Vertical bipolar transistor in combination with resistors or capacitors

Industry

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H01L27/0658

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/0658Vertical bipolar transistor in combination with resistors or capacitors

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,961,834
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,929,363
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Issue date Feb 6, 2024
- Murata Manufacturing Co., Ltd.
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- Issue date Nov 28, 2023
- Murata Manufacturing Co., Ltd.
- Yasunari Umemoto
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Information Patent Grant
Device for electrostatic discharge protection
- Patent number 11,749,672
- Issue date Sep 5, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Prantik Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
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- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with protective protrusion
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- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Kazuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated capacitors in an integrated circuit
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- Issue date May 2, 2023
- NXP USA, INC.
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Information Patent Grant
Power amplifier apparatus
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- Issue date Mar 28, 2023
- Murata Manufacturing Co., Ltd.
- Toshikazu Terashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 11,515,845
- Issue date Nov 29, 2022
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,322,462
- Issue date May 3, 2022
- Murata Manufacturing Co., Ltd.
- Takayuki Tsutsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multiple electrostatic discharge (ESD)...
- Patent number 11,282,831
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Lin Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,916,541
- Issue date Feb 9, 2021
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
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- Issue date Nov 10, 2020
- Rohm Co., Ltd.
- Akihiko Tsubaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct substrate to solder bump connection for thermal management i...
- Patent number 10,790,788
- Issue date Sep 29, 2020
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IGBT with improved terminal and manufacturing method thereof
- Patent number 10,741,651
- Issue date Aug 11, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jian Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,586,861
- Issue date Mar 10, 2020
- Nexperia B.V.
- Stefan Berglund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with current/voltage vibration suppression at...
- Patent number 10,522,668
- Issue date Dec 31, 2019
- Fuji Electric Co., Ltd.
- Shigeki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with insulated gate bipolar transistor (IGBT)...
- Patent number 10,468,512
- Issue date Nov 5, 2019
- Kabushiki Kaisha Toshiba
- Kenichi Matsushita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip amplifier for wireless device
- Patent number 10,447,210
- Issue date Oct 15, 2019
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vertical transport transistors with equal gate stack thicknesses
- Patent number 10,312,237
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power amplifier circuit
- Patent number 10,249,620
- Issue date Apr 2, 2019
- Murata Manufacturing Co., Ltd.
- Isao Obu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor apparatus
- Patent number 10,192,978
- Issue date Jan 29, 2019
- Mitsubishi Electric Corporation
- Satoshi Okuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump placement for thermal management in flip chip amplifiers
- Patent number 10,193,504
- Issue date Jan 29, 2019
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solder bump placement for grounding in flip chip amplifiers
- Patent number 10,181,824
- Issue date Jan 15, 2019
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solder bump placement for emitter-ballasting in flip chip amplifiers
- Patent number 10,177,716
- Issue date Jan 8, 2019
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Vertical transport transistors with equal gate stack thicknesses
- Patent number 10,157,923
- Issue date Dec 18, 2018
- International Business Machines Corporation
- Ruqiang Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices related to barrier for metallization of gallium based semic...
- Patent number 10,121,780
- Issue date Nov 6, 2018
- Skyworks Solutions, Inc.
- Cristian Cismaru
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Process-compensated HBT power amplifier bias circuits and methods
- Patent number 10,116,274
- Issue date Oct 30, 2018
- Skyworks Solutions, Inc.
- David Steven Ripley
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Compound semiconductor transistor integration with high density cap...
- Patent number 10,026,731
- Issue date Jul 17, 2018
- QUALCOMM Incorporated
- Bin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION
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VERTICALLY STACKED CASCODE BIPOLAR JUNCTION TRANSISTOR (BJT) PAIR S...
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- Publication date May 25, 2023
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DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20230155555
- Publication date May 18, 2023
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20230085420
- Publication date Mar 16, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Prantik MAHAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230027990
- Publication date Jan 26, 2023
- Mitsubishi Electric Corporation
- Koichi NISHI
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220165727
- Publication date May 26, 2022
- RENESAS ELECTRONICS CORPORATION
- Ryota KURODA
- H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
- Publication number 20220157808
- Publication date May 19, 2022
- Murata Manufacturing Co., Ltd.
- Shinnosuke TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFYING DEVICE
- Publication number 20210305949
- Publication date Sep 30, 2021
- Murata Manufacturing Co., Ltd.
- Shaojun MA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210134789
- Publication date May 6, 2021
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
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DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20210119584
- Publication date Apr 22, 2021
- Skyworks Solutions, Inc.
- Michael Joseph McPartlin
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UNIT CELL AND POWER AMPLIFIER MODULE
- Publication number 20210098585
- Publication date Apr 1, 2021
- Murata Manufacturing Co., Ltd.
- Yasunari UMEMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200006265
- Publication date Jan 2, 2020
- MURATA MANUFACTURING CO., LTD.
- Kazuya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Electronic Arrangement
- Publication number 20190386093
- Publication date Dec 19, 2019
- Frank Dieter Pfirsch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190304969
- Publication date Oct 3, 2019
- Rohm Co., Ltd.
- Akihiko TSUBAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190198464
- Publication date Jun 27, 2019
- MURATA MANUFACTURING CO., LTD.
- Takayuki TSUTSUI
- H01 - BASIC ELECTRIC ELEMENTS
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METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS
- Publication number 20190199294
- Publication date Jun 27, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
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- Publication number 20190189580
- Publication date Jun 20, 2019
- DUET MICROELECTRONICS INC.
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DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...
- Publication number 20190123045
- Publication date Apr 25, 2019
- SKYWORKS SOLUTIONS, INC.
- Cristian Cismaru
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FLIP CHIP AMPLIFIER FOR WIRELESS DEVICE
- Publication number 20190123693
- Publication date Apr 25, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
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Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20190088769
- Publication date Mar 21, 2019
- Kabushiki Kaisha Toshiba
- Kenichi MATSUSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...
- Publication number 20190028067
- Publication date Jan 24, 2019
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
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- Publication number 20180323294
- Publication date Nov 8, 2018
- MITSUBISHI ELECTRIC CORPORATION
- Satoshi OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IGBT WITH IMPROVED TERMINAL AND MANUFACTURING METHOD THEREOF
- Publication number 20180240880
- Publication date Aug 23, 2018
- Semiconductor Manufacturing International (Shanghai) Corporation
- JIAN LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP PLACEMENT FOR EMITTER-BALLASTING IN FLIP CHIP AMPLIFIERS
- Publication number 20170117270
- Publication date Apr 27, 2017
- SKYWORKS SOLUTIONS, INC.
- Michael Joseph McPartlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS-COMPENSATED HBT POWER AMPLIFIER BIAS CIRCUITS AND METHODS
- Publication number 20170019076
- Publication date Jan 19, 2017
- SKYWORKS SOLUTIONS, INC.
- David Steven Ripley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUDIO PROCESSING DEVICE
- Publication number 20160381477
- Publication date Dec 29, 2016
- Onkyo Corporation
- Kuniaki YAMAMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160372460
- Publication date Dec 22, 2016
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...
- Publication number 20160358907
- Publication date Dec 8, 2016
- SKYWORKS SOLUTIONS, INC.
- Cristian Cismaru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160308038
- Publication date Oct 20, 2016
- Fuji Electric Co., Ltd.
- Shigeki SATO
- H01 - BASIC ELECTRIC ELEMENTS

Vertical bipolar transistor in combination with resistors or capacitors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device having multiple electrostatic discharge (ESD)...

Semiconductor device having multiple electrostatic discharge (ESD)...

Power amplifying device

Unit cell and power amplifier module

Device for electrostatic discharge protection

Semiconductor device

Semiconductor device with protective protrusion

Integrated capacitors in an integrated circuit

Power amplifier apparatus

Direct substrate to solder bump connection for thermal management i...

Semiconductor device

Semiconductor device having multiple electrostatic discharge (ESD)...

Semiconductor device

Semiconductor device

Direct substrate to solder bump connection for thermal management i...

IGBT with improved terminal and manufacturing method thereof

Semiconductor device

Semiconductor device with current/voltage vibration suppression at...

Semiconductor device with insulated gate bipolar transistor (IGBT)...

Flip chip amplifier for wireless device

Vertical transport transistors with equal gate stack thicknesses

Semiconductor device and power amplifier circuit

Semiconductor apparatus

Solder bump placement for thermal management in flip chip amplifiers

Solder bump placement for grounding in flip chip amplifiers

Solder bump placement for emitter-ballasting in flip chip amplifiers

Vertical transport transistors with equal gate stack thicknesses

Devices related to barrier for metallization of gallium based semic...

Process-compensated HBT power amplifier bias circuits and methods

Compound semiconductor transistor integration with high density cap...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION

VERTICALLY STACKED CASCODE BIPOLAR JUNCTION TRANSISTOR (BJT) PAIR S...

SEMICONDUCTOR DEVICE

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

POWER AMPLIFYING DEVICE

SEMICONDUCTOR DEVICE

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

UNIT CELL AND POWER AMPLIFIER MODULE

SEMICONDUCTOR DEVICE

Power Electronic Arrangement

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS

THERMAL SHUNTS AND THERMAL MANAGEMENT IN MONOLITHIC MICROWAVE INTEG...

DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...

FLIP CHIP AMPLIFIER FOR WIRELESS DEVICE

SEMICONDUCTOR DEVICE

DIRECT SUBSTRATE TO SOLDER BUMP CONNECTION FOR THERMAL MANAGEMENT I...

SEMICONDUCTOR APPARATUS

IGBT WITH IMPROVED TERMINAL AND MANUFACTURING METHOD THEREOF

SOLDER BUMP PLACEMENT FOR EMITTER-BALLASTING IN FLIP CHIP AMPLIFIERS

PROCESS-COMPENSATED HBT POWER AMPLIFIER BIAS CIRCUITS AND METHODS

AUDIO PROCESSING DEVICE

SEMICONDUCTOR DEVICE

DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMIC...

SEMICONDUCTOR DEVICE