Variation of parameters during sputtering

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CPC
C23C14/3492

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CCHEMISTRY METALLURGY C23Surface treatment C23CCOATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material

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C23C14/3492Variation of parameters during sputtering

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Patents Grantslast 30 patents

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Variation of parameters during sputtering

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Deposition method for tuning magnetic field distribution of deposit...

Deposition method and deposition apparatus

Sputtering system with a plurality of cathode assemblies

Method and device for homogeneously coating 3D substrates

Semiconductor device, method and machine of manufacture

Reactive thermal barrier coating

Methods and apparatus for processing a substrate

Method and a device for automatically determining adjustment values...

Electronic device and manufacturing method thereof

Sputtering method

Tantalum-doped molybdenum disulfide/tungsten disulfide multi-layer...

Deposition system with multi-cathode and method of manufacture thereof

Substrate temperature non-uniformity reduction over target life usi...

Sputtering system with a plurality of cathode assemblies

Semiconductor device, method and machine of manufacture

Deposition system with multi-cathode and method of manufacture thereof

Methods for reducing material overhang in a feature of a substrate

Decorative HIPIMS hard material layers

Methods and apparatus for substrate edge uniformity

Method of making coated article having antibacterial and/or antifun...

Device and method for producing defined properties of gradient laye...

Homogeneous HiPIMS coating method

Method of forming internal stress control film

Pulsed sputtering apparatus and pulsed sputtering method

Physical vapor deposition chamber particle reduction apparatus and...

High pressure RF-DC sputtering and methods to improve film uniformi...

Sliding bearing element

Semiconductor element and method of manufacturing the same

Substrate processing method

High performance coating for high-strength steel cold metal forming

Patents Applicationslast 30 patents

PLASMA BASED FILM MODIFICATION FOR SEMICONDUCTOR DEVICES

Air Gap Formation by Physical Vapor Deposition

PHYSICAL VAPOR DEPOSITION SYSTEM AND METHODS OF OPERATING THE SAME

Semiconductor Device, Method and Machine of Manufacture

DEPOSITION METHOD AND DEPOSITION APPARATUS

REACTIVE THERMAL BARRIER COATING

IN SITU AND TUNABLE DEPOSITION OF A FILM

Sputtering System with a Plurality of Cathode Assemblies

PULSED-DC POWER GENERATOR AND METHOD OF AUTOMATICALLY ADJUSTING ARC...

OVERHANG REDUCTION USING PULSED BIAS

APPROACHES TO MODIFYING A COLOR OF AN ELECTROCHROMIC STACK IN A TIN...

METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE

FLOW RATE ADJUSTMENT VALVE, PUMP UNIT, AND SURFACE TREATMENT DEVICE

TANTALUM-DOPED MOLYBDENUM DISULFIDE/TUNGSTEN DISULFIDE MULTI-LAYER...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRODE PHASING USING CONTROL PARAMETERS

Semiconductor Device, Method and Machine of Manufacture

SUBSTRATE TEMPERATURE NON-UNIFORMITY REDUCTION OVER TARGET LIFE USI...

Deposition System With Multi-Cathode And Method Of Manufacture Thereof

METHOD OF MAKING COATED ARTICLE HAVING ANTIBACTERIAL AND/OR ANTIFUN...

METHOD AND DEVICE FOR HOMOGENEOUSLY COATING 3D SUBSTRATES

SPUTTERING METHOD

A METHOD AND A DEVICE FOR AUTOMATICALLY DETERMINING ADJUSTMENT VALU...

HIGH PRESSURE RF-DC SPUTTERING AND METHODS TO IMPROVE FILM UNIFORMI...

MOLYBDENUM CONTAINING TARGETS

TRANSPARENT CONDUCTING FILM BASED ON ZINC OXIDE

METHODS AND APPARATUS FOR MAINTAINING LOW NON-UNIFORMITY OVER TARGE...

DEVICE AND METHOD FOR PRODUCING DEFINED PROPERTIES OF GRADIENT LAYE...

SPUTTERING APPARATUS AND METHOD OF OPERATING THE SAME

Pulsed Sputtering Apparatus and Pulsed Sputtering Method