated vapor

Method for controlling heat transfer to a work piece during condens...

Method of heat treating a workpiece by a heat transfer liquid

Fixed-gap solder reflow method

Process for cooling soldered objects

Soldered product

Process and device for the wave or vapor-phase soldering of electro...

Method and apparatus for improved temperature control in rapid ther...

Soldering method

Patents Applicationslast 30 patents

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

SOLDER REFLOW APPARATUS

METHOD OF USING PROCESSING OVEN

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING AN ELECTRONIC D...

PROCESS CHAMBER WITH UV IRRADIANCE

DEVICE AND METHOD FOR CONTROLLED HEAT TRANSFER, IN PARTICULAR TO WO...

METHOD OF USING PROCESSING OVEN

DEVICE FOR SOLDERING

METHOD OF DIFFUSION BONDING UTILIZING VAPOR DEPOSITION

REFLOW CONDENSATION SOLDERING MACHINE

SOLDER MASK

HYDROFLUOROEPOXIDE CONTAINING COMPOSITIONS AND METHODS FOR USING SAME

VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS

VAPOR-PHASE TYPE HEATING METHOD AND VAPOR-PHASE TYPE HEATING APPARATUS

STEAM REFLOW APPARATUS AND STEAM REFLOW METHOD

SOLDER ASSEMBLY TEMPERATURE MONITORING PROCESS

REFLOW SOLDERING DEVICE AND REFLOW SOLDERING METHOD

REFLOW FURNACE

SYSTEM AND METHOD FOR VAPOR PHASE REFLOW OF A CONDUCTIVE COATING

Device for Soldering in the Vapor Phase

Vapor-Operated Soldering System and Vapor Generation System for a S...

METHOD FOR MAKING PLATE TYPE HEAT PIPE

Process and device for soldering in the vapor phase

Vapor-operated soldering system and vapor generation system for a s...

Method and apparatus for vapour phase soldering

Vapor phase reflow system with superheated vapor

Method of heat treating a workpiece by a heat transfer liquid