Wafer internal defects

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CPC
G01N21/9505

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GPHYSICS G01Measuring instruments G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES G01N21/00Investigating or analysing materials by the use of optical means

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G01N21/9505Wafer internal defects

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor failure analysis device
- Patent number 12,163,900
- Issue date Dec 10, 2024
- Hamamatsu Photonics K.K.
- Masataka Ikesu
- G01 - MEASURING TESTING
Information Patent Grant
Illumination and detection apparatus for a metrology apparatus
- Patent number 12,158,435
- Issue date Dec 3, 2024
- ASML Netherlands B.V.
- Nitesh Pandey
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Broadband wafer defect detection
- Patent number 12,158,434
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Nai-Han Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for determining characteristics of semiconducto...
- Patent number 12,158,492
- Issue date Dec 3, 2024
- FemtoMetrix, Inc.
- Ming Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for predicting reliability of semiconductor device
- Patent number 12,152,997
- Issue date Nov 26, 2024
- Renesas Electronics Corporation
- Takuo Funaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of evaluating quality of wafer or single cryst...
- Patent number 12,118,706
- Issue date Oct 15, 2024
- SK SILTRON CO., LTD.
- Hyun Woo Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for wafer bond monitoring
- Patent number 12,085,518
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus comprising a first imager imaging fluorescence...
- Patent number 12,072,289
- Issue date Aug 27, 2024
- Hamamatsu Photonics K.K.
- Tomonori Nakamura
- G01 - MEASURING TESTING
Information Patent Grant
Simultaneous multi-bandwidth optical inspection of semiconductor de...
- Patent number 12,068,207
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect inspection device and defect inspection method
- Patent number 12,044,627
- Issue date Jul 23, 2024
- HITACHI HIGH-TECH CORPORATION
- Masaya Yamamoto
- G02 - OPTICS
Information Patent Grant
Method for evaluating defect in monoclinic gallium oxide
- Patent number 12,038,388
- Issue date Jul 16, 2024
- The Industry & Academic Cooperation in Chungnam National University (IAC)
- Soon-Ku Hong
- C30 - CRYSTAL GROWTH
Information Patent Grant
Wafer inspection apparatus and method
- Patent number 12,038,389
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defect inspection method and defect inspection device
- Patent number 12,039,716
- Issue date Jul 16, 2024
- HITACHI HIGH-TECH CORPORATION
- Takashi Hiroi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic system and method of specimen qualification
- Patent number 12,019,032
- Issue date Jun 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Hung-Chih Chang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for producing semiconductor wafers
- Patent number 11,972,986
- Issue date Apr 30, 2024
- Siltronic AG
- Michael Boy
- C30 - CRYSTAL GROWTH
Information Patent Grant
SiC epitaxial wafer, production method therefor, and defect identif...
- Patent number 11,961,736
- Issue date Apr 16, 2024
- Resonac Corporation
- Ling Guo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Image view angle conversion/fault determination method and device,...
- Patent number 11,956,407
- Issue date Apr 9, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ruirui Zhao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
SiC wafer manufacturing method and SiC wafer manufacturing apparatus
- Patent number 11,945,049
- Issue date Apr 2, 2024
- Disco Corporation
- Ryohei Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer defect tracing method and apparatus, electronic device and co...
- Patent number 11,927,544
- Issue date Mar 12, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Yui-Lang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor edge and bevel inspection tool system
- Patent number 11,927,545
- Issue date Mar 12, 2024
- Camtek Ltd.
- Carmel Yehuda Drillman
- G01 - MEASURING TESTING
Information Patent Grant
Solid immersion lens unit and semiconductor inspection device
- Patent number 11,913,888
- Issue date Feb 27, 2024
- Hamamatsu Photonics K.K.
- Xiangguang Mao
- G01 - MEASURING TESTING
Information Patent Grant
Hot spot defect detecting method and hot spot defect detecting system
- Patent number 11,900,586
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus, method and computer program product for defect detection...
- Patent number 11,892,493
- Issue date Feb 6, 2024
- KLA Corporation
- Tom Marivoet
- G01 - MEASURING TESTING
Information Patent Grant
Integrated wafer bow measurements
- Patent number 11,885,750
- Issue date Jan 30, 2024
- Lam Research Corporation
- Rajan Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Broadband wafer defect detection
- Patent number 11,852,593
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Nai-Han Cheng
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for metrology with layer-specific illumination...
- Patent number 11,852,590
- Issue date Dec 26, 2023
- KLA Corporation
- Amnon Manassen
- G01 - MEASURING TESTING
Information Patent Grant
Image acquisition by an electron beam examination tool for metrolog...
- Patent number 11,828,714
- Issue date Nov 28, 2023
- Applied Materials Israel Ltd.
- Bobin Mathew Skaria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer inspection apparatus and system including the same
- Patent number 11,823,927
- Issue date Nov 21, 2023
- Samsung Electronics Co., Ltd.
- Kyunghun Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer backside defect detection method and wafer backside defect de...
- Patent number 11,821,847
- Issue date Nov 21, 2023
- United Microelectronics Corp.
- Cheng-Hsien Chen
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MEASURING DEPTH OF DAMAGED LAYER AND CONCENTRATION OF DE...
- Publication number 20240402094
- Publication date Dec 5, 2024
- EHWA DIAMOND INDUSTRIAL COMPANY LIMITED
- Seong Kwon CHOI
- G01 - MEASURING TESTING
Information Patent Application
MULTI-DEVICE AUTOMATED OPTICAL INSPECTION
- Publication number 20240394866
- Publication date Nov 28, 2024
- Nanotronics Imaging, Inc.
- Nadine Wong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR WAFER BOND MONITORING
- Publication number 20240385124
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...
- Publication number 20240363451
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD
- Publication number 20240361244
- Publication date Oct 31, 2024
- HAMAMATSU PHOTONICS K. K.
- Tomonori Nakamura
- G01 - MEASURING TESTING
Information Patent Application
Combined Spectroscopic Reflectometry And Pattern Recognition Based...
- Publication number 20240353321
- Publication date Oct 24, 2024
- KLA Corporation
- David Y. Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR INSPECTION APPARATUS, METHOD OF INSPECTING SEMICONDUC...
- Publication number 20240353351
- Publication date Oct 24, 2024
- Mitsubishi Electric Corporation
- Takuyo NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods And Systems For Nanoscale Imaging Based On Second Harmonic...
- Publication number 20240353352
- Publication date Oct 24, 2024
- KLA Corporation
- Qiang Zhao
- G01 - MEASURING TESTING
Information Patent Application
DEFECT DETECTION METHOD, APPARATUS AND DEVICE, AND COMPUTER-READABL...
- Publication number 20240319099
- Publication date Sep 26, 2024
- JI HUA LABORATORY
- Zhaoming HE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER INSPECTION APPARATUS AND METHOD
- Publication number 20240319109
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Pin Chou
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC SYSTEM OF SPECIMEN QUALIFICATION
- Publication number 20240295505
- Publication date Sep 5, 2024
- NANYA TECHNOLOGY CORPORATION
- Hung-Chih CHANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTUR...
- Publication number 20240241064
- Publication date Jul 18, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR OPTICAL INSPECTING THREE OR MORE SIDES OF...
- Publication number 20240230552
- Publication date Jul 11, 2024
- BESI Switzerland AG
- Ralf WEISE
- G01 - MEASURING TESTING
Information Patent Application
System and method for optical mapping of semiconductor wafers at cr...
- Publication number 20240201105
- Publication date Jun 20, 2024
- Epir, Inc.
- Issac L. Chang
- G01 - MEASURING TESTING
Information Patent Application
MEASUREMENT DEVICE
- Publication number 20240192139
- Publication date Jun 13, 2024
- Hamamatsu Photonics K.K.
- Kengo SUZUKI
- G01 - MEASURING TESTING
Information Patent Application
MEASURING DEVICE
- Publication number 20240183795
- Publication date Jun 6, 2024
- Hamamatsu Photonics K.K.
- Kenichiro IKEMURA
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS FOR INSPECTING SURFACE OF OBJECT
- Publication number 20240183796
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- YASUHIRO HIDAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETERMINING TYPES OF DEFECTS IN MONOCRYSTALLINE SILICON...
- Publication number 20240183797
- Publication date Jun 6, 2024
- ZING SEMICONDUCTOR CORPORATION
- Xing WEI
- G01 - MEASURING TESTING
Information Patent Application
WAFER DEFECT DETECTION DEVICE
- Publication number 20240175827
- Publication date May 30, 2024
- PlayNitride Display Co., Ltd.
- Yi-Chia Hwang
- G01 - MEASURING TESTING
Information Patent Application
WAFER DEFECT INSPECTION APPARATUS
- Publication number 20240175826
- Publication date May 30, 2024
- PlayNitride Display Co., Ltd.
- Yi-Chia Hwang
- G01 - MEASURING TESTING
Information Patent Application
SURFACE INSPECTION DEVICE AND SHAPE MEASUREMENT SOFTWARE
- Publication number 20240159520
- Publication date May 16, 2024
- Hitachi High-Tech Corporation
- Toshifumi HONDA
- G01 - MEASURING TESTING
Information Patent Application
HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM
- Publication number 20240144467
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Huei Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR EVALUATING CRYSTAL DEFECTS IN SILICON CARBIDE SINGLE CRY...
- Publication number 20240142390
- Publication date May 2, 2024
- Shin-Etsu Handotai Co., Ltd.
- Yutaka SHIGA
- C30 - CRYSTAL GROWTH
Information Patent Application
SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240145315
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- EUNHEE JEANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Defect Inspection System and Method
- Publication number 20240125713
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Yang
- G01 - MEASURING TESTING
Information Patent Application
Calibration Of Parametric Measurement Models Based On In-Line Wafer...
- Publication number 20240102941
- Publication date Mar 28, 2024
- KLA Corporation
- Brian C. Lin
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED WAFER BOW MEASUREMENTS
- Publication number 20240094144
- Publication date Mar 21, 2024
- LAM RESEARCH CORPORATION
- Rajan Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD OF WORKPIECE AND INSPECTION APPARATUS
- Publication number 20240094143
- Publication date Mar 21, 2024
- Disco Corporation
- Hayato IGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND SYSTEM FOR EVALUATING WORK-AFFECTED LAYER
- Publication number 20240068958
- Publication date Feb 29, 2024
- KWANSEI GAKUIN EDUCATIONAL FOUNDATION
- Tadaaki KANEKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D PROFILOMETRY WITH A LINNIK INTERFEROMETER
- Publication number 20240035810
- Publication date Feb 1, 2024
- Amnon Manassen
- G01 - MEASURING TESTING

Wafer internal defects

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor substrate processing apparatus and semiconductor subs...

Semiconductor failure analysis device

Illumination and detection apparatus for a metrology apparatus

Broadband wafer defect detection

Systems and methods for determining characteristics of semiconducto...

Method for predicting reliability of semiconductor device

Method and apparatus of evaluating quality of wafer or single cryst...

Systems and methods for wafer bond monitoring

Inspection apparatus comprising a first imager imaging fluorescence...

Simultaneous multi-bandwidth optical inspection of semiconductor de...

Defect inspection device and defect inspection method

Method for evaluating defect in monoclinic gallium oxide

Wafer inspection apparatus and method

Defect inspection method and defect inspection device

Electronic system and method of specimen qualification

Process for producing semiconductor wafers

SiC epitaxial wafer, production method therefor, and defect identif...

Image view angle conversion/fault determination method and device,...

SiC wafer manufacturing method and SiC wafer manufacturing apparatus

Wafer defect tracing method and apparatus, electronic device and co...

Semiconductor edge and bevel inspection tool system

Solid immersion lens unit and semiconductor inspection device

Hot spot defect detecting method and hot spot defect detecting system

Apparatus, method and computer program product for defect detection...

Integrated wafer bow measurements

Broadband wafer defect detection

Systems and methods for metrology with layer-specific illumination...

Image acquisition by an electron beam examination tool for metrolog...

Wafer inspection apparatus and system including the same

Wafer backside defect detection method and wafer backside defect de...

Patents Applicationslast 30 patents

METHOD FOR MEASURING DEPTH OF DAMAGED LAYER AND CONCENTRATION OF DE...

MULTI-DEVICE AUTOMATED OPTICAL INSPECTION

SYSTEMS AND METHODS FOR WAFER BOND MONITORING

SIMULTANEOUS MULTI-BANDWIDTH OPTICAL INSPECTION OF SEMICONDUCTOR DE...

INSPECTION APPARATUS AND INSPECTION METHOD

Combined Spectroscopic Reflectometry And Pattern Recognition Based...

SEMICONDUCTOR INSPECTION APPARATUS, METHOD OF INSPECTING SEMICONDUC...

Methods And Systems For Nanoscale Imaging Based On Second Harmonic...

DEFECT DETECTION METHOD, APPARATUS AND DEVICE, AND COMPUTER-READABL...

WAFER INSPECTION APPARATUS AND METHOD

ELECTRONIC SYSTEM OF SPECIMEN QUALIFICATION

METHOD FOR EVALUATING WORK-MODIFIED LAYER, AND METHOD OF MANUFACTUR...

APPARATUS AND METHOD FOR OPTICAL INSPECTING THREE OR MORE SIDES OF...

System and method for optical mapping of semiconductor wafers at cr...

MEASUREMENT DEVICE

MEASURING DEVICE

APPARATUS FOR INSPECTING SURFACE OF OBJECT

METHOD FOR DETERMINING TYPES OF DEFECTS IN MONOCRYSTALLINE SILICON...

WAFER DEFECT DETECTION DEVICE

WAFER DEFECT INSPECTION APPARATUS

SURFACE INSPECTION DEVICE AND SHAPE MEASUREMENT SOFTWARE

HOT SPOT DEFECT DETECTING METHOD AND HOT SPOT DEFECT DETECTING SYSTEM

METHOD FOR EVALUATING CRYSTAL DEFECTS IN SILICON CARBIDE SINGLE CRY...

SUBSTRATE INSPECTION SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCT...

Defect Inspection System and Method

Calibration Of Parametric Measurement Models Based On In-Line Wafer...

INTEGRATED WAFER BOW MEASUREMENTS

INSPECTION METHOD OF WORKPIECE AND INSPECTION APPARATUS

METHOD AND SYSTEM FOR EVALUATING WORK-AFFECTED LAYER

3D PROFILOMETRY WITH A LINNIK INTERFEROMETER